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I/O 扩展器

制造商 系列 封装/外壳 包装 产品状态 可编程 I/O 数量 中断输出 特性 输出类型 电流 - 输出源/汇 时钟频率 接口 电压 - 电源 工作温度 等级 供应商设备封装 认证 安装类型

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图片 厂商料号 库存情况 价格 数量 数据表 系列 封装/外壳 包装 产品状态 可编程 I/O 数量 中断输出 特性 输出类型 电流 - 输出源/汇 时钟频率 接口 电压 - 电源 工作温度 等级 供应商设备封装 认证 安装类型
MCP23017T-E/SS

MCP23017T-E/SS

IC XPNDR 1.7MHZ I2C 28SSOP

Microchip Technology

3,842 -
MCP23017T-E/SS

数据表

- 28-SSOP (0.209", 5.30mm Width) Tape & Reel (TR) Active Not Verified 16 Yes POR Push-Pull 25mA 1.7 MHz I2C 1.8V ~ 5.5V -40°C ~ 125°C - 28-SSOP - Surface Mount
MCP23S17T-E/SO

MCP23S17T-E/SO

IC XPNDR 10MHZ SPI 28SOIC

Microchip Technology

3,398 -
MCP23S17T-E/SO

数据表

- 28-SOIC (0.295", 7.50mm Width) Tape & Reel (TR) Active Not Verified 16 Yes POR Push-Pull 25mA 10 MHz SPI 1.8V ~ 5.5V -40°C ~ 125°C - 28-SOIC - Surface Mount
MCP23S17-E/ML

MCP23S17-E/ML

IC XPNDR 10MHZ SPI 28QFN

Microchip Technology

1,143 -
MCP23S17-E/ML

数据表

- 28-VQFN Exposed Pad Tube Active Not Verified 16 Yes POR Push-Pull 25mA 10 MHz SPI 1.8V ~ 5.5V -40°C ~ 125°C - 28-QFN (6x6) - Surface Mount
MCP23S09T-E/MG

MCP23S09T-E/MG

IC XPNDR 10MHZ SPI 16QFN

Microchip Technology

3,678 -
MCP23S09T-E/MG

数据表

- 16-VFQFN Exposed Pad Tape & Reel (TR) Active Not Verified 8 Yes - Open Drain 25mA 10 MHz SPI 1.8V ~ 5.5V -40°C ~ 125°C - 16-QFN (3x3) - Surface Mount
MCP23S17T-E/SS

MCP23S17T-E/SS

IC XPNDR 10MHZ SPI 28SSOP

Microchip Technology

13,799 -
MCP23S17T-E/SS

数据表

- 28-SSOP (0.209", 5.30mm Width) Tape & Reel (TR) Active Not Verified 16 Yes - Push-Pull 25mA 10 MHz SPI 1.8V ~ 5.5V -40°C ~ 125°C - 28-SSOP - Surface Mount
MCP23S17-E/SP

MCP23S17-E/SP

IC XPNDR 10MHZ SPI 28SDIP

Microchip Technology

12,344 -
MCP23S17-E/SP

数据表

- 28-DIP (0.300", 7.62mm) Tube Active Not Verified 16 Yes POR Push-Pull 25mA 10 MHz SPI 1.8V ~ 5.5V -40°C ~ 125°C - 28-SPDIP - Through Hole
MCP23017T-E/ML

MCP23017T-E/ML

IC XPNDR 1.7MHZ I2C 28QFN

Microchip Technology

5,014 -
MCP23017T-E/ML

数据表

- 28-VQFN Exposed Pad Tape & Reel (TR) Active Not Verified 16 Yes POR Push-Pull 25mA 1.7 MHz I2C 1.8V ~ 5.5V -40°C ~ 125°C - 28-QFN (6x6) - Surface Mount
MCP23017-E/ML

MCP23017-E/ML

IC XPNDR 1.7MHZ I2C 28QFN

Microchip Technology

3,792 -
MCP23017-E/ML

数据表

- 28-VQFN Exposed Pad Tube Active Not Verified 16 Yes POR Push-Pull 25mA 1.7 MHz I2C 1.8V ~ 5.5V -40°C ~ 125°C - 28-QFN (6x6) - Surface Mount
MCP23S17T-E/ML

MCP23S17T-E/ML

IC XPNDR 10MHZ SPI 28QFN

Microchip Technology

34,710 -
MCP23S17T-E/ML

数据表

- 28-VQFN Exposed Pad Tape & Reel (TR) Active Not Verified 16 Yes POR Push-Pull 25mA 10 MHz SPI 1.8V ~ 5.5V -40°C ~ 125°C - 28-QFN (6x6) - Surface Mount
MCP23018T-E/MJ

MCP23018T-E/MJ

IC XPNDR 3.4MHZ I2C 24QFN

Microchip Technology

6,076 -
MCP23018T-E/MJ

数据表

- 24-VFQFN Exposed Pad Tape & Reel (TR) Active Not Verified 16 Yes POR Open Drain 25mA 3.4 MHz I2C 1.8V ~ 5.5V -40°C ~ 125°C - 24-QFN (4x4) - Surface Mount
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