| 图片 | 厂商料号 | 库存情况 | 价格 | 数量 | 数据表 | 封装/外壳 | 系列 | 包装 | 产品状态 | 可编程 | 核心处理器 | 速度 | 连接性 | 外设 | 等级 | I/O 数量 | 程序存储器大小 | 核心大小 | 程序存储器类型 | EEPROM 大小 | 工作温度 | RAM 大小 | 认证 | 振荡器类型 | 电压 - 供应(Vcc/Vdd) | 数据转换器 | 安装类型 | 供应商设备封装 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
MC9S08SH32VTLIC MCU 8BIT 32KB FLASH 28TSSOP NXP USA Inc. |
0 | - |
|
数据表 |
28-TSSOP (0.173", 4.40mm Width) | S08 | Tube | Active | Not Verified | S08 | 40MHz | I2C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | - | 23 | 32KB (32K x 8) | 8-Bit | FLASH | - | -40°C ~ 105°C (TA) | 1K x 8 | - | Internal | 2.7V ~ 5.5V | A/D 16x10b | Surface Mount | |
|
S9S12GA64F0VLHIC MCU 16BIT 64KB FLASH 64LQFP NXP USA Inc. |
0 | - |
|
数据表 |
64-LQFP | HCS12 | Tray | Active | Not Verified | 12V1 | 25MHz | CANbus, IrDA, LINbus, SCI, SPI | LVD, POR, PWM, WDT | - | 54 | 64KB (64K x 8) | 16-Bit | FLASH | 2K x 8 | -40°C ~ 105°C (TA) | 4K x 8 | - | Internal | 3.13V ~ 5.5V | A/D 12x12b | Surface Mount | |
|
MKE14F512VLL16IC MCU 32BIT 512KB FLASH 100LQFP NXP USA Inc. |
374 | - |
|
数据表 |
100-LQFP | Kinetis KE1xF | Tray | Active | Not Verified | ARM® Cortex®-M4F | 168MHz | FlexIO, I2C, SPI, UART/USART | DMA, LVD, PWM, WDT | - | 89 | 512KB (512K x 8) | 32-Bit Single-Core | FLASH | 68K x 8 | -40°C ~ 105°C (TA) | 64K x 8 | - | Internal | 2.7V ~ 5.5V | A/D 16x12b; D/A 1x12b | Surface Mount | |
|
LPC1114LVFHN24/303IC MCU 32BIT 32KB FLASH 24HVQFN NXP USA Inc. |
0 | - |
|
数据表 |
24-VFQFN Exposed Pad | LPC1100LV | Bulk | Active | Not Verified | ARM® Cortex®-M0 | 50MHz | I2C, SPI, UART/USART | Brown-out Detect/Reset, POR, WDT | - | 20 | 32KB (32K x 8) | 32-Bit Single-Core | FLASH | - | -40°C ~ 85°C (TA) | 8K x 8 | - | Internal | 1.65V ~ 1.95V | A/D 8x8b | Surface Mount | |
|
MC68HC908QY1CDTIC MCU 8BIT 1.5KB FLASH 16TSSOP NXP USA Inc. |
0 | - |
|
数据表 |
16-TSSOP (0.173", 4.40mm Width) | HC08 | Tube | Obsolete | Not Verified | HC08 | 8MHz | - | LVD, POR, PWM | - | 13 | 1.5KB (1.5K x 8) | 8-Bit | FLASH | - | -40°C ~ 85°C (TA) | 128 x 8 | - | Internal | 2.7V ~ 5.5V | - | Surface Mount | |
|
LPC11E68JBD48KIC MCU 32BIT 256KB FLASH 48LQFP NXP USA Inc. |
1,244 | - |
|
数据表 |
48-LQFP | LPC11Exx | Tray | Active | Not Verified | ARM® Cortex®-M0+ | 50MHz | I2C, Microwire, SPI, SSI, SSP, UART/USART | Brown-out Detect/Reset, DMA, POR, PWM, WDT | - | 36 | 256KB (256K x 8) | 32-Bit Single-Core | FLASH | 4K x 8 | -40°C ~ 105°C (TA) | 36K x 8 | - | Internal | 2.4V ~ 3.6V | A/D 8x12b SAR | Surface Mount | |
|
LPC1317FHN33,551IC MCU 32BIT 64KB FLASH 32HVQFN NXP USA Inc. |
236 | - |
|
数据表 |
32-VQFN Exposed Pad | LPC13xx | Tray | Active | Not Verified | ARM® Cortex®-M3 | 72MHz | I2C, Microwire, SPI, SSI, SSP, UART/USART | Brown-out Detect/Reset, POR, WDT | - | 26 | 64KB (64K x 8) | 32-Bit Single-Core | FLASH | 4K x 8 | -40°C ~ 85°C (TA) | 10K x 8 | - | Internal | 2V ~ 3.6V | A/D 8x12b | Surface Mount | |
|
|
MCHC908QY4CDWEIC MCU 8BIT 4KB FLASH 16SOIC NXP USA Inc. |
1,855 | - |
|
数据表 |
16-SOIC (0.295", 7.50mm Width) | HC08 | Tube | Not For New Designs | Verified | HC08 | 8MHz | - | LVD, POR, PWM | - | 13 | 4KB (4K x 8) | 8-Bit | FLASH | - | -40°C ~ 85°C (TA) | 128 x 8 | - | Internal | 2.7V ~ 5.5V | A/D 4x8b | Surface Mount | |
|
LPC1518JBD64EIC MCU 32BIT 128KB FLASH 64LQFP NXP USA Inc. |
677 | - |
|
数据表 |
64-LQFP | LPC15xx | Tray | Active | Not Verified | ARM® Cortex®-M3 | 72MHz | CANbus, I2C, SPI, UART/USART | Brown-out Detect/Reset, DMA, POR, PWM, WDT | - | 46 | 128KB (128K x 8) | 32-Bit Single-Core | FLASH | 4K x 8 | -40°C ~ 105°C (TA) | 20K x 8 | - | Internal | 2.4V ~ 3.6V | A/D 24x12b | Surface Mount | |
|
FS32K116BRT0MLFTIC MCU 32BIT 128KB FLASH 48LQFP NXP USA Inc. |
0 | - |
|
数据表 |
48-LQFP | S32K | Tray | Active | Not Verified | ARM® Cortex®-M0+ | 48MHz | CANbus, FlexIO, I2C, LINbus, SPI, UART/USART | DMA, PWM, WDT | - | 43 | 128KB (128K x 8) | 32-Bit Single-Core | FLASH | 2K x 8 | -40°C ~ 125°C (TA) | 17K x 8 | - | Internal | 2.7V ~ 5.5V | A/D 13x12b SAR; D/A 1x8b | Surface Mount |