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微控制器、微处理器、FPGA 模块

制造商 系列 包装 产品状态 模块/板类型 核心处理器 速度 闪存大小 RAM 大小 连接器类型 尺寸 / 尺寸 协处理器 工作温度

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 模块/板类型 核心处理器 速度 闪存大小 RAM 大小 连接器类型 尺寸 / 尺寸 协处理器 工作温度
FORLINX-FET3568-C+202GSE16GCA10

FORLINX-FET3568-C+202GSE16GCA10

Rockchip RK3568SOM, 2GB DDR4, 16

Forlinx Embedded

1 -
FORLINX-FET3568-C+202GSE16GCA10

数据表

- Tape & Box (TB) Active MPU ARM® Cortex®-A55 2.0GHz 16GB eMMC 2GB Board-to-Board (BTB) 1.770" L x 2.756" W (45.00mm x 70.00mm) - 0°C ~ 80°C
FORLINX-FETT507-C+152GSE8GIA10

FORLINX-FETT507-C+152GSE8GIA10

Allwinner T507SOM, 2GB DDR3L, 8G

Forlinx Embedded

1 -
FORLINX-FETT507-C+152GSE8GIA10

数据表

- Tape & Box (TB) Active MPU ARM® Cortex®-A53 1.5GHz 8GB eMMC 2GB Board-to-Board (BTB) Socket - 240 2.760" L x 1.570" W (70.00mm x 40.00mm) - -40°C ~ 85°C
FORLINX-FET1012A-C+10512MOE01IA11

FORLINX-FET1012A-C+10512MOE01IA11

NXP LS1012ASOM,512MB DDR3L 8GB e

Forlinx Embedded

1 -
FORLINX-FET1012A-C+10512MOE01IA11

数据表

- Tape & Box (TB) Active MPU ARM® Cortex®-A53 1.0GHz 8GB eMMC, 16Mb QSPI 512MB Board-to-Board (BTB) Socket - 160 1.770" L x 1.570" W (45.00mm x 40.00mm) - -40°C ~ 80°C
FORLINX-FET6254-C+142GSE8GIB11

FORLINX-FET6254-C+142GSE8GIB11

TI AM6254SOM,2GB DDR4, 8GB eMMC

Forlinx Embedded

1 -
FORLINX-FET6254-C+142GSE8GIB11

数据表

- Tape & Box (TB) Active MPU ARM® Cortex®-A53, ARM® Cortex®-M4F 1.4GHz 8GB eMMC 2GB Board-to-Board (BTB) 4 x 80 Pin 1.496" L x 2.360" W (38.00mm x 60.00mm) - -40°C ~ 85°C
FORLINX-FETMX8MM-C+182GSE8GCA10

FORLINX-FETMX8MM-C+182GSE8GCA10

NXP i.MX8M MiniSOM,2G DDR4,8GB e

Forlinx Embedded

1 -
FORLINX-FETMX8MM-C+182GSE8GCA10

数据表

- Tape & Box (TB) Active MPU ARM Cortex-A53, ARM® Cortex®-M4F 1.8GHz 8GB eMMC 2GB Board-to-Board (BTB) Socket - 240 2.200" L x 1.417" W (56.00mm x 36.00mm) - 0°C ~ 70°C
FORLINX-FET7110-C+154GSE32GCF11

FORLINX-FET7110-C+154GSE32GCF11

StarFive JH7110, SOM, 4GB LPDDR4

Forlinx Embedded

1 -
FORLINX-FET7110-C+154GSE32GCF11

数据表

StarFive JH7110 Tape & Box (TB) Active MPU JH7110 Quad +RISC-V 1.5GHz 32GB eMMC 4GB Board-to-Board (BTB) 3 x 80 Pin 2.360" L x 1.496" W (60.00mm x 38.00mm) - 0°C ~ 80°C
FORLINX-FET-G2LD-C+122GOE16M16GIB11

FORLINX-FET-G2LD-C+122GOE16M16GIB11

Renesas RZ/G2L (R9A07G044Lxx)SOM

Forlinx Embedded

1 -
FORLINX-FET-G2LD-C+122GOE16M16GIB11

数据表

- Tape & Box (TB) Active MPU ARM® Cortex®-A55, ARM® Cortex®-M33 1.2GHz 16GB eMMC,16MB (NOR) 2GB Board-to-Board (BTB) Socket - 240 1.496" L x 2.360" W (38.00mm x 60.00mm) - -40°C ~ 85°C
FORLINX-FET527N-C+182GSE16GIA11

FORLINX-FET527N-C+182GSE16GIA11

Allwinner T527N, SOM, 2GB LPDDR4

Forlinx Embedded

1 -
FORLINX-FET527N-C+182GSE16GIA11

数据表

Allwinner T527N Tape & Box (TB) Active MPU ARM® Cortex®-A55 8-Core 1.8GHz 16GB eMMC 2GB Board-to-Board (BTB) Socket - 4 x 80 2.756" L x 1.811" W (70.00mm x 46.00mm) - -40°C ~ 85°C
FORLINX-FET3568J-C+182GSE16GIB10

FORLINX-FET3568J-C+182GSE16GIB10

Rockchip RK3568SOM, 2GB DDR4, 16

Forlinx Embedded

1 -
FORLINX-FET3568J-C+182GSE16GIB10

数据表

- Tape & Box (TB) Active MPU ARM® Cortex®-A55 1.8GHz 16GB eMMC 2GB Board-to-Board (BTB) 4 x 80 Pin 1.770" L x 2.756" W (45.00mm x 70.00mm) - -40°C ~ 85°C
FORLINX-FET3576-C+232GSE32GCA11

FORLINX-FET3576-C+232GSE32GCA11

Rockchip 35676, SOM, 2GB LPDDDR4

Forlinx Embedded

1 -
FORLINX-FET3576-C+232GSE32GCA11

数据表

RK3576 Tape & Box (TB) Active MPU ARM® Cortex®-A53 Quad, ARM® Cortex®-A72 2.3GHz 32GB eMMC 2GB Board-to-Board (BTB) Socket - 4 x 100 2.677" L x 1.969" W (68.00mm x 50.00mm) - 0°C ~ 80°C
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