| 图片 | 厂商料号 | 库存情况 | 价格 | 数量 | 数据表 | 封装/外壳 | 系列 | 包装 | 产品状态 | 可编程 | 核心处理器 | 速度 | 连接性 | 外设 | 等级 | I/O 数量 | 程序存储器大小 | 核心大小 | 程序存储器类型 | EEPROM 大小 | 工作温度 | RAM 大小 | 认证 | 振荡器类型 | 电压 - 供应(Vcc/Vdd) | 数据转换器 | 安装类型 | 供应商设备封装 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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SPC5125YVN400IC MCU 32BIT ROMLESS 324PBGA NXP USA Inc. |
0 | - |
|
数据表 |
324-BBGA | MPC51xx | Tray | Active | Not Verified | e300 | 400MHz | CANbus, EBI/EMI, Ethernet, I2C, USB OTG | DMA, WDT | - | 64 | - | 32-Bit Single-Core | ROMless | - | -40°C ~ 125°C | 32K x 8 | - | External | 1.08V ~ 3.6V | - | Surface Mount | |
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MC908AP32CFAE-NXPMICROCONTROLLER, 8 BIT, HC08/S08 NXP USA Inc. |
0 | - |
|
数据表 |
48-LQFP | HC08 | Bulk | Active | Not Verified | HC08 | 8MHz | I2C, IRSCI, SCI, SPI | LED, LVD, POR, PWM | - | 32 | 32KB (32K x 8) | 8-Bit | FLASH | - | -40°C ~ 85°C (TA) | 2K x 8 | - | Internal | 2.7V ~ 5.5V | A/D 8x10b | Surface Mount | |
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MCF5274VM166IC MCU 32BIT ROMLESS 256MAPBGA NXP USA Inc. |
0 | - |
|
数据表 |
256-LBGA | MCF527x | Tray | Not For New Designs | Not Verified | Coldfire V2 | 166MHz | EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB | DMA, WDT | - | 69 | - | 32-Bit Single-Core | ROMless | - | 0°C ~ 70°C (TA) | 64K x 8 | - | External | 1.4V ~ 1.6V | - | Surface Mount | |
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SPC5747GK1MMJ6RIC MCU 32BIT 4MB FLSH 256MAPPBGA NXP USA Inc. |
0 | - |
|
数据表 |
256-LBGA | MPC57xx | Tape & Reel (TR) | Active | Not Verified | e200z2, e200z4, e200z4 | 80MHz/160MHz | CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | - | 178 | 4MB (4M x 8) | 32-Bit Tri-Core | FLASH | - | -40°C ~ 125°C (TA) | 768K x 8 | - | Internal | 3V ~ 5.5V | A/D 80x10b, 64x12b | Surface Mount | |
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SPC5516EBMLQ66IC MCU 32BIT 1MB FLASH 144LQFP NXP USA Inc. |
0 | - |
|
数据表 |
144-LQFP | MPC55xx Qorivva | Tray | Active | Not Verified | e200z0, e200z1 | 66MHz | CANbus, EBI/EMI, I2C, SCI, SPI | DMA, POR, PWM, WDT | - | 111 | 1MB (1M x 8) | 32-Bit Dual-Core | FLASH | - | -40°C ~ 125°C (TA) | 64K x 8 | - | Internal | 4.5V ~ 5.25V | A/D 40x12b | Surface Mount | |
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S32K376NHT1MJBSRS32K376NHT1MJBSR NXP USA Inc. |
0 | - |
|
数据表 |
289-LFBGA | S32K3 | Tape & Reel (TR) | Active | - | ARM® Cortex®-M7 | 320MHz | CANbus, I2C, QSPI, SPI, UART/USART | DMA, I2S, WDT | Automotive | 209 | 6MB (6M x 8) | 32-Bit Quad-Core | FLASH | 128K x 8 | -40°C ~ 125°C (TA) | 800K x 8 | AEC-Q100 | External | 2.7V ~ 5.5V | A/D 69x12b SAR, Sigma-Delta | Surface Mount | |
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MC912D60AVFUE8IC MCU 16BIT 60KB FLASH 80QFP NXP USA Inc. |
0 | - |
|
数据表 |
80-QFP | HC12 | Tray | Not For New Designs | Not Verified | CPU12 | 8MHz | CANbus, MI Bus, SCI, SPI | POR, PWM, WDT | - | 48 | 60KB (60K x 8) | 16-Bit | FLASH | 1K x 8 | -40°C ~ 105°C | 2K x 8 | - | Internal | 4.5V ~ 5.5V | A/D 8x8/10b | Surface Mount | |
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SPC5747GK1MMJ6IC MCU 32BIT 4MB FLSH 256MAPPBGA NXP USA Inc. |
0 | - |
|
数据表 |
256-LBGA | MPC57xx | Bulk | Active | Not Verified | e200z2, e200z4, e200z4 | 80MHz/160MHz | CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | - | 178 | 4MB (4M x 8) | 32-Bit Tri-Core | FLASH | - | -40°C ~ 125°C (TA) | 768K x 8 | - | Internal | 3V ~ 5.5V | A/D 80x10b, 64x12b | Surface Mount | |
|
SPC5747GK0AMMJ6IC MCU 32BIT 4MB FLSH 256MAPPBGA NXP USA Inc. |
0 | - |
|
数据表 |
256-LBGA | MPC57xx | Tray | Active | Not Verified | e200z2, e200z4, e200z4 | 80MHz/120MHz | CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | - | 178 | 4MB (4M x 8) | 32-Bit Tri-Core | FLASH | - | -40°C ~ 125°C (TA) | 768K x 8 | - | Internal | 3V ~ 5.5V | A/D 80x10b, 64x12b | Surface Mount | |
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S912B32E4CFUE8RIC MCU 16BIT 32KB FLASH 80QFP NXP USA Inc. |
0 | - |
|
数据表 |
80-QFP | HC12 | Tape & Reel (TR) | Not For New Designs | Not Verified | CPU12 | 8MHz | SCI, SPI | POR, PWM, WDT | - | 63 | 32KB (32K x 8) | 16-Bit | FLASH | 768 x 8 | -40°C ~ 85°C (TA) | 1K x 8 | - | External | 4.5V ~ 5.5V | A/D 8x10b | Surface Mount |