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系统级芯片(SoC)

制造商 系列 封装/外壳 包装 产品状态 架构 核心处理器 RAM 大小 外设 连接性 速度 主要属性 闪存大小 工作温度 等级 认证 供应商设备封装

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图片 厂商料号 库存情况 价格 数量 数据表 系列 封装/外壳 包装 产品状态 架构 核心处理器 RAM 大小 外设 连接性 速度 主要属性 闪存大小 工作温度 等级 认证 供应商设备封装
AGFA022R25A1E1V

AGFA022R25A1E1V

IC FPGA AGILEX-F 2581FBGA

Intel

0 -
AGFA022R25A1E1V

数据表

Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.2M Logic Elements - 0°C ~ 100°C (TJ) - - -
1SX280LH2F55E2VG

1SX280LH2F55E2VG

IC SOC CORTEX-A53 1.5GHZ 2912BGA

Intel

0 -
1SX280LH2F55E2VG

数据表

Stratix® 10 SX 2912-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.5GHz FPGA - 2800K Logic Elements - 0°C ~ 100°C (TJ) - - 2912-FBGA, FC (55x55)
1SX280LH3F55I2VG

1SX280LH3F55I2VG

IC SOC CORTEX-A53 1.5GHZ 2912BGA

Intel

0 -
1SX280LH3F55I2VG

数据表

Stratix® 10 SX 2912-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.5GHz FPGA - 2800K Logic Elements - -40°C ~ 100°C (TJ) - - 2912-FBGA, FC (55x55)
AGFB022R25A1E1V

AGFB022R25A1E1V

IC FPGA AGILEX-F 2581FBGA

Intel

0 -
AGFB022R25A1E1V

数据表

Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.2M Logic Elements - 0°C ~ 100°C (TJ) - - -
AGIB023R18A2E2VR0

AGIB023R18A2E2VR0

IC FPGA AGILEX-I 1805FBGA

Intel

0 -
AGIB023R18A2E2VR0

数据表

Agilex I 1805-BBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.3M Logic Elements - 0°C ~ 100°C (TJ) - - 1805-BGA (42.5x42.5)
AGIB023R18A2E2V

AGIB023R18A2E2V

IC FPGA AGILEX-I 1805FBGA

Intel

0 -
AGIB023R18A2E2V

数据表

Agilex I - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.3M Logic Elements - 0°C ~ 100°C (TJ) - - -
AGIB023R18A2E3E

AGIB023R18A2E3E

IC FPGA AGILEX-I 1805FBGA

Intel

0 -
AGIB023R18A2E3E

数据表

Agilex I - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.3M Logic Elements - 0°C ~ 100°C (TJ) - - -
AGIB023R18A2E2VB

AGIB023R18A2E2VB

IC FPGA AGILEX-I 1805BGA

Intel

0 -
AGIB023R18A2E2VB

数据表

Agilex I 1805-BBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.3M Logic Elements - 0°C ~ 100°C (TJ) - - 1805-BGA (42.5x42.5)
1SX250LU3F50I3XG

1SX250LU3F50I3XG

IC FPGA STRATIX 10 2397FBGA

Intel

0 -
1SX250LU3F50I3XG

数据表

Stratix® 10 SX 2397-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.5GHz FPGA - 2500K Logic Elements - -40°C ~ 100°C (TJ) - - 2397-FBGA, FC (50x50)
1SX250HU3F50I3XG

1SX250HU3F50I3XG

IC FPGA STRATIX 10 2397FBGA

Intel

0 -
1SX250HU3F50I3XG

数据表

Stratix® 10 SX 2397-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.5GHz FPGA - 2500K Logic Elements - -40°C ~ 100°C (TJ) - - 2397-FBGA, FC (50x50)
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