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微处理器

制造商 封装/外壳 系列 包装 产品状态 核心处理器 核心数量/总线宽度 协处理器/DSP RAM 控制器 图形加速 安装类型 显示和接口控制器 以太网 速度 SATA USB 安全特性 电压 - I/O 供应商设备封装 认证 工作温度 等级 附加接口

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图片 厂商料号 库存情况 价格 数量 数据表 封装/外壳 系列 包装 产品状态 核心处理器 核心数量/总线宽度 协处理器/DSP RAM 控制器 图形加速 安装类型 显示和接口控制器 以太网 速度 SATA USB 安全特性 电压 - I/O 供应商设备封装 认证 工作温度 等级 附加接口
R8A77860NBGV

R8A77860NBGV

IC MPU 533MHZ 593HFBGA

Renesas Electronics Corporation

0 -
R8A77860NBGV

数据表

593-BFBGA - Tray Obsolete SH-4A 2 Core, 32-Bit - DDR3, SDRAM No Surface Mount - IEEE 802.3u 533MHz - USB 2.0 - 1.25V, 1.5V, 3.3V 593-HFBGA (25x25) - -20°C ~ 85°C (TA) - I2C, SCIF, SD
R8A774E1HA01BN#U0

R8A774E1HA01BN#U0

IC MCU 32BIT ARM 1022FPBGA

Renesas Electronics Corporation

0 -
R8A774E1HA01BN#U0

数据表

- - Tray Active - - - - - - - - - - - - - - - - - -
R8A774A0HA01BG#U2

R8A774A0HA01BG#U2

IC MPU RZ 1.2GHZ/1.5GHZ 1022BGA

Renesas Electronics Corporation

0 -
R8A774A0HA01BG#U2

数据表

1022-BGA RZ/G2M Tray Discontinued at Digi-Key ARM® Cortex®-A53, ARM® Cortex®-A57 6 Core, 64-Bit - LPDDR4 No Surface Mount DU 10/100Mbps (1), 100/1000Mbps (1) 1.2GHz, 1.5GHz - USB (2) - 0.82V, 1.8V, 3.3V 1022-FPBGA (29x29) - -40°C ~ 85°C (TA) - CAN, I2C, SCI, SPI
R8A774C0HA01BG#U0

R8A774C0HA01BG#U0

IC MPU RZ/G2E 1.2GHZ 552FBGA

Renesas Electronics Corporation

0 -
R8A774C0HA01BG#U0

数据表

552-FBGA RZ/G2E Tray Discontinued at Digi-Key ARM® Cortex®-A53 2 Core, 64-Bit Multimedia; NEON™ MPE DDR3L No Surface Mount MIPI-CSI 10/100Mbps (1), 100/1000Mbps (1) 1.2GHz - USB 2.0 (1), USB 3.0 (1) - - 552-FBGA (21x21) - -40°C ~ 85°C (TA) - CAN, I2C, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI
R8A774E0HA01BN#U0

R8A774E0HA01BN#U0

IC MPU RZ 1.2GHZ/1.5GHZ 1022BGA

Renesas Electronics Corporation

0 -
R8A774E0HA01BN#U0

数据表

1022-BGA RZ/G2E Tray Discontinued at Digi-Key ARM® Cortex®-A53, ARM® Cortex®-A57 8 Core, 64-Bit - LPDDR4 No Surface Mount DU 10/100Mbps (1), 100/1000Mbps (1) 1.2GHz, 1.5GHz - USB (4) - 0.82V, 1.8V, 3.3V 1022-FPBGA - -40°C ~ 85°C (TA) - CAN, I2C, SCI, SPI
R7S721020VLFP#AA0

R7S721020VLFP#AA0

IC MPU RZ/A1L 400MHZ 176LFQFP

Renesas Electronics Corporation

0 -
R7S721020VLFP#AA0

数据表

176-LQFP RZ/A1L Bulk Obsolete ARM® Cortex®-A9 1 Core, 32-Bit Multimedia; NEON™ MPE SDRAM, SRAM Yes Surface Mount VDC 10/100Mbps 400MHz - USB 2.0 (2) - 1.2V, 3.3V 176-LFQFP (24x24) - -40°C ~ 85°C (TA) - CAN, I2C, IEBus, IrDA, LIN, MediaLB, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI
R7S721020VLFP#AA1

R7S721020VLFP#AA1

IC MPU RZ/A1L 400MHZ 176LFQFP

Renesas Electronics Corporation

0 -
R7S721020VLFP#AA1

数据表

176-LQFP RZ/A1L Bulk Active ARM® Cortex®-A9 1 Core, 32-Bit Multimedia; NEON™ MPE SDRAM, SRAM Yes Surface Mount VDC 10/100Mbps 400MHz - USB 2.0 (2) - 1.2V, 3.3V 176-LFQFP (24x24) - -40°C ~ 85°C (TA) - CAN, I2C, IEBus, IrDA, LIN, MediaLB, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI
R9A06G032PGBG#AC0

R9A06G032PGBG#AC0

R9A06G032PGBG#AC0

Renesas Electronics Corporation

0 -
R9A06G032PGBG#AC0

数据表

400-LFBGA RZ/N1D Bulk Obsolete ARM® Cortex®-A7 2 Core, 32-Bit ARM® Cortex®-M3 DDR2, DDR3 No Surface Mount LCD 10/100/1000Mbps 500MHz - USB 2.0 (2) Boot Security, Secure JTAG 1.5V, 1.8V, 2.5V, 3.3V 400-LFBGA (17x17) - -40°C ~ 110°C (TJ) - CANbus, eMMC/SD/SDIO, I2C, SPI, UART
R9J03G019GBG#AC1

R9J03G019GBG#AC1

R9J03G019GBG#AC1

Renesas Electronics Corporation

0 -
R9J03G019GBG#AC1

数据表

484-BGA - Bulk Obsolete - - - - - Surface Mount - - - - - - - 484-BGA (23x23) - - - -
UPD70F3543M1GKA2-GAK-AX

UPD70F3543M1GKA2-GAK-AX

UPD70F3543M1GKA2-GAK-AX

Renesas Electronics Corporation

0 -
UPD70F3543M1GKA2-GAK-AX

数据表

- - Bulk Obsolete - - - - - - - - - - - - - - - - - -
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