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| 图片 | 厂商料号 | 库存情况 | 价格 | 数量 | 数据表 | 封装/外壳 | 系列 | 包装 | 产品状态 | 可编程 | 核心处理器 | 速度 | 连接性 | 外设 | 等级 | I/O 数量 | 程序存储器大小 | 核心大小 | 程序存储器类型 | EEPROM 大小 | 工作温度 | RAM 大小 | 认证 | 振荡器类型 | 电压 - 供应（Vcc/Vdd） | 数据转换器 | 安装类型 | 供应商设备封装 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
C9KEAZN8AVTGIC MCU NXP USA Inc. |
0 | - |
|
数据表 |
- | - | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
MCF52256CVN66IC MCU 32B 256KB FLASH 144MAPBGA NXP USA Inc. |
800 | - |
|
数据表 |
144-LBGA | MCF5225x | Tray | Active | Not Verified | Coldfire V2 | 66MHz | CANbus, EBI/EMI, Ethernet, I2C, QSPI, UART/USART, USB OTG | DMA, LVD, POR, PWM, WDT | - | 96 | 256KB (256K x 8) | 32-Bit Single-Core | FLASH | - | -40°C ~ 85°C (TA) | 64K x 8 | - | Internal | 3V ~ 3.6V | A/D 8x12b | Surface Mount | |
|
LPC5516JBD64EIC MCU 32BIT 256KB FLASH 64HTQFP NXP USA Inc. |
161 | - |
|
数据表 |
64-TQFP Exposed Pad | LPC551x | Tray | Active | Not Verified | ARM® Cortex®-M33 | 150MHz | CAN FD, Flexcomm, I2C, SPI, UART/USART, USB | Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT | - | 36 | 256KB (256K x 8) | 32-Bit Single-Core | FLASH | - | -40°C ~ 105°C (TA) | 96K x 8 | - | External, Internal | 1.8V ~ 3.6V | A/D 10x16b SAR | Surface Mount | |
|
MC68HC908QY4CDTEIC MCU 8BIT 4KB FLASH 16TSSOP NXP USA Inc. |
1,653 | - |
|
数据表 |
16-TSSOP (0.173", 4.40mm Width) | HC08 | Tube | Not For New Designs | Verified | HC08 | 8MHz | - | LVD, POR, PWM | - | 13 | 4KB (4K x 8) | 8-Bit | FLASH | - | -40°C ~ 85°C (TA) | 128 x 8 | - | Internal | 2.7V ~ 5.5V | A/D 4x8b | Surface Mount | |
|
LPC1114FHI33/302,5IC MCU 32BIT 32KB FLASH 32HVQFN NXP USA Inc. |
1,440 | - |
|
数据表 |
32-VFQFN Exposed Pad | LPC1100L | Tray | Active | Not Verified | ARM® Cortex®-M0 | 50MHz | I2C, SPI, UART/USART | Brown-out Detect/Reset, POR, WDT | - | 28 | 32KB (32K x 8) | 32-Bit Single-Core | FLASH | - | -40°C ~ 85°C (TA) | 8K x 8 | - | Internal | 1.8V ~ 3.6V | A/D 8x10b | Surface Mount | |
|
|
MIMXRT555SFAWCRIC MCU 32BIT 192KB ROM 141WLCSP NXP USA Inc. |
5,979 | - |
|
数据表 |
141-XFBGA, WLCSP | i.MX | Tape & Reel (TR) | Active | Not Verified | ARM® Cortex®-M33 | 200MHz | eMMC/SD/SDIO, I2C, LINbus, SPI, UART/USART, USB | DMA, I2S, LCD, POR, PWM, WDT | - | 136 | 192KB (192K x 8) | 32-Bit Dual-Core | ROM | - | -20°C ~ 70°C (TA) | 5M x 8 | - | External, Internal | 1.71V ~ 3.6V | A/D 10x12b | Surface Mount | |
|
S9KEAZN64ACLHIC MCU 32BIT 64KB FLASH 64LQFP NXP USA Inc. |
1,400 | - |
|
数据表 |
64-LQFP | Kinetis KEA | Tray | Active | Not Verified | ARM® Cortex®-M0+ | 40MHz | I2C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | - | 57 | 64KB (64K x 8) | 32-Bit Single-Core | FLASH | 256 x 8 | -40°C ~ 85°C (TA) | 4K x 8 | - | Internal | 2.7V ~ 5.5V | A/D 16x12b | Surface Mount | |
|
S9S12G48F0MLFIC MCU 16BIT 48KB FLASH 48LQFP NXP USA Inc. |
1,623 | - |
|
数据表 |
48-LQFP | HCS12 | Tray | Active | Not Verified | 12V1 | 25MHz | CANbus, IrDA, LINbus, SCI, SPI | LVD, POR, PWM, WDT | - | 40 | 48KB (48K x 8) | 16-Bit | FLASH | 1.5K x 8 | -40°C ~ 125°C (TA) | 4K x 8 | - | Internal | 3.13V ~ 5.5V | A/D 12x10b | Surface Mount | |
|
LPC11U24FHN33/401,IC MCU 32BIT 32KB FLASH 32HVQFN NXP USA Inc. |
4,500 | - |
|
数据表 |
32-VQFN Exposed Pad | LPC11Uxx | Tray | Active | Not Verified | ARM® Cortex®-M0 | 50MHz | I2C, Microwire, SPI, SSI, SSP, UART/USART, USB | Brown-out Detect/Reset, POR, WDT | - | 26 | 32KB (32K x 8) | 32-Bit Single-Core | FLASH | 4K x 8 | -40°C ~ 85°C (TA) | 10K x 8 | - | Internal | 1.8V ~ 3.6V | A/D 8x10b | Surface Mount | |
|
|
MK02FN128VLF10IC MCU 32BIT 128KB FLASH 48LQFP NXP USA Inc. |
1,315 | - |
|
数据表 |
48-LQFP | Kinetis K02 | Tray | Active | Not Verified | ARM® Cortex®-M4 | 100MHz | I2C, SPI, UART/USART | DMA, LVD, POR, PWM | - | 35 | 128KB (128K x 8) | 32-Bit Single-Core | FLASH | - | -40°C ~ 105°C (TA) | 16K x 8 | - | Internal | 1.71V ~ 3.6V | A/D 12x16b; D/A 1x12b | Surface Mount |
