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振荡器
| 图片 | 厂商料号 | 库存情况 | 价格 | 数量 | 数据表 | 系列 | 封装/外壳 | 包装 | 产品状态 | 基谐振器 | 类型 | 功能 | 输出 | 电压 - 电源 | 高度 - 安装后（最大值） | 频率稳定性 | 绝对拉力范围（APR） | 频率 | 工作温度 | 扩展频谱带宽 | 尺寸 / 尺寸 | 电流 - 电源（最大值） | 供应商设备封装 | 额定值 | 安装类型 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
DSC6111BI2B-033.3330MEMS OSC., ULTRA LOW POWER, LVCM Microchip Technology |
7,189 | - |
|
数据表 |
DSC61XXB | 4-VDFN | Tube | Active | MEMS | XO (Standard) | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | 0.035" (0.90mm) | ±25ppm | - | 33.333 MHz | -40°C ~ 85°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 3mA (Typ) | 4-VDFN (5x3.2) | - | Surface Mount |
|
|
DSC6111BI2B-025.0000MEMS OSC., ULTRA LOW POWER, LVCM Microchip Technology |
9,217 | - |
|
数据表 |
DSC61XXB | 4-VDFN | Tube | Active | MEMS | XO (Standard) | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | 0.035" (0.90mm) | ±25ppm | - | 25 MHz | -40°C ~ 85°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 3mA (Typ) | 4-VDFN (5x3.2) | - | Surface Mount |
|
|
DSC6111BI2B-050.0000MEMS OSC., ULTRA LOW POWER, LVCM Microchip Technology |
6,521 | - |
|
数据表 |
DSC61XXB | 4-VDFN | Tube | Active | MEMS | XO (Standard) | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | 0.035" (0.90mm) | ±25ppm | - | 50 MHz | -40°C ~ 85°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 3mA (Typ) | 4-VDFN (5x3.2) | - | Surface Mount |
|
|
DSC6111HI1B-033.3330TMEMS OSC., ULTRA LOW POWER, LVCM Microchip Technology |
2,955 | - |
|
数据表 |
DSC61XXB | 4-VFLGA | Tape & Reel (TR) | Active | MEMS | XO (Standard) | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | 0.035" (0.89mm) | ±50ppm | - | 33.333 MHz | -40°C ~ 85°C | - | 0.063" L x 0.047" W (1.60mm x 1.20mm) | 3mA (Typ) | 4-VFLGA (1.6x1.2) | - | Surface Mount |
|
|
DSC6111HI1B-019.2000TMEMS OSC., ULTRA LOW POWER, LVCM Microchip Technology |
9,209 | - |
|
数据表 |
DSC61XXB | 4-VFLGA | Tape & Reel (TR) | Active | MEMS | XO (Standard) | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | 0.035" (0.89mm) | ±50ppm | - | 19.2 MHz | -40°C ~ 85°C | - | 0.063" L x 0.047" W (1.60mm x 1.20mm) | 3mA (Typ) | 4-VFLGA (1.6x1.2) | - | Surface Mount |
|
|
DSC6111HI1B-016.0000TMEMS OSC., ULTRA LOW POWER, LVCM Microchip Technology |
3,184 | - |
|
数据表 |
DSC61XXB | 4-VFLGA | Tape & Reel (TR) | Active | MEMS | XO (Standard) | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | 0.035" (0.89mm) | ±50ppm | - | 16 MHz | -40°C ~ 85°C | - | 0.063" L x 0.047" W (1.60mm x 1.20mm) | 3mA (Typ) | 4-VFLGA (1.6x1.2) | - | Surface Mount |
|
|
DSC6111HI1B-012.2880TMEMS OSC., ULTRA LOW POWER, LVCM Microchip Technology |
2,293 | - |
|
数据表 |
DSC61XXB | 4-VFLGA | Tape & Reel (TR) | Active | MEMS | XO (Standard) | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | 0.035" (0.89mm) | ±50ppm | - | 12.288 MHz | -40°C ~ 85°C | - | 0.063" L x 0.047" W (1.60mm x 1.20mm) | 3mA (Typ) | 4-VFLGA (1.6x1.2) | - | Surface Mount |
|
|
DSC6111BI2B-024.0000TMEMS OSC., ULTRA LOW POWER, LVCM Microchip Technology |
7,914 | - |
|
数据表 |
DSC61XXB | 4-VDFN | Tape & Reel (TR) | Active | MEMS | XO (Standard) | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | 0.035" (0.90mm) | ±25ppm | - | 24 MHz | -40°C ~ 85°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 3mA (Typ) | 4-VDFN (5x3.2) | - | Surface Mount |
|
|
DSC6111BI2B-012.2880TMEMS OSC., ULTRA LOW POWER, LVCM Microchip Technology |
6,691 | - |
|
数据表 |
DSC61XXB | 4-VDFN | Tape & Reel (TR) | Active | MEMS | XO (Standard) | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | 0.035" (0.90mm) | ±25ppm | - | 12.288 MHz | -40°C ~ 85°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 3mA (Typ) | 4-VDFN (5x3.2) | - | Surface Mount |
|
|
DSC6111BI2B-006.0000TMEMS OSC., ULTRA LOW POWER, LVCM Microchip Technology |
7,715 | - |
|
数据表 |
DSC61XXB | 4-VDFN | Tape & Reel (TR) | Active | MEMS | XO (Standard) | Standby (Power Down) | CMOS | 1.8V ~ 3.3V | 0.035" (0.90mm) | ±25ppm | - | 6 MHz | -40°C ~ 85°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 3mA (Typ) | 4-VDFN (5x3.2) | - | Surface Mount |
