| 图片 | 厂商料号 | 库存情况 | 价格 | 数量 | 数据表 | 封装/外壳 | 系列 | 包装 | 产品状态 | 可编程 | 核心处理器 | 速度 | 连接性 | 外设 | 等级 | I/O 数量 | 程序存储器大小 | 核心大小 | 程序存储器类型 | EEPROM 大小 | 工作温度 | RAM 大小 | 认证 | 振荡器类型 | 电压 - 供应(Vcc/Vdd) | 数据转换器 | 安装类型 | 供应商设备封装 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
MKL27Z256VLH4IC MCU 32BIT 256KB FLASH 64LQFP NXP USA Inc. |
689 | - |
|
数据表 |
64-LQFP | Kinetis KL2 | Tray | Active | Not Verified | ARM® Cortex®-M0+ | 48MHz | I2C, SPI, UART/USART, USB | DMA, I2S, LVD, POR, PWM, WDT | - | 50 | 256KB (256K x 8) | 32-Bit Single-Core | FLASH | - | -40°C ~ 105°C (TA) | 32K x 8 | - | Internal | 1.71V ~ 3.6V | A/D 16x16b; D/A 1x12b | Surface Mount | |
|
|
LPC55S28JBD64KIC MCU 32BIT 512KB FLASH 64HTQFP NXP USA Inc. |
669 | - |
|
数据表 |
64-TQFP Exposed Pad | LPC55S2x | Tray | Active | Not Verified | ARM® Cortex®-M33 | 150MHz | Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB | Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT | - | 36 | 512KB (512K x 8) | 32-Bit Single-Core | FLASH | - | -40°C ~ 105°C (TA) | 256K x 8 | - | External, Internal | 1.8V ~ 3.6V | A/D 10x16b | Surface Mount | |
|
MC9S08PA16AMTGIC MCU 8BIT 16KB FLASH 16TSSOP NXP USA Inc. |
0 | - |
|
数据表 |
16-TSSOP (0.173", 4.40mm Width) | S08 | Tube | Active | Not Verified | S08 | 20MHz | I2C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | - | 14 | 16KB (16K x 8) | 8-Bit | FLASH | 256 x 8 | -40°C ~ 105°C (TA) | 2K x 8 | - | Internal | 2.7V ~ 5.5V | A/D 12x12b | Surface Mount | |
|
LPC802UKZLPC802UKZ - Low-Cost Microcontro NXP Semiconductors |
559,224 | - |
|
数据表 |
16-UFBGA, WLCSP | LPC80xM | Bulk | Active | Not Verified | ARM® Cortex®-M0+ | 15MHz | I2C, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | - | 13 | 16KB (16K x 8) | 32-Bit Single-Core | FLASH | - | -40°C ~ 105°C (TA) | 2K x 8 | - | Internal | 1.71V ~ 3.6V | A/D 12x12b | Surface Mount | |
|
MC908QT4AMPEIC MCU 8BIT 4KB FLASH 8DIP NXP USA Inc. |
2,450 | - |
|
数据表 |
8-DIP (0.300", 7.62mm) | HC08 | Bulk | Obsolete | Not Verified | HC08 | 8MHz | - | LVD, POR, PWM | - | 5 | 4KB (4K x 8) | 8-Bit | FLASH | - | -40°C ~ 125°C (TA) | 128 x 8 | - | Internal | 2.7V ~ 5.5V | A/D 6x10b | Through Hole | |
|
MC908QY1ACDTEIC MCU 8BIT 1.5KB FLASH 16TSSOP NXP USA Inc. |
4,108 | - |
|
数据表 |
16-TSSOP (0.173", 4.40mm Width) | HC08 | Bulk | Obsolete | Not Verified | HC08 | 8MHz | - | LVD, POR, PWM | - | 13 | 1.5KB (1.5K x 8) | 8-Bit | FLASH | - | -40°C ~ 85°C (TA) | 128 x 8 | - | Internal | 2.7V ~ 5.5V | - | Surface Mount | |
|
MC9S08AC32CFGEIC MCU 8BIT 32KB FLASH 44LQFP NXP USA Inc. |
860 | - |
|
数据表 |
44-LQFP | S08 | Tray | Active | Not Verified | S08 | 40MHz | I2C, SCI, SPI | LVD, POR, PWM, WDT | - | 34 | 32KB (32K x 8) | 8-Bit | FLASH | - | -40°C ~ 85°C (TA) | 2K x 8 | - | Internal | 2.7V ~ 5.5V | A/D 8x10b | Surface Mount | |
|
MC9S08PL8CTJIC MCU 8BIT 8KB FLASH 20TSSOP NXP USA Inc. |
0 | - |
|
数据表 |
20-TSSOP (0.173", 4.40mm Width) | S08 | Tube | Active | Not Verified | S08 | 20MHz | LINbus, SCI, UART/USART | LVD, POR, PWM | - | 18 | 8KB (8K x 8) | 8-Bit | FLASH | 256 x 8 | -40°C ~ 85°C (TA) | 2K x 8 | - | Internal | 2.7V ~ 5.5V | A/D 10x10b | Surface Mount | |
|
C9KEAZN8AMTGC9KEAZN8AMTG NXP USA Inc. |
0 | - |
|
数据表 |
16-TSSOP (0.173", 4.40mm Width) | Kinetis KEA | Bulk | Active | - | ARM® Cortex®-M0+ | 48MHz | I2C, SPI, UART/USART | LVD, PMC, PWM, WDT | - | 22 | 8KB (8K x 8) | 32-Bit | FLASH | - | -40°C ~ 125°C (TA) | 1K x 8 | - | Internal | 2.7V ~ 5.5V | A/D 12x12b SAR | Surface Mount | |
|
LPC1114FHN33/333,5IC MCU 32BIT 56KB FLASH 32HVQFN NXP USA Inc. |
12,220 | - |
|
数据表 |
32-VQFN Exposed Pad | LPC1100XL | Tray | Active | Not Verified | ARM® Cortex®-M0 | 50MHz | I2C, SPI, UART/USART | Brown-out Detect/Reset, POR, WDT | - | 28 | 56KB (56K x 8) | 32-Bit Single-Core | FLASH | - | -40°C ~ 85°C (TA) | 8K x 8 | - | Internal | 1.8V ~ 3.6V | A/D 8x10b | Surface Mount |