| 图片 | 厂商料号 | 库存情况 | 价格 | 数量 | 数据表 | 系列 | 包装 | 产品状态 | 模块/板类型 | 核心处理器 | 速度 | 闪存大小 | RAM 大小 | 连接器类型 | 尺寸 / 尺寸 | 协处理器 | 工作温度 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
TE0813-01-4BE11-AMODULE MPSOC 4GB DDR4 Trenz Electronic GmbH |
0 | - |
|
数据表 |
- | Box | Discontinued at Digi-Key | FPGA Core | Xilinx Zynq UltraScale+ XCZU4EG-1SFVC784E | - | 128MB | 2GB | Board-to-Board (BTB) Socket | 2.050" L x 2.990" W (52.00mm x 76.00mm) | - | 0°C ~ 85°C |
|
TE0741-04-G2C-1-AMODULE FPGA KINTEX Trenz Electronic GmbH |
0 | - |
|
数据表 |
- | Box | Obsolete | FPGA Core | Xilinx Kintex-7 FPGA XC7K410T-2FBG676C | - | 32MB | - | Board-to-Board (BTB) Socket | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | 0°C ~ 70°C |
|
TE0741-03-B3E-1-AFMODULE FPGA KINTEX Trenz Electronic GmbH |
0 | - |
|
数据表 |
* | Box | Obsolete | - | - | - | - | - | - | - | - | - |
|
TE0741-03-410-2IFMODULE FPGA KINTEX Trenz Electronic GmbH |
0 | - |
|
数据表 |
- | Box | Obsolete | FPGA Core | Xilinx Kintex-7 FPGA XC7K410T-2FBG676I | - | 32MB | - | Board-to-Board (BTB) Socket | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | -40°C ~ 85°C |
|
TE0741-04-D2C-1-AMODULE FPGA KINTEX Trenz Electronic GmbH |
0 | - |
|
数据表 |
- | Box | Obsolete | FPGA Core | Xilinx Kintex-7 FPGA XC7K325T-2FBG676C | - | 32MB | - | Board-to-Board (BTB) Socket | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | 0°C ~ 70°C |
|
TE0741-04-A2C-1-AMODULE FPGA KINTEX Trenz Electronic GmbH |
0 | - |
|
数据表 |
- | Box | Obsolete | FPGA Core | Xilinx Kintex-7 FPGA XC7K70T-2FBG676C | - | 32MB | - | Board-to-Board (BTB) Socket | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | 0°C ~ 70°C |
|
TE0741-04-B2C-1-AFMODULE FPGA KINTEX Trenz Electronic GmbH |
0 | - |
|
数据表 |
- | Box | Obsolete | FPGA Core | Xilinx Kintex-7 FPGA XC7K160T-2FFG676C | - | 32MB | - | Board-to-Board (BTB) Socket | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | 0°C ~ 70°C |
|
TE0741-04-D2I-1-AMODULE FPGA KINTEX Trenz Electronic GmbH |
0 | - |
|
数据表 |
- | Box | Obsolete | FPGA Core | Xilinx Kintex-7 FPGA XC7K325T-2FBG676I | - | 32MB | - | Board-to-Board (BTB) Socket | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | -40°C ~ 85°C |
|
TE0820-05-2BI21MAMOD MPSOC 2GB DDR4 Trenz Electronic GmbH |
0 | - |
|
数据表 |
TE0820 | Bulk | Discontinued at Digi-Key | MPU Core | ARM® Cortex®-R5 | - | 128MB | 2GB | Pin(s) | 1.970" L x 1.570" W (50.00mm x 40.00mm) | Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784I | 0°C ~ 85°C |
|
TE0820-05-5DR21MAMOD MPSOC 2GB DDR4 Trenz Electronic GmbH |
0 | - |
|
数据表 |
TE0820 | Bulk | Discontinued at Digi-Key | MPU Core | - | - | 128MB | 2GB | - | - | - | - |