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图片 厂商料号 库存情况 价格 数量 数据表 系列 封装/外壳 包装 产品状态 应用 电流 - 电源 工作温度 等级 认证 安装类型 供应商设备封装 电压 - 电源
MC33FS6518NAER2

MC33FS6518NAER2

SYSTEM BASIS CHIP, DCDC 1.5A VCO

NXP USA Inc.

0 -
MC33FS6518NAER2

数据表

- 48-LQFP Exposed Pad Tape & Reel (TR) Active System Basis Chip - -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7) 1V ~ 5V
MC33816AE

MC33816AE

IC SOLENOID CTRLR PROGRAMMABLE

NXP USA Inc.

0 -
MC33816AE

数据表

- 64-LQFP Exposed Pad Tray Active Solenoid Controller - -40°C ~ 125°C - - Surface Mount 64-LQFP (10x10) -
MC33FS6526NAE

MC33FS6526NAE

SYSTEM BASIS CHIP, DCDC 2.2A VCO

NXP USA Inc.

0 -
MC33FS6526NAE

数据表

- 48-LQFP Exposed Pad Tray Active System Basis Chip - -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7) 2.7V ~ 40V
MPF7100BMBA0ESR2

MPF7100BMBA0ESR2

POWER MANAGEMENT IC, I.MX 8, I.M

NXP USA Inc.

0 -
MPF7100BMBA0ESR2

数据表

- 48-VFQFN Exposed Pad Tape & Reel (TR) Active i.MX Processors 10µA -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 48-HVQFN (7x7) 2.5V ~ 5.5V
MC34PF8100CFEPR2

MC34PF8100CFEPR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

0 -
MC34PF8100CFEPR2

数据表

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8) 2.5V ~ 5.5V
MC34PF8100CCEPR2

MC34PF8100CCEPR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

0 -
MC34PF8100CCEPR2

数据表

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8) 2.5V ~ 5.5V
MC34PF8100A0EPR2

MC34PF8100A0EPR2

POWER MANAGEMENT IC I.MX8 NON-PR

NXP USA Inc.

0 -
MC34PF8100A0EPR2

数据表

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8) 2.5V ~ 5.5V
MC34PF8100F3EPR2

MC34PF8100F3EPR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

0 -
MC34PF8100F3EPR2

数据表

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8) 2.5V ~ 5.5V
MC34PF8100CHEPR2

MC34PF8100CHEPR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

0 -
MC34PF8100CHEPR2

数据表

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8) 2.5V ~ 5.5V
MC34PF8100EPEPR2

MC34PF8100EPEPR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

0 -
MC34PF8100EPEPR2

数据表

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8) 2.5V ~ 5.5V
MC34PF8100EREPR2

MC34PF8100EREPR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

0 -
MC34PF8100EREPR2

数据表

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8) 2.5V ~ 5.5V
MC34PF8100EQEPR2

MC34PF8100EQEPR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

0 -
MC34PF8100EQEPR2

数据表

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8) 2.5V ~ 5.5V
BQ501210RGCR

BQ501210RGCR

WIRELESS POWER MEDIUM POWER TRAN

Texas Instruments

0 -
BQ501210RGCR

数据表

- 64-VFQFN Exposed Pad Tape & Reel (TR) Not For New Designs Wireless Power Transmitter 52mA -40°C ~ 85°C - - Surface Mount 64-VQFN (9x9) 3V ~ 3.6V
MC35FS4505CAE

MC35FS4505CAE

SYSTEM BASIS CHIP, LINEAR 0.5A V

NXP USA Inc.

0 -
MC35FS4505CAE

数据表

- 48-LQFP Exposed Pad Tray Active System Basis Chip - -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7) 1V ~ 5V
MAX16948AGEE/V+T

MAX16948AGEE/V+T

AUTOMOTIVE DUAL REMOTE ANTENNA C

Analog Devices Inc./Maxim Integrated

0 -
MAX16948AGEE/V+T

数据表

- 16-LSSOP (0.154", 3.90mm Width) Exposed Pad Tape & Reel (TR) Active Systems, Remote Power 2.1mA -40°C ~ 105°C Automotive - Surface Mount 16-QSOP-EP 4.5V ~ 28V
MC35FS6501NAER2

MC35FS6501NAER2

FS6500

NXP USA Inc.

0 -
MC35FS6501NAER2

数据表

- 48-LQFP Exposed Pad Tape & Reel (TR) Active System Basis Chip - -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7) 1V ~ 5V
STWBC-EPTR

STWBC-EPTR

IND.& POWER CONV.

STMicroelectronics

0 -
STWBC-EPTR

数据表

- 32-VFQFN Exposed Pad Tape & Reel (TR) Obsolete Digital Power Controller - -40°C ~ 105°C - - Surface Mount 32-VFQFPN (5x5) 3V ~ 5.5V
MC33FS6506CAE

MC33FS6506CAE

SYSTEM BASIS CHIP, DCDC 0.8A VCO

NXP USA Inc.

0 -
MC33FS6506CAE

数据表

- 48-LQFP Exposed Pad Tray Active System Basis Chip - -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7) 1V ~ 5V
MC33FS4502CAE

MC33FS4502CAE

SYSTEM BASIS CHIP LINEAR 0.5A V

NXP USA Inc.

0 -
MC33FS4502CAE

数据表

- 48-LQFP Exposed Pad Tray Active System Basis Chip - -40°C ~ 125°C - - Surface Mount 48-HLQFP (7x7) 1V ~ 5V
MC33FS6522NAE

MC33FS6522NAE

SYSTEM BASIS CHIP DCDC 2.2A VCO

NXP USA Inc.

0 -
MC33FS6522NAE

数据表

- 48-LQFP Exposed Pad Tray Active System Basis Chip - -40°C ~ 125°C - - Surface Mount 48-HLQFP (7x7) 1V ~ 5V
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