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系统级芯片(SoC)

制造商 系列 封装/外壳 包装 产品状态 架构 核心处理器 RAM 大小 外设 连接性 速度 主要属性 闪存大小 工作温度 等级 认证 供应商设备封装

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图片 厂商料号 库存情况 价格 数量 数据表 系列 封装/外壳 包装 产品状态 架构 核心处理器 RAM 大小 外设 连接性 速度 主要属性 闪存大小 工作温度 等级 认证 供应商设备封装
XCZU5EV-L2FBVB900E

XCZU5EV-L2FBVB900E

IC SOC CORTEX-A53 900FCBGA

AMD

0 -
XCZU5EV-L2FBVB900E

数据表

Zynq® UltraScale+™ MPSoC EV 900-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 533MHz, 600MHz, 1.3GHz Zynq®UltraScale+™ FPGA, 256K+ Logic Cells - 0°C ~ 100°C (TJ) - - 900-FCBGA (31x31)
XCZU7CG-L1FFVC1156I

XCZU7CG-L1FFVC1156I

IC SOC CORTEX-A53 1156FCBGA

AMD

0 -
XCZU7CG-L1FFVC1156I

数据表

Zynq® UltraScale+™ MPSoC CG 1156-BBGA, FCBGA Tray Active MCU, FPGA Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 500MHz, 1.2GHz Zynq®UltraScale+™ FPGA, 504K+ Logic Cells - -40°C ~ 100°C (TJ) - - 1156-FCBGA (35x35)
XCZU7CG-2FFVC1156E

XCZU7CG-2FFVC1156E

IC SOC CORTEX-A53 1156FCBGA

AMD

0 -
XCZU7CG-2FFVC1156E

数据表

Zynq® UltraScale+™ MPSoC CG 1156-BBGA, FCBGA Tray Active MCU, FPGA Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 533MHz, 1.3GHz Zynq®UltraScale+™ FPGA, 504K+ Logic Cells - 0°C ~ 100°C (TJ) - - 1156-FCBGA (35x35)
XCZU6EG-2FFVB1156E

XCZU6EG-2FFVB1156E

IC SOC CORTEX-A53 1156FCBGA

AMD

0 -
XCZU6EG-2FFVB1156E

数据表

Zynq® UltraScale+™ MPSoC EG 1156-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 533MHz, 600MHz, 1.3GHz Zynq®UltraScale+™ FPGA, 469K+ Logic Cells - 0°C ~ 100°C (TJ) - - 1156-FCBGA (35x35)
XCZU6EG-L1FFVB1156I

XCZU6EG-L1FFVB1156I

IC SOC CORTEX-A53 1156FCBGA

AMD

0 -
XCZU6EG-L1FFVB1156I

数据表

Zynq® UltraScale+™ MPSoC EG 1156-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 500MHz, 600MHz, 1.2GHz Zynq®UltraScale+™ FPGA, 469K+ Logic Cells - -40°C ~ 100°C (TJ) - - 1156-FCBGA (35x35)
XCZU7EV-1FFVC1156I

XCZU7EV-1FFVC1156I

IC SOC CORTEX-A53 1156FCBGA

AMD

0 -
XCZU7EV-1FFVC1156I

数据表

Zynq® UltraScale+™ MPSoC EV 1156-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 500MHz, 600MHz, 1.2GHz Zynq®UltraScale+™ FPGA, 504K+ Logic Cells - -40°C ~ 100°C (TJ) - - 1156-FCBGA (35x35)
XCZU9CG-2FFVC900E

XCZU9CG-2FFVC900E

IC SOC CORTEX-A53 900FCBGA

AMD

0 -
XCZU9CG-2FFVC900E

数据表

Zynq® UltraScale+™ MPSoC CG 900-BBGA, FCBGA Tray Active MCU, FPGA Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 533MHz, 1.3GHz Zynq®UltraScale+™ FPGA, 599K+ Logic Cells - 0°C ~ 100°C (TJ) - - 900-FCBGA (31x31)
XCZU9CG-L1FFVC900I

XCZU9CG-L1FFVC900I

IC SOC CORTEX-A53 900FCBGA

AMD

0 -
XCZU9CG-L1FFVC900I

数据表

Zynq® UltraScale+™ MPSoC CG 900-BBGA, FCBGA Bulk Active MCU, FPGA Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 500MHz, 1.2GHz Zynq®UltraScale+™ FPGA, 599K+ Logic Cells - -40°C ~ 100°C (TJ) - - 900-FCBGA (31x31)
XCVM1302-2MSENBVB1024

XCVM1302-2MSENBVB1024

IC VERSALPRIME ACAP FPGA 1024BGA

AMD

0 -
XCVM1302-2MSENBVB1024

数据表

Versal™ Prime 1024-BFBGA Tray Active MPU, FPGA Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ - DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 600MHz, 1.4GHz Versal™ Prime FPGA, 70k Logic Cells - 0°C ~ 100°C (TJ) - - 1024-BGA (31x31)
XCVM1302-1MSINBVB1024

XCVM1302-1MSINBVB1024

IC VERSALPRIME ACAP FPGA 1024BGA

AMD

0 -
XCVM1302-1MSINBVB1024

数据表

Versal™ Prime 1024-BFBGA Tray Active MPU, FPGA Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ - DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 600MHz, 1.3GHz Versal™ Prime FPGA, 70k Logic Cells - -40°C ~ 100°C (TJ) - - 1024-BGA (31x31)
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