| 图片 | 厂商料号 | 库存情况 | 价格 | 数量 | 数据表 | 封装/外壳 | 系列 | 包装 | 产品状态 | 可编程 | 核心处理器 | 速度 | 连接性 | 外设 | 等级 | I/O 数量 | 程序存储器大小 | 核心大小 | 程序存储器类型 | EEPROM 大小 | 工作温度 | RAM 大小 | 认证 | 振荡器类型 | 电压 - 供应(Vcc/Vdd) | 数据转换器 | 安装类型 | 供应商设备封装 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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MC9S08DN60MLFIC MCU 8BIT 60KB FLASH 48LQFP NXP USA Inc. |
0 | - |
|
数据表 |
48-LQFP | S08 | Tray | Obsolete | Not Verified | S08 | 40MHz | I2C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | - | 39 | 60KB (60K x 8) | 8-Bit | FLASH | 2K x 8 | -40°C ~ 125°C (TA) | 2K x 8 | - | External | 2.7V ~ 5.5V | A/D 16x12b | Surface Mount | |
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S912ZVL96AVFMRS12Z CPU, 96K FLASH NXP USA Inc. |
0 | - |
|
数据表 |
32-VFQFN Exposed Pad | S12 MagniV | Tape & Reel (TR) | Active | - | S12Z | 32MHz | CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART | LVD, POR, PWM, WDT | - | 19 | 96KB (96K x 8) | 16-Bit | FLASH | 512 x 8 | -40°C ~ 105°C (TA) | 8K x 8 | - | External, Internal | 5.5V ~ 18V | A/D 6x10b | Surface Mount | |
|
LPC1112FDH28/102:5IC MCU 32BIT 16KB FLASH 28TSSOP NXP USA Inc. |
0 | - |
|
数据表 |
28-TSSOP (0.173", 4.40mm Width) | LPC1100L | Tape & Reel (TR) | Active | Not Verified | ARM® Cortex®-M0 | 50MHz | I2C, SPI, UART/USART | Brown-out Detect/Reset, POR, WDT | - | 22 | 16KB (16K x 8) | 32-Bit Single-Core | FLASH | - | -40°C ~ 85°C (TA) | 4K x 8 | - | Internal | 1.8V ~ 3.6V | A/D 6x10b | Surface Mount | |
|
MC9S08PA16AVLCIC MCU 8BIT 16KB FLASH 32LQFP NXP USA Inc. |
0 | - |
|
数据表 |
32-LQFP | S08 | Tray | Active | Not Verified | S08 | 20MHz | I2C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | - | 28 | 16KB (16K x 8) | 8-Bit | FLASH | 256 x 8 | -40°C ~ 105°C (TA) | 2K x 8 | - | Internal | 2.7V ~ 5.5V | A/D 12x12b | Surface Mount | |
|
MC9S08PT16VLDIC MCU 8BIT 16KB FLASH 44LQFP NXP USA Inc. |
0 | - |
|
数据表 |
44-LQFP | S08 | Bulk | Not For New Designs | Not Verified | S08 | 20MHz | I2C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | - | 37 | 16KB (16K x 8) | 8-Bit | FLASH | 256 x 8 | -40°C ~ 105°C (TA) | 2K x 8 | - | Internal | 2.7V ~ 5.5V | A/D 12x12b | Surface Mount | |
|
MC68HC908JB8JPEIC MCU 8BIT 8KB FLASH 20DIP NXP USA Inc. |
415 | - |
|
数据表 |
20-DIP (0.300", 7.62mm) | HC08 | Bulk | Obsolete | Not Verified | HC08 | 3MHz | USB | LVD, POR, PWM | - | 13 | 8KB (8K x 8) | 8-Bit | FLASH | - | 0°C ~ 70°C (TA) | 256 x 8 | - | Internal | 4V ~ 5.5V | - | Through Hole | |
|
MKE15Z256VLH7IC MCU 32BIT 256KB FLASH 64LQFP NXP USA Inc. |
747 | - |
|
数据表 |
64-LQFP | Kinetis KE1xZ | Tray | Active | Not Verified | ARM® Cortex®-M0+ | 72MHz | FlexIO, I2C, SPI, UART/USART | DMA, LVD, PWM, WDT | - | 58 | 256KB (256K x 8) | 32-Bit Single-Core | FLASH | 32K x 8 | -40°C ~ 105°C (TA) | 32K x 8 | - | External, Internal | 2.7V ~ 5.5V | A/D 27x12b SAR; D/A 1x8b | Surface Mount | |
|
MKV10Z16VFM7IC MCU 32BIT 16KB FLASH 32QFN NXP USA Inc. |
0 | - |
|
数据表 |
32-VFQFN Exposed Pad | Kinetis KV | Tray | Active | Not Verified | ARM® Cortex®-M0+ | 75MHz | I2C, SPI, UART/USART | DMA, WDT | - | 28 | 16KB (16K x 8) | 32-Bit Single-Core | FLASH | - | -40°C ~ 105°C (TA) | 8K x 8 | - | Internal | 1.71V ~ 3.6V | A/D 16x12b; D/A 1x12b | Surface Mount, Wettable Flank | |
|
S9S08SG8E2CTGRIC MCU 8BIT 8KB FLASH 16TSSOP NXP USA Inc. |
0 | - |
|
数据表 |
16-TSSOP (0.173", 4.40mm Width) | S08 | Tape & Reel (TR) | Active | Not Verified | S08 | 40MHz | I2C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | - | 12 | 8KB (8K x 8) | 8-Bit | FLASH | - | -40°C ~ 85°C (TA) | 512 x 8 | - | Internal | 2.7V ~ 5.5V | A/D 8x10b | Surface Mount | |
|
MC9S08SH8CSCIC MCU 8BIT 8KB FLASH 8SOIC NXP USA Inc. |
0 | - |
|
数据表 |
8-SOIC (0.154", 3.90mm Width) | S08 | Tube | Active | Not Verified | S08 | 40MHz | I2C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | - | 5 | 8KB (8K x 8) | 8-Bit | FLASH | - | -40°C ~ 85°C (TA) | 512 x 8 | - | Internal | 2.7V ~ 5.5V | A/D 4x10b | Surface Mount |