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系统级芯片(SoC)

制造商 系列 封装/外壳 包装 产品状态 架构 核心处理器 RAM 大小 外设 连接性 速度 主要属性 闪存大小 工作温度 等级 认证 供应商设备封装

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图片 厂商料号 库存情况 价格 数量 数据表 系列 封装/外壳 包装 产品状态 架构 核心处理器 RAM 大小 外设 连接性 速度 主要属性 闪存大小 工作温度 等级 认证 供应商设备封装
XCZU5CG-L2FBVB900E

XCZU5CG-L2FBVB900E

IC SOC CORTEX-A53 900FCBGA

AMD

0 -
XCZU5CG-L2FBVB900E

数据表

Zynq® UltraScale+™ MPSoC CG 900-BBGA, FCBGA Tray Active MCU, FPGA Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 533MHz, 1.3GHz Zynq®UltraScale+™ FPGA, 256K+ Logic Cells - 0°C ~ 100°C (TJ) - - 900-FCBGA (31x31)
XCZU6CG-1FFVB1156I

XCZU6CG-1FFVB1156I

IC SOC CORTEX-A53 1156FCBGA

AMD

0 -
XCZU6CG-1FFVB1156I

数据表

Zynq® UltraScale+™ MPSoC CG 1156-BBGA, FCBGA Bulk Active MCU, FPGA Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 500MHz, 1.2GHz Zynq®UltraScale+™ FPGA, 469K+ Logic Cells - -40°C ~ 100°C (TJ) - - 1156-FCBGA (35x35)
XCZU7EV-1FFVF1517E

XCZU7EV-1FFVF1517E

IC SOC CORTEX-A53 1517FCBGA

AMD

0 -
XCZU7EV-1FFVF1517E

数据表

Zynq® UltraScale+™ MPSoC EV 1517-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 500MHz, 600MHz, 1.2GHz Zynq®UltraScale+™ FPGA, 504K+ Logic Cells - 0°C ~ 100°C (TJ) - - 1517-FCBGA (40x40)
XCVM1302-1MSENSVF1369

XCVM1302-1MSENSVF1369

IC VERSALPRIME ACAP FPGA 1369BGA

AMD

0 -
XCVM1302-1MSENSVF1369

数据表

Versal™ Prime 1369-BFBGA Tray Active MPU, FPGA Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ - DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 600MHz, 1.3GHz Versal™ Prime FPGA, 70k Logic Cells - 0°C ~ 100°C (TJ) - - 1369-BGA (35x35)
XC7Z045-3FFG900E

XC7Z045-3FFG900E

IC SOC CORTEX-A9 1GHZ 900FCBGA

AMD

0 -
XC7Z045-3FFG900E

数据表

Zynq®-7000 900-BBGA, FCBGA Tray Active MCU, FPGA Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ 256KB DMA CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1GHz Kintex™-7 FPGA, 350K Logic Cells - 0°C ~ 100°C (TJ) - - 900-FCBGA (31x31)
XC7Z045-L2FFG900I

XC7Z045-L2FFG900I

IC SOC CORTEX-A9 800MHZ 900FCBGA

AMD

0 -
XC7Z045-L2FFG900I

数据表

Zynq®-7000 900-BBGA, FCBGA Tray Active MCU, FPGA Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ 256KB DMA CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 800MHz Kintex™-7 FPGA, 350K Logic Cells - -40°C ~ 100°C (TJ) - - 900-FCBGA (31x31)
XCVM1302-1MSEVFVC1596

XCVM1302-1MSEVFVC1596

IC VERSALPRIME ACAP FPGA 1596BGA

AMD

0 -
XCVM1302-1MSEVFVC1596

数据表

Versal™ Prime 1596-BFBGA Tray Active MPU, FPGA Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ - DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 600MHz, 1.3GHz Versal™ Prime FPGA, 70k Logic Cells - 0°C ~ 100°C (TJ) - - 1596-BGA (37.5x37.5)
XCZU7EG-1FBVB900I

XCZU7EG-1FBVB900I

IC SOC CORTEX-A53 900FCBGA

AMD

0 -
XCZU7EG-1FBVB900I

数据表

Zynq® UltraScale+™ MPSoC EG 900-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 500MHz, 600MHz, 1.2GHz Zynq®UltraScale+™ FPGA, 504K+ Logic Cells - -40°C ~ 100°C (TJ) - - 900-FCBGA (31x31)
XCZU5EV-2FBVB900E

XCZU5EV-2FBVB900E

IC SOC CORTEX-A53 900FCBGA

AMD

0 -
XCZU5EV-2FBVB900E

数据表

Zynq® UltraScale+™ MPSoC EV 900-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 533MHz, 600MHz, 1.3GHz Zynq®UltraScale+™ FPGA, 256K+ Logic Cells - 0°C ~ 100°C (TJ) - - 900-FCBGA (31x31)
XCZU5EV-L1FBVB900I

XCZU5EV-L1FBVB900I

IC SOC CORTEX-A53 900FCBGA

AMD

0 -
XCZU5EV-L1FBVB900I

数据表

Zynq® UltraScale+™ MPSoC EV 900-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 500MHz, 600MHz, 1.2GHz Zynq®UltraScale+™ FPGA, 256K+ Logic Cells - -40°C ~ 100°C (TJ) - - 900-FCBGA (31x31)
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