| 图片 | 厂商料号 | 库存情况 | 价格 | 数量 | 数据表 | 封装/外壳 | 系列 | 包装 | 产品状态 | 可编程 | 核心处理器 | 速度 | 连接性 | 外设 | 等级 | I/O 数量 | 程序存储器大小 | 核心大小 | 程序存储器类型 | EEPROM 大小 | 工作温度 | RAM 大小 | 认证 | 振荡器类型 | 电压 - 供应(Vcc/Vdd) | 数据转换器 | 安装类型 | 供应商设备封装 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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S908AZ60AE2MFUEIC MCU 8BIT 60KB FLASH 64QFP NXP USA Inc. |
0 | - |
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数据表 |
64-QFP | HC08 | Tray | Not For New Designs | Not Verified | HC08 | 8MHz | CANbus, SCI, SPI | LVD, POR, PWM | - | 52 | 60KB (60K x 8) | 8-Bit | FLASH | 1K x 8 | -40°C ~ 105°C (TA) | 2K x 8 | - | Internal | 4.5V ~ 5.5V | A/D 15x8b | Surface Mount | |
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S32K328GHT1VJBSTS32K328GHT1VJBST NXP USA Inc. |
0 | - |
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数据表 |
289-LFBGA | S32K3 | Bulk | Active | - | ARM® Cortex®-M7 | 240MHz | CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART | DMA, I2S, WDT | Automotive | 218 | 8MB (8M x 8) | 32-Bit Dual-Core | FLASH | 128K x 8 | -40°C ~ 105°C (TA) | 1.125M x 8 | AEC-Q100 | External, Internal | 2.97V ~ 5.5V | A/D 24x12b SAR | Surface Mount | |
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MC9S12XHZ256CALIC MCU 16BIT 256KB FLASH 112LQFP NXP USA Inc. |
0 | - |
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数据表 |
112-LQFP | HCS12X | Tray | Last Time Buy | Not Verified | HCS12X | 80MHz | CANbus, EBI/EMI, I2C, LINbus, SCI, SPI | LCD, Motor control PWM, POR, PWM, WDT | - | 85 | 256KB (256K x 8) | 16-Bit | FLASH | 4K x 8 | -40°C ~ 85°C | 16K x 8 | - | External | 2.35V ~ 5.5V | A/D 16x8/10b | Surface Mount | |
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PVF60NN151CMK50IC MCU 32BIT ROMLESS 364BGA NXP USA Inc. |
0 | - |
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数据表 |
364-LFBGA | Vybrid, VF6xx | Tray | Active | Not Verified | ARM® Cortex®-A5 + Cortex®-M4 | 500MHz | CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, SCI, SD, SPI, UART/USART, USB OTG | DMA, LVD, WDT | - | - | - | 32-Bit Dual-Core | ROMless | - | -40°C ~ 85°C | 1.5MB | - | Internal | 3V ~ 3.6V | A/D 12bit SAR; D/A 12bit | Surface Mount | |
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SPC5746BHK1AMKU6IC MCU 32BIT 3MB FLASH 176LQFP NXP USA Inc. |
0 | - |
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数据表 |
176-LQFP Exposed Pad | MPC57xx | Tray | Active | Not Verified | e200z4 | 160MHz | CANbus, Ethernet, FlexRay, I2C, LINbus, SPI | DMA, I2S, POR, WDT | - | 129 | 3MB (3M x 8) | 32-Bit Single-Core | FLASH | 64K x 8 | -40°C ~ 125°C (TA) | 384K x 8 | - | Internal | 3.15V ~ 5.5V | A/D 36x10b, 16x12b | Surface Mount | |
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MCF5307FT66BIC MCU 32BIT ROMLESS 208FQFP NXP USA Inc. |
0 | - |
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数据表 |
208-BFQFP | MCF530x | Tray | Obsolete | Not Verified | Coldfire V3 | 66MHz | EBI/EMI, I2C, UART/USART | DMA, POR, WDT | - | 16 | - | 32-Bit Single-Core | ROMless | - | 0°C ~ 70°C (TA) | 4K x 8 | - | External | 3V ~ 3.6V | - | Surface Mount | |
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MCF5280CVF66IC MCU 32BIT ROMLESS 256MAPBGA NXP USA Inc. |
0 | - |
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数据表 |
256-LBGA | MCF528x | Tray | Obsolete | Not Verified | Coldfire V2 | 66MHz | CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART | DMA, LVD, POR, PWM, WDT | - | 142 | - | 32-Bit Single-Core | ROMless | - | -40°C ~ 85°C (TA) | 64K x 8 | - | External | 2.7V ~ 3.6V | A/D 8x10b | Surface Mount | |
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SPC5606SF2VLQ6IC MCU 32BIT 1MB FLASH 144LQFP NXP USA Inc. |
0 | - |
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数据表 |
144-LQFP | MPC56xx Qorivva | Tray | Active | Not Verified | e200z0h | 64MHz | CANbus, I2C, LINbus, QSPI, SCI, SPI | DMA, LCD, POR, PWM, WDT | - | 108 | 1MB (1M x 8) | 32-Bit Single-Core | FLASH | 64K x 8 | -40°C ~ 105°C (TA) | 48K x 8 | - | Internal | 3V ~ 5.5V | A/D 16x10b | Surface Mount | |
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SPC5746CHK1ACKU6IC MCU 32BIT 3MB FLASH 176LQFP NXP USA Inc. |
0 | - |
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数据表 |
176-LQFP Exposed Pad | MPC57xx | Tray | Active | - | e200z2, e200z4 | 80MHz, 160MHz | CANbus, Ethernet, FlexRay, I2C, LINbus, SAI, SPI | DMA, I2S, LVD/HVD, POR, WDT | Automotive | 129 | 3MB (3M x 8) | 32-Bit Dual-Core | FLASH | 128K x 8 | -40°C ~ 85°C (TA) | 384K x 8 | AEC-Q100 | Internal | 3.15V ~ 5.5V | A/D 68x10b, 31x12b SAR | Surface Mount | |
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MC9S12E64MFUEIC MCU 16BIT 64KB FLASH 80QFP NXP USA Inc. |
0 | - |
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数据表 |
80-QFP | HCS12 | Tray | Active | Not Verified | HCS12 | 25MHz | EBI/EMI, I2C, SCI, SPI | POR, PWM, WDT | - | 60 | 64KB (64K x 8) | 16-Bit | FLASH | - | -40°C ~ 125°C (TA) | 4K x 8 | - | Internal | 2.35V ~ 2.75V | A/D 16x10b; D/A 2x8b | Surface Mount |