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振荡器

制造商 系列 封装/外壳 包装 产品状态 基谐振器 类型 功能 输出 电压 - 电源 高度 - 安装后(最大值) 频率稳定性 绝对拉力范围(APR) 频率 工作温度 扩展频谱带宽 尺寸 / 尺寸 电流 - 电源(最大值) 供应商设备封装 额定值 安装类型

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图片 厂商料号 库存情况 价格 数量 数据表 系列 封装/外壳 包装 产品状态 基谐振器 类型 功能 输出 电压 - 电源 高度 - 安装后(最大值) 频率稳定性 绝对拉力范围(APR) 频率 工作温度 扩展频谱带宽 尺寸 / 尺寸 电流 - 电源(最大值) 供应商设备封装 额定值 安装类型
DSC6001CI2B-032K768T

DSC6001CI2B-032K768T

MEMS OSC

Microchip Technology

8,714 -
DSC6001CI2B-032K768T

数据表

DSC60XX 4-VDFN Strip Active MEMS XO (Standard) Enable/Disable CMOS 1.71V ~ 3.63V 0.035" (0.90mm) ±25ppm - 32.768 kHz -40°C ~ 85°C - 0.126" L x 0.098" W (3.20mm x 2.50mm) 1.3mA (Typ) 4-VDFN (3.2x2.5) AEC-Q100 Surface Mount
DSC6111CI1B-024.5760T

DSC6111CI1B-024.5760T

MEMS OSC., ULTRA LOW POWER, LVCM

Microchip Technology

8,785 -
DSC6111CI1B-024.5760T

数据表

DSC61XXB 4-VDFN Strip Active MEMS XO (Standard) Standby (Power Down) CMOS 1.71V ~ 3.63V 0.035" (0.89mm) ±50ppm - 24.576 MHz -40°C ~ 85°C - 0.126" L x 0.098" W (3.20mm x 2.50mm) 3mA (Typ) 4-CDFN (3.2x2.5) - Surface Mount
DSC6101CI2B-048.0000T

DSC6101CI2B-048.0000T

MEMS OSC

Microchip Technology

7,787 -
DSC6101CI2B-048.0000T

数据表

DSC61XXB 4-VDFN Strip Active MEMS XO (Standard) Enable/Disable CMOS 1.71V ~ 3.63V 0.035" (0.89mm) ±25ppm - 48 MHz -40°C ~ 85°C - 0.126" L x 0.098" W (3.20mm x 2.50mm) 3mA (Typ) 4-VDFN (3.2x2.5) - Surface Mount
DSC6111CI1B-027.0000T

DSC6111CI1B-027.0000T

MEMS OSC., ULTRA LOW POWER, LVCM

Microchip Technology

2,578 -
DSC6111CI1B-027.0000T

数据表

DSC61XXB 4-VDFN Strip Active MEMS XO (Standard) Standby (Power Down) CMOS 1.71V ~ 3.63V 0.035" (0.89mm) ±50ppm - 27 MHz -40°C ~ 85°C - 0.126" L x 0.098" W (3.20mm x 2.50mm) 3mA (Typ) 4-CDFN (3.2x2.5) - Surface Mount
DSC6001CI2B-040.0000T

DSC6001CI2B-040.0000T

MEMS OSC

Microchip Technology

3,531 -
DSC6001CI2B-040.0000T

数据表

DSC60XX 4-VDFN Strip Active MEMS XO (Standard) Enable/Disable CMOS 1.71V ~ 3.63V 0.035" (0.90mm) ±25ppm - 40 MHz -40°C ~ 85°C - 0.126" L x 0.098" W (3.20mm x 2.50mm) 1.3mA (Typ) 4-VDFN (3.2x2.5) AEC-Q100 Surface Mount
DSC6001CI1B-010.0000T

DSC6001CI1B-010.0000T

MEMS OSC

Microchip Technology

7,920 -
DSC6001CI1B-010.0000T

数据表

DSC60XX 4-VDFN Strip Active MEMS XO (Standard) Enable/Disable CMOS 1.71V ~ 3.63V 0.035" (0.90mm) ±50ppm - 10 MHz -40°C ~ 85°C - 0.126" L x 0.098" W (3.20mm x 2.50mm) 1.3mA (Typ) 4-VDFN (3.2x2.5) AEC-Q100 Surface Mount
DSC6111CI1B-012.0000T

DSC6111CI1B-012.0000T

MEMS OSC., ULTRA LOW POWER, LVCM

Microchip Technology

3,010 -
DSC6111CI1B-012.0000T

数据表

DSC61XXB 4-VDFN Strip Active MEMS XO (Standard) Standby (Power Down) CMOS 1.71V ~ 3.63V 0.035" (0.89mm) ±50ppm - 12 MHz -40°C ~ 85°C - 0.126" L x 0.098" W (3.20mm x 2.50mm) 3mA (Typ) 4-CDFN (3.2x2.5) - Surface Mount
DSC6001CE2B-025.0000T

DSC6001CE2B-025.0000T

MEMS OSC

Microchip Technology

5,288 -
DSC6001CE2B-025.0000T

数据表

DSC60XX 4-VDFN Strip Active MEMS XO (Standard) Enable/Disable CMOS 1.71V ~ 3.63V 0.035" (0.90mm) ±25ppm - 25 MHz -20°C ~ 70°C - 0.126" L x 0.098" W (3.20mm x 2.50mm) 1.3mA (Typ) 4-VDFN (3.2x2.5) AEC-Q100 Surface Mount
DSC6111CI1B-033.3330T

DSC6111CI1B-033.3330T

MEMS OSC., ULTRA LOW POWER, LVCM

Microchip Technology

7,411 -
DSC6111CI1B-033.3330T

数据表

DSC61XXB 4-VDFN Strip Active MEMS XO (Standard) Standby (Power Down) CMOS 1.71V ~ 3.63V 0.035" (0.89mm) ±50ppm - 33.333 MHz -40°C ~ 85°C - 0.126" L x 0.098" W (3.20mm x 2.50mm) 3mA (Typ) 4-CDFN (3.2x2.5) - Surface Mount
DSC6111JE1B-033.3333

DSC6111JE1B-033.3333

MEMS OSC XO 33.3333MHZ CMOS SMD

Microchip Technology

3,190 -
DSC6111JE1B-033.3333

数据表

DSC61XXB 4-VLGA Strip Active MEMS XO (Standard) Standby (Power Down) CMOS 1.71V ~ 3.63V 0.035" (0.90mm) ±50ppm - 33.3333 MHz -20°C ~ 70°C - 0.098" L x 0.079" W (2.50mm x 2.00mm) 3mA (Typ) 4-VLGA (2.5x2) - Surface Mount
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