| 图片 | 厂商料号 | 库存情况 | 价格 | 数量 | 数据表 | 封装/外壳 | 系列 | 包装 | 产品状态 | 可编程 | 核心处理器 | 速度 | 连接性 | 外设 | 等级 | I/O 数量 | 程序存储器大小 | 核心大小 | 程序存储器类型 | EEPROM 大小 | 工作温度 | RAM 大小 | 认证 | 振荡器类型 | 电压 - 供应(Vcc/Vdd) | 数据转换器 | 安装类型 | 供应商设备封装 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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SPC5643LFK0MLQ1RIC MCU 32BIT 1MB FLASH 144LQFP NXP USA Inc. |
0 | - |
|
数据表 |
144-LQFP | MPC56xx Qorivva | Tape & Reel (TR) | Active | Not Verified | e200z4 | 120MHz | CANbus, FlexRay, LINbus, SPI, UART/USART | DMA, POR, PWM, WDT | - | - | 1MB (1M x 8) | 32-Bit Dual-Core | FLASH | - | -40°C ~ 125°C (TA) | 128K x 8 | - | Internal | 3V ~ 5.5V | A/D 32x12b | Surface Mount | |
|
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MCF54452VP266RIC MCU 32BIT ROMLESS 360BGA NXP USA Inc. |
0 | - |
|
数据表 |
360-BBGA | MCF5445x | Tape & Reel (TR) | Active | Not Verified | Coldfire V4 | 266MHz | I2C, SPI, SSI, UART/USART, USB OTG | DMA, WDT | - | 132 | - | 32-Bit Single-Core | ROMless | - | 0°C ~ 70°C (TA) | 32K x 8 | - | External, Internal | 1.35V ~ 3.6V | - | Surface Mount | |
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MMC2114CFCPU33IC MCU 32BIT 256KB FLASH 100LQFP NXP USA Inc. |
0 | - |
|
数据表 |
100-LQFP | MCore | Tray | Obsolete | Not Verified | M210 | 33MHz | EBI/EMI, SCI, SPI | LVD, POR, PWM, WDT | - | 67 | 256KB (256K x 8) | 16/32-Bit | FLASH | - | -40°C ~ 85°C (TA) | 32K x 8 | - | Internal | 2.7V ~ 3.6V | A/D 8x10b | Surface Mount | |
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MC68334GCEH20IC MCU 32BIT ROMLESS 132PQFP NXP USA Inc. |
0 | - |
|
数据表 |
132-BQFP Bumpered | M683xx | Tray | Obsolete | Not Verified | CPU32 | 20MHz | EBI/EMI, UART/USART | - | - | 47 | - | 32-Bit Single-Core | ROMless | - | -40°C ~ 85°C (TA) | 1K x 8 | - | External | 3V ~ 5.5V | A/D 8x8/10b | Surface Mount | |
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S32K328GHT1VJBSRS32K328GHT1VJBSR NXP USA Inc. |
0 | - |
|
数据表 |
289-LFBGA | S32K3 | Bulk | Active | - | ARM® Cortex®-M7 | 240MHz | CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART | DMA, I2S, WDT | Automotive | 218 | 8MB (8M x 8) | 32-Bit Dual-Core | FLASH | 128K x 8 | -40°C ~ 105°C (TA) | 1.125M x 8 | AEC-Q100 | External, Internal | 2.97V ~ 5.5V | A/D 24x12b SAR | Surface Mount | |
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MC9S12HZ128CALIC MCU 16BIT 128KB FLASH 112LQFP NXP USA Inc. |
0 | - |
|
数据表 |
112-LQFP | HCS12 | Tray | Not For New Designs | Not Verified | HCS12 | 25MHz | CANbus, EBI/EMI, I2C, SCI, SPI | LCD, Motor control PWM, POR, PWM, WDT | - | 85 | 128KB (128K x 8) | 16-Bit | FLASH | 2K x 8 | -40°C ~ 85°C (TA) | 6K x 8 | - | Internal | 2.35V ~ 5.5V | A/D 16x10b | Surface Mount | |
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PK70FN1M0VMJ15IC MCU 32BIT 1MB FLSH 256MAPPBGA NXP USA Inc. |
0 | - |
|
数据表 |
256-LBGA | Kinetis K70 | Box | Obsolete | Not Verified | ARM® Cortex®-M4 | 150MHz | CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | DMA, I2S, LCD, LVD, POR, PWM, WDT | - | 128 | 1MB (1M x 8) | 32-Bit Single-Core | FLASH | - | -40°C ~ 105°C (TA) | 128K x 8 | - | Internal | 1.71V ~ 3.6V | A/D 81x16b; D/A 2x12b | Surface Mount | |
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S32K328GHT1VPCSRS32K328GHT1VPCSR NXP USA Inc. |
0 | - |
|
数据表 |
172-QFP Exposed Pad | S32K3 | Bulk | Active | - | ARM® Cortex®-M7 | 240MHz | CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART | DMA, I2S, WDT | - | 142 | 8MB (8M x 8) | 32-Bit Dual-Core | FLASH | 128K x 8 | -40°C ~ 105°C (TA) | 1.125M x 8 | - | External, Internal | 2.97V ~ 5.5V | A/D 24x12b SAR | Surface Mount | |
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MC908AZ60AVFUEIC MCU 8BIT 60KB FLASH 64QFP NXP USA Inc. |
0 | - |
|
数据表 |
64-QFP | HC08 | Tray | Not For New Designs | Not Verified | HC08 | 8.4MHz | CANbus, SCI, SPI | LVD, POR, PWM | - | 52 | 60KB (60K x 8) | 8-Bit | FLASH | 1K x 8 | -40°C ~ 105°C (TA) | 2K x 8 | - | Internal | 4.5V ~ 5.5V | A/D 15x8b | Surface Mount | |
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SPC5746CHK0AMMH6IC MCU 32BIT 3MB FLASH 100MAPBGA NXP USA Inc. |
0 | - |
|
数据表 |
100-LFBGA | MPC57xx | Bulk | Not For New Designs | Not Verified | e200z2, e200z4 | 80MHz/160MHz | CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | - | - | 3MB (3M x 8) | 32-Bit Dual-Core | FLASH | - | -40°C ~ 125°C (TA) | 512K x 8 | - | Internal | 3V ~ 5.5V | A/D 80x10b, 64x12b | Surface Mount |