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振荡器

制造商 系列 封装/外壳 包装 产品状态 基谐振器 类型 功能 输出 电压 - 电源 高度 - 安装后(最大值) 频率稳定性 绝对拉力范围(APR) 频率 工作温度 扩展频谱带宽 尺寸 / 尺寸 电流 - 电源(最大值) 供应商设备封装 额定值 安装类型

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图片 厂商料号 库存情况 价格 数量 数据表 系列 封装/外壳 包装 产品状态 基谐振器 类型 功能 输出 电压 - 电源 高度 - 安装后(最大值) 频率稳定性 绝对拉力范围(APR) 频率 工作温度 扩展频谱带宽 尺寸 / 尺寸 电流 - 电源(最大值) 供应商设备封装 额定值 安装类型
DSC6111HI1B-048.0000

DSC6111HI1B-048.0000

MEMS OSC., ULTRA LOW POWER, LVCM

Microchip Technology

7,801 -
DSC6111HI1B-048.0000

数据表

DSC61XXB 4-VFLGA Bag Active MEMS XO (Standard) Standby (Power Down) CMOS 1.8V ~ 3.3V 0.035" (0.89mm) ±50ppm - 48 MHz -40°C ~ 85°C - 0.063" L x 0.047" W (1.60mm x 1.20mm) 3mA (Typ) 4-VFLGA (1.6x1.2) - Surface Mount
DSC6111HI1B-050.0000

DSC6111HI1B-050.0000

MEMS OSC., ULTRA LOW POWER, LVCM

Microchip Technology

4,083 -
DSC6111HI1B-050.0000

数据表

DSC61XXB 4-VFLGA Bag Active MEMS XO (Standard) Standby (Power Down) CMOS 1.8V ~ 3.3V 0.035" (0.89mm) ±50ppm - 50 MHz -40°C ~ 85°C - 0.063" L x 0.047" W (1.60mm x 1.20mm) 3mA (Typ) 4-VFLGA (1.6x1.2) - Surface Mount
DSC6111BI2B-048.0000

DSC6111BI2B-048.0000

MEMS OSC., ULTRA LOW POWER, LVCM

Microchip Technology

3,011 -
DSC6111BI2B-048.0000

数据表

DSC61XXB 4-VDFN Tube Active MEMS XO (Standard) Standby (Power Down) CMOS 1.8V ~ 3.3V 0.035" (0.90mm) ±25ppm - 48 MHz -40°C ~ 85°C - 0.197" L x 0.126" W (5.00mm x 3.20mm) 3mA (Typ) 4-VDFN (5x3.2) - Surface Mount
DSC6111HI1B-019.2000

DSC6111HI1B-019.2000

MEMS OSC., ULTRA LOW POWER, LVCM

Microchip Technology

8,808 -
DSC6111HI1B-019.2000

数据表

DSC61XXB 4-VFLGA Bag Active MEMS XO (Standard) Standby (Power Down) CMOS 1.8V ~ 3.3V 0.035" (0.89mm) ±50ppm - 19.2 MHz -40°C ~ 85°C - 0.063" L x 0.047" W (1.60mm x 1.20mm) 3mA (Typ) 4-VFLGA (1.6x1.2) - Surface Mount
DSC6111HI1B-001.8432

DSC6111HI1B-001.8432

MEMS OSC., ULTRA LOW POWER, LVCM

Microchip Technology

9,005 -
DSC6111HI1B-001.8432

数据表

DSC61XXB 4-VFLGA Bag Active MEMS XO (Standard) Standby (Power Down) CMOS 1.8V ~ 3.3V 0.035" (0.89mm) ±50ppm - 1.8432 MHz -40°C ~ 85°C - 0.063" L x 0.047" W (1.60mm x 1.20mm) 3mA (Typ) 4-VFLGA (1.6x1.2) - Surface Mount
DSC6111HI1B-020.0000

DSC6111HI1B-020.0000

MEMS OSC., ULTRA LOW POWER, LVCM

Microchip Technology

8,605 -
DSC6111HI1B-020.0000

数据表

DSC61XXB 4-VFLGA Bag Active MEMS XO (Standard) Standby (Power Down) CMOS 1.8V ~ 3.3V 0.035" (0.89mm) ±50ppm - 20 MHz -40°C ~ 85°C - 0.063" L x 0.047" W (1.60mm x 1.20mm) 3mA (Typ) 4-VFLGA (1.6x1.2) - Surface Mount
DSC6111HI1B-012.0000

DSC6111HI1B-012.0000

MEMS OSC., ULTRA LOW POWER, LVCM

Microchip Technology

6,009 -
DSC6111HI1B-012.0000

数据表

DSC61XXB 4-VFLGA Bag Active MEMS XO (Standard) Standby (Power Down) CMOS 1.8V ~ 3.3V 0.035" (0.89mm) ±50ppm - 12 MHz -40°C ~ 85°C - 0.063" L x 0.047" W (1.60mm x 1.20mm) 3mA (Typ) 4-VFLGA (1.6x1.2) - Surface Mount
DSC6111HI1B-024.5760

DSC6111HI1B-024.5760

MEMS OSC., ULTRA LOW POWER, LVCM

Microchip Technology

2,229 -
DSC6111HI1B-024.5760

数据表

DSC61XXB 4-VFLGA Bag Active MEMS XO (Standard) Standby (Power Down) CMOS 1.8V ~ 3.3V 0.035" (0.89mm) ±50ppm - 24.576 MHz -40°C ~ 85°C - 0.063" L x 0.047" W (1.60mm x 1.20mm) 3mA (Typ) 4-VFLGA (1.6x1.2) - Surface Mount
DSC6111HI1B-010.0000

DSC6111HI1B-010.0000

MEMS OSC., ULTRA LOW POWER, LVCM

Microchip Technology

7,119 -
DSC6111HI1B-010.0000

数据表

DSC61XXB 4-VFLGA Bag Active MEMS XO (Standard) Standby (Power Down) CMOS 1.8V ~ 3.3V 0.035" (0.89mm) ±50ppm - 10 MHz -40°C ~ 85°C - 0.063" L x 0.047" W (1.60mm x 1.20mm) 3mA (Typ) 4-VFLGA (1.6x1.2) - Surface Mount
DSC6111BI2B-006.0000

DSC6111BI2B-006.0000

MEMS OSC., ULTRA LOW POWER, LVCM

Microchip Technology

2,909 -
DSC6111BI2B-006.0000

数据表

DSC61XXB 4-VDFN Tube Active MEMS XO (Standard) Standby (Power Down) CMOS 1.8V ~ 3.3V 0.035" (0.90mm) ±25ppm - 6 MHz -40°C ~ 85°C - 0.197" L x 0.126" W (5.00mm x 3.20mm) 3mA (Typ) 4-VDFN (5x3.2) - Surface Mount
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