富聪科技订单满¥1000免运费
关注我们:

电源管理 - 专用

制造商 系列 封装/外壳 包装 产品状态 应用 电流 - 电源 工作温度 等级 认证 安装类型 供应商设备封装 电压 - 电源

全部重置
全部应用
结果
图片 厂商料号 库存情况 价格 数量 数据表 系列 封装/外壳 包装 产品状态 应用 电流 - 电源 工作温度 等级 认证 安装类型 供应商设备封装 电压 - 电源
MFS2623AMBA0AD

MFS2623AMBA0AD

SAFETY SYSTEM BASIS CHIP WITH LO

NXP USA Inc.

0 -
MFS2623AMBA0AD

数据表

- 48-LQFP Exposed Pad Tray Active - - -40°C ~ 125°C (TA) Automotive - Surface Mount 48-LQFP-EP (7x7) 3.2V ~ 40V
MFS2630AMDA0AD

MFS2630AMDA0AD

SAFETY SYSTEM BASIS CHIP WITH LO

NXP USA Inc.

0 -
MFS2630AMDA0AD

数据表

- 48-LQFP Exposed Pad Tray Active - 29µA -40°C ~ 125°C (TA) Automotive - Surface Mount 48-LQFP-EP (7x7) 3.2V ~ 40V
MC33FS6527CAER2

MC33FS6527CAER2

SYSTEM BASIS CHIP, DCDC 2.2A VCO

NXP USA Inc.

0 -
MC33FS6527CAER2

数据表

- 48-LQFP Exposed Pad Tape & Reel (TR) Active System Basis Chip - -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7) 1V ~ 5V
MC35FS4506CAER2

MC35FS4506CAER2

SYSTEM BASIS CHIP, LINEAR 0.5A V

NXP USA Inc.

0 -
MC35FS4506CAER2

数据表

- 48-LQFP Exposed Pad Tape & Reel (TR) Active System Basis Chip - -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7) 1V ~ 5V
MC34PF8100FJEPR2

MC34PF8100FJEPR2

POWER MANAGEMENT IC, I.MX8, PRE-

NXP USA Inc.

0 -
MC34PF8100FJEPR2

数据表

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active Processor 10µA -40°C ~ 105°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 56-HVQFN (8x8) 2.5V ~ 5.5V
LT8253AEUFDM#TRPBF

LT8253AEUFDM#TRPBF

40V USB TYPE-C PD 60W 4-SW BUCK-

Analog Devices Inc.

0 -
LT8253AEUFDM#TRPBF

数据表

- 28-WFQFN Exposed Pad Tape & Reel (TR) Active USB, Type-C Controller 2.1mA -40°C ~ 125°C (TJ) - - Surface Mount, Wettable Flank 28-QFN (4x5) 4V ~ 40V
MAX749EPA+

MAX749EPA+

IC SUPPLY LCD BIAS ADJ 8-DIP

Analog Devices Inc./Maxim Integrated

0 -
MAX749EPA+

数据表

- 8-DIP (0.300", 7.62mm) Tube Obsolete LCD Display 60µA -40°C ~ 85°C - - Through Hole 8-PDIP 2V ~ 6V
UCD9244ARGCR

UCD9244ARGCR

IC DGTL PWM SYSTEM CTRLR 64VQFN

Texas Instruments

0 -
UCD9244ARGCR

数据表

- 64-VFQFN Exposed Pad Tape & Reel (TR) Active PWM Controller 8mA -40°C ~ 85°C - - Surface Mount 64-VQFN (9x9) 3V ~ 3.6V
MC35FS6517NAER2

MC35FS6517NAER2

SYSTEM BASIS CHIP, DCDC 1.5A VCO

NXP USA Inc.

0 -
MC35FS6517NAER2

数据表

- 48-LQFP Exposed Pad Tape & Reel (TR) Active System Basis Chip - -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7) 1V ~ 5V
MC33FS6512LAER2

MC33FS6512LAER2

SYSTEM BASIS CHIP DCDC 1.5A VCO

NXP USA Inc.

0 -
MC33FS6512LAER2

数据表

- 48-LQFP Exposed Pad Tape & Reel (TR) Active System Basis Chip - -40°C ~ 125°C - - Surface Mount 48-HLQFP (7x7) 1V ~ 5V
MC33FS6513NAER2

MC33FS6513NAER2

SYSTEM BASIS CHIP DCDC 1.5A VCO

NXP USA Inc.

0 -
MC33FS6513NAER2

数据表

- 48-LQFP Exposed Pad Tape & Reel (TR) Active System Basis Chip - -40°C ~ 125°C - - Surface Mount 48-HLQFP (7x7) 1V ~ 5V
MC35FS4502NAER2

MC35FS4502NAER2

FS4500

NXP USA Inc.

0 -
MC35FS4502NAER2

数据表

- 48-LQFP Exposed Pad Tape & Reel (TR) Active System Basis Chip - -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7) 1V ~ 5V
MAX77643AANA+

MAX77643AANA+

ULTRA-LOW POWER PMIC FEATURING S

Analog Devices Inc./Maxim Integrated

5 -
MAX77643AANA+

数据表

- 25-XFBGA, WLBGA Strip Active General Purpose 28µA -40°C ~ 125°C (TA) - - Surface Mount 25-WLP (2.06x2.06) 2.7V ~ 5.5V
MC33FS8410G6ES

MC33FS8410G6ES

SYSTEM BASIS CHIP FS8410

NXP USA Inc.

0 -
MC33FS8410G6ES

数据表

* - Tray Active - - - - - - - -
MC33FS4507CAE

MC33FS4507CAE

SYSTEM BASIS CHIP, LINEAR 0.5A V

NXP USA Inc.

0 -
MC33FS4507CAE

数据表

- 48-LQFP Exposed Pad Tray Active System Basis Chip - -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7) 1V ~ 5V
MC33FS6517KAE

MC33FS6517KAE

SYSTEM BASIS CHIP, DCDC 1.5A VCO

NXP USA Inc.

0 -
MC33FS6517KAE

数据表

- 48-LQFP Exposed Pad Tray Active System Basis Chip - -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7) 1V ~ 5V
MB3771PF-GT-BND-TKERE1

MB3771PF-GT-BND-TKERE1

IC POWER SUPPLY MONITOR

Infineon Technologies

0 -
MB3771PF-GT-BND-TKERE1

数据表

- - Tape & Reel (TR) Obsolete - - - - - - - -
MC35FS4500CAE

MC35FS4500CAE

FS4500

NXP USA Inc.

0 -
MC35FS4500CAE

数据表

- 48-LQFP Exposed Pad Tray Active System Basis Chip - -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7) 1V ~ 5V
MC33FS6522CAER2

MC33FS6522CAER2

SYSTEM BASIS CHIP DCDC 2.2A VCO

NXP USA Inc.

0 -
MC33FS6522CAER2

数据表

- 48-LQFP Exposed Pad Tape & Reel (TR) Active System Basis Chip - -40°C ~ 125°C - - Surface Mount 48-HLQFP (7x7) 1V ~ 5V
MC33FS6522LAER2

MC33FS6522LAER2

SYSTEM BASIS CHIP DCDC 2.2A VCO

NXP USA Inc.

0 -
MC33FS6522LAER2

数据表

- 48-LQFP Exposed Pad Tape & Reel (TR) Active System Basis Chip - -40°C ~ 125°C - - Surface Mount 48-HLQFP (7x7) 1V ~ 5V
富聪科技

搜索

富聪科技

产品

富聪科技

电话

富聪科技

用户