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I/O 扩展器

制造商 系列 封装/外壳 包装 产品状态 可编程 I/O 数量 中断输出 特性 输出类型 电流 - 输出源/汇 时钟频率 接口 电压 - 电源 工作温度 等级 供应商设备封装 认证 安装类型

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图片 厂商料号 库存情况 价格 数量 数据表 系列 封装/外壳 包装 产品状态 可编程 I/O 数量 中断输出 特性 输出类型 电流 - 输出源/汇 时钟频率 接口 电压 - 电源 工作温度 等级 供应商设备封装 认证 安装类型
MCP23008T-E/SO

MCP23008T-E/SO

IC XPNDR 1.7MHZ I2C 18SOIC

Microchip Technology

8,729 -
MCP23008T-E/SO

数据表

- 18-SOIC (0.295", 7.50mm Width) Tape & Reel (TR) Active Not Verified 8 Yes POR Push-Pull 25mA 1.7 MHz I2C 1.8V ~ 5.5V -40°C ~ 125°C - 18-SOIC - Surface Mount
MCP23008-E/SO

MCP23008-E/SO

IC XPNDR 1.7MHZ I2C 18SOIC

Microchip Technology

1,559 -
MCP23008-E/SO

数据表

- 18-SOIC (0.295", 7.50mm Width) Tube Active Not Verified 8 Yes POR Push-Pull 25mA 1.7 MHz I2C 1.8V ~ 5.5V -40°C ~ 125°C - 18-SOIC - Surface Mount
MCP23008T-E/SS

MCP23008T-E/SS

IC XPNDR 1.7MHZ I2C 20SSOP

Microchip Technology

15,006 -
MCP23008T-E/SS

数据表

- 20-SSOP (0.209", 5.30mm Width) Tape & Reel (TR) Active Not Verified 8 Yes POR Push-Pull 25mA 1.7 MHz I2C 1.8V ~ 5.5V -40°C ~ 125°C - 20-SSOP - Surface Mount
MCP23S17-E/SS

MCP23S17-E/SS

IC XPNDR 10MHZ SPI 28SSOP

Microchip Technology

11,800 -
MCP23S17-E/SS

数据表

- 28-SSOP (0.209", 5.30mm Width) Tube Active Not Verified 16 Yes POR Push-Pull 25mA 10 MHz SPI 1.8V ~ 5.5V -40°C ~ 125°C - 28-SSOP - Surface Mount
MCP23008T-E/ML

MCP23008T-E/ML

IC XPNDR 1.7MHZ I2C 20QFN

Microchip Technology

7,805 -
MCP23008T-E/ML

数据表

- 20-VFQFN Exposed Pad Tape & Reel (TR) Active Not Verified 8 Yes POR Push-Pull 25mA 1.7 MHz I2C 1.8V ~ 5.5V -40°C ~ 125°C - 20-QFN (4x4) - Surface Mount
MCP23008-E/ML

MCP23008-E/ML

IC XPNDR 1.7MHZ I2C 20QFN

Microchip Technology

6,544 -
MCP23008-E/ML

数据表

- 20-VFQFN Exposed Pad Tube Active Not Verified 8 Yes POR Push-Pull 25mA 1.7 MHz I2C 1.8V ~ 5.5V -40°C ~ 125°C - 20-QFN (4x4) - Surface Mount
MCP23008-E/SS

MCP23008-E/SS

IC XPNDR 1.7MHZ I2C 20SSOP

Microchip Technology

2,117 -
MCP23008-E/SS

数据表

- 20-SSOP (0.209", 5.30mm Width) Tube Active Not Verified 8 Yes POR Push-Pull 25mA 1.7 MHz I2C 1.8V ~ 5.5V -40°C ~ 125°C - 20-SSOP - Surface Mount
MCP23S08T-E/SO

MCP23S08T-E/SO

IC XPNDR 10MHZ SPI 18SOIC

Microchip Technology

18,664 -
MCP23S08T-E/SO

数据表

- 18-SOIC (0.295", 7.50mm Width) Tape & Reel (TR) Active Not Verified 8 Yes POR Push-Pull 25mA 10 MHz SPI 1.8V ~ 5.5V -40°C ~ 125°C - 18-SOIC - Surface Mount
MCP23S08-E/SO

MCP23S08-E/SO

IC XPNDR 10MHZ SPI 18SOIC

Microchip Technology

2,699 -
MCP23S08-E/SO

数据表

- 18-SOIC (0.295", 7.50mm Width) Tube Active Not Verified 8 Yes POR Push-Pull 25mA 10 MHz SPI 1.8V ~ 5.5V -40°C ~ 125°C - 18-SOIC - Surface Mount
MCP23008-E/P

MCP23008-E/P

IC XPNDR 1.7MHZ I2C 18DIP

Microchip Technology

219 -
MCP23008-E/P

数据表

- 18-DIP (0.300", 7.62mm) Tube Active Not Verified 8 Yes POR Push-Pull 25mA 1.7 MHz I2C 1.8V ~ 5.5V -40°C ~ 125°C - 18-PDIP - Through Hole
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