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| 图片 | 厂商料号 | 库存情况 | 价格 | 数量 | 数据表 | 封装/外壳 | 系列 | 包装 | 产品状态 | 可编程 | 核心处理器 | 速度 | 连接性 | 外设 | 等级 | I/O 数量 | 程序存储器大小 | 核心大小 | 程序存储器类型 | EEPROM 大小 | 工作温度 | RAM 大小 | 认证 | 振荡器类型 | 电压 - 供应（Vcc/Vdd） | 数据转换器 | 安装类型 | 供应商设备封装 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
LPC11U22FBD48/30QLIC MCU 32BIT 16KB FLASH 48LQFP NXP USA Inc. |
242 | - |
|
数据表 |
48-LQFP | LPC11Uxx | Tray | Active | Not Verified | ARM® Cortex®-M0 | 50MHz | I2C, Microwire, SPI, SSI, SSP, UART/USART, USB | Brown-out Detect/Reset, POR, WDT | - | 40 | 16KB (16K x 8) | 32-Bit Single-Core | FLASH | 1K x 8 | -40°C ~ 85°C (TA) | 8K x 8 | - | Internal | 1.8V ~ 3.6V | A/D 8x10b | Surface Mount | |
|
MC9S08GT16ACFDEIC MCU 8BIT 16KB FLASH 48QFN NXP USA Inc. |
20,123 | - |
|
数据表 |
48-VFQFN Exposed Pad | S08 | Tray | Active | Verified | S08 | 40MHz | I2C, SCI, SPI | LVD, POR, PWM, WDT | - | 39 | 16KB (16K x 8) | 8-Bit | FLASH | - | -40°C ~ 85°C (TA) | 2K x 8 | - | Internal | 1.8V ~ 3.6V | A/D 8x10b | Surface Mount | |
|
|
FS32K118LAT0MLFTIC MCU 32BIT 256KB FLASH 48LQFP NXP USA Inc. |
145 | - |
|
数据表 |
48-LQFP | S32K | Tray | Active | Not Verified | ARM® Cortex®-M0+ | 48MHz | CANbus, FlexIO, I2C, LINbus, SPI, UART/USART | DMA, PWM, WDT | - | 43 | 256KB (256K x 8) | 32-Bit Single-Core | FLASH | 2K x 8 | -40°C ~ 125°C (TA) | 25K x 8 | - | Internal | 2.7V ~ 5.5V | A/D 16x12b SAR; D/A1x8b | Surface Mount | |
|
LPC11U68JBD100KIC MCU 32BIT 256KB FLASH 100LQFP NXP USA Inc. |
1,194 | - |
|
数据表 |
100-LQFP | LPC11Uxx | Tray | Active | Not Verified | ARM® Cortex®-M0+ | 50MHz | I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB | Brown-out Detect/Reset, DMA, POR, PWM, WDT | - | 80 | 256KB (256K x 8) | 32-Bit Single-Core | FLASH | 4K x 8 | -40°C ~ 105°C (TA) | 36K x 8 | - | Internal | 2.4V ~ 3.6V | A/D 12x12b | Surface Mount | |
|
MC9S08PB8MTGIC MCU 8BIT 8KB FLASH 16TSSOP NXP USA Inc. |
0 | - |
|
数据表 |
16-TSSOP (0.173", 4.40mm Width) | S08 | Tube | Active | Not Verified | S08 | 20MHz | I2C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | - | 14 | 8KB (8K x 8) | 8-Bit | FLASH | - | -40°C ~ 125°C (TA) | 1K x 8 | - | External | 2.7V ~ 5.5V | A/D 8x12b | Surface Mount | |
|
MKL03Z32VFK4RIC MCU 32BIT 32KB FLASH 24QFN NXP USA Inc. |
0 | - |
|
数据表 |
24-VFQFN Exposed Pad | Kinetis KL03 | Tape & Reel (TR) | Active | Not Verified | ARM® Cortex®-M0+ | 48MHz | I2C, SPI, UART/USART | Brown-out Detect/Reset, LVD, POR, PWM, WDT | - | 22 | 32KB (32K x 8) | 32-Bit Single-Core | FLASH | - | -40°C ~ 105°C (TA) | 2K x 8 | - | Internal | 1.71V ~ 3.6V | A/D 7x12b | Surface Mount | |
|
|
MC908QY1ACDTERIC MCU 8BIT 1.5KB FLASH 16TSSOP NXP USA Inc. |
0 | - |
|
数据表 |
16-TSSOP (0.173", 4.40mm Width) | HC08 | Tape & Reel (TR) | Obsolete | Not Verified | HC08 | 8MHz | - | LVD, POR, PWM | - | 13 | 1.5KB (1.5K x 8) | 8-Bit | FLASH | - | -40°C ~ 85°C (TA) | 128 x 8 | - | Internal | 2.7V ~ 5.5V | - | Surface Mount | |
|
LPC5534JBD64MPIC MCU 32BIT 128KB FLASH 64HTQFP NXP USA Inc. |
1,260 | - |
|
数据表 |
64-TQFP Exposed Pad | - | Tape & Reel (TR) | Active | - | ARM® Cortex®-M33 | 150MHz | CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART | Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT | - | 39 | 128KB (128K x 8) | 32-Bit Single-Core | FLASH | - | -40°C ~ 105°C (TA) | 96K x 8 | - | External, Internal | 1.8V ~ 3.6V | A/D 13x16b; D/A 1x12b | Surface Mount | |
|
MC9S08GT16ACFBEIC MCU 8BIT 16KB FLASH 44QFP NXP USA Inc. |
436 | - |
|
数据表 |
44-QFP | S08 | Tray | Active | Not Verified | S08 | 40MHz | I2C, SCI, SPI | LVD, POR, PWM, WDT | - | 36 | 16KB (16K x 8) | 8-Bit | FLASH | - | -40°C ~ 85°C (TA) | 2K x 8 | - | Internal | 1.8V ~ 3.6V | A/D 8x10b | Surface Mount | |
|
FS32K118LFT0MLHTIC MCU 32BIT 256KB FLASH 64LQFP NXP USA Inc. |
1,116 | - |
|
数据表 |
64-LQFP | S32K | Tray | Active | Not Verified | ARM® Cortex®-M0+ | 48MHz | CANbus, FlexIO, I2C, LINbus, SPI, UART/USART | DMA, PWM, WDT | - | 58 | 256KB (256K x 8) | 32-Bit Single-Core | FLASH | 2K x 8 | -40°C ~ 125°C (TA) | 25K x 8 | - | Internal | 2.7V ~ 5.5V | A/D 16x12b SAR; D/A1x8b | Surface Mount |
