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系统级芯片(SoC)

制造商 系列 封装/外壳 包装 产品状态 架构 核心处理器 RAM 大小 外设 连接性 速度 主要属性 闪存大小 工作温度 等级 认证 供应商设备封装

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图片 厂商料号 库存情况 价格 数量 数据表 系列 封装/外壳 包装 产品状态 架构 核心处理器 RAM 大小 外设 连接性 速度 主要属性 闪存大小 工作温度 等级 认证 供应商设备封装
AGFA022R24C3E4X

AGFA022R24C3E4X

IC FPGA AGILEX-F 2340FBGA

Intel

0 -
AGFA022R24C3E4X

数据表

Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.2M Logic Elements - 0°C ~ 100°C (TJ) - - -
1SX280HH1F55E2LG

1SX280HH1F55E2LG

IC FPGA STRATIX 10 2912FBGA

Intel

0 -
1SX280HH1F55E2LG

数据表

Stratix® 10 SX 2912-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.5GHz FPGA - 2800K Logic Elements - 0°C ~ 100°C (TJ) - - 2912-FBGA, FC (55x55)
1SX280HH1F55E2LGS3

1SX280HH1F55E2LGS3

IC FPGA STRATIX 10 2912FBGA

Intel

0 -
1SX280HH1F55E2LGS3

数据表

Stratix® 10 SX 2912-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.5GHz FPGA - 2800K Logic Elements - 0°C ~ 100°C (TJ) - - 2912-FBGA, FC (55x55)
AGFB022R24C3E4X

AGFB022R24C3E4X

IC FPGA AGILEX-F 2340FBGA

Intel

0 -
AGFB022R24C3E4X

数据表

Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.2M Logic Elements - 0°C ~ 100°C (TJ) - - -
AGFC023R25A2E4X

AGFC023R25A2E4X

IC FPGA AGILEX-F 2581FBGA

Intel

0 -
AGFC023R25A2E4X

数据表

Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.3M Logic Elements - 0°C ~ 100°C (TJ) - - -
1SX280HN1F43E2LG

1SX280HN1F43E2LG

IC FPGA STRATIX 10 1760FBGA

Intel

0 -
1SX280HN1F43E2LG

数据表

Stratix® 10 SX 1760-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.5GHz FPGA - 2800K Logic Elements - 0°C ~ 100°C (TJ) - - 1760-FBGA (42.5x42.5)
1SX280HN1F43E2LGS3

1SX280HN1F43E2LGS3

IC FPGA STRATIX 10 1760FBGA

Intel

0 -
1SX280HN1F43E2LGS3

数据表

Stratix® 10 SX 1760-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.5GHz FPGA - 2800K Logic Elements - 0°C ~ 100°C (TJ) - - 1760-FBGA (42.5x42.5)
AGFD023R25A2E4X

AGFD023R25A2E4X

IC FPGA AGILEX-F 2581FBGA

Intel

0 -
AGFD023R25A2E4X

数据表

Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.3M Logic Elements - 0°C ~ 100°C (TJ) - - -
AGFA023R31C2I3V

AGFA023R31C2I3V

IC FPGA AGILEX-F 3184FBGA

Intel

0 -
AGFA023R31C2I3V

数据表

Agilex F 3184-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.3M Logic Elements - -40°C ~ 100°C (TJ) - - 3184-BGA (56x45)
AGFB023R31C2I3V

AGFB023R31C2I3V

IC FPGA AGILEX-F 3184FBGA

Intel

0 -
AGFB023R31C2I3V

数据表

Agilex F 3184-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.3M Logic Elements - -40°C ~ 100°C (TJ) - - 3184-BGA (56x45)
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