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陶瓷电容器

制造商 系列 包装 产品状态 电容 容差 温度系数 工作温度 特性 引线样式 额定值 应用 额定电压 失效率 安装类型 引线间距 封装/外壳 厚度(最大值) 尺寸 / 尺寸 高度 - 安装后(最大值)

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 电容 容差 温度系数 工作温度 特性 引线样式 额定值 应用 额定电压 失效率 安装类型 引线间距 封装/外壳 厚度(最大值) 尺寸 / 尺寸 高度 - 安装后(最大值)
CGA9P3X7T2E225K250KE

CGA9P3X7T2E225K250KE

CAP CER 2.2UF 250V X7T 2220

TDK Corporation

28,125 -
CGA9P3X7T2E225K250KE

数据表

CGA Tape & Reel (TR) Active 2.2 µF ±10% X7T -55°C ~ 125°C Soft Termination - AEC-Q200 Automotive, Boardflex Sensitive 250V - Surface Mount, MLCC - 2220 (5750 Metric) 0.110" (2.80mm) 0.224" L x 0.197" W (5.70mm x 5.00mm) -
C5750X7R1E476M230KB

C5750X7R1E476M230KB

CAP CER 47UF 25V X7R 2220

TDK Corporation

299 -
C5750X7R1E476M230KB

数据表

C Tape & Reel (TR) Active 47 µF ±20% X7R -55°C ~ 125°C Low ESL - - General Purpose 25V - Surface Mount, MLCC - 2220 (5750 Metric) 0.098" (2.50mm) 0.224" L x 0.197" W (5.70mm x 5.00mm) -
C2012X6S0G226M085AC

C2012X6S0G226M085AC

CAP CER 22UF 4V X6S 0805

TDK Corporation

10,750 -
C2012X6S0G226M085AC

数据表

C Tape & Reel (TR) Not For New Designs 22 µF ±20% X6S -55°C ~ 105°C Low ESL - - General Purpose 4V - Surface Mount, MLCC - 0805 (2012 Metric) 0.039" (1.00mm) 0.079" L x 0.049" W (2.00mm x 1.25mm) -
C2012X6S1H335M125AC

C2012X6S1H335M125AC

CAP CER 3.3UF 50V X6S 0805

TDK Corporation

9,827 -
C2012X6S1H335M125AC

数据表

C Tape & Reel (TR) Not For New Designs 3.3 µF ±20% X6S -55°C ~ 105°C Low ESL - - General Purpose 50V - Surface Mount, MLCC - 0805 (2012 Metric) 0.057" (1.45mm) 0.079" L x 0.049" W (2.00mm x 1.25mm) -
CKG57NX7T2E335M500JH

CKG57NX7T2E335M500JH

CAP CER 3.3UF 250V X7T SMD

TDK Corporation

52,029 -
CKG57NX7T2E335M500JH

数据表

MEGACAP, CKG Tape & Reel (TR) Active 3.3 µF ±20% X7T -55°C ~ 125°C Low ESL (Stacked) J-Lead - SMPS Filtering, Bypass, Decoupling 250V - Surface Mount, MLCC - Stacked SMD, 2 J-Lead 0.217" (5.50mm) 0.236" L x 0.197" W (6.00mm x 5.00mm) -
CKG57NX7T2W225M500JH

CKG57NX7T2W225M500JH

CAP CER 2.2UF 450V X7T SMD

TDK Corporation

32,679 -
CKG57NX7T2W225M500JH

数据表

MEGACAP, CKG Tape & Reel (TR) Active 2.2 µF ±20% X7T -55°C ~ 125°C Low ESL (Stacked) J-Lead - SMPS Filtering, Bypass, Decoupling 450V - Surface Mount, MLCC - Stacked SMD, 2 J-Lead 0.217" (5.50mm) 0.236" L x 0.197" W (6.00mm x 5.00mm) -
CKG57NX7R2E225M500JH

CKG57NX7R2E225M500JH

CAP CER 2.2UF 250V X7R SMD

TDK Corporation

17,249 -
CKG57NX7R2E225M500JH

数据表

MEGACAP, CKG Tape & Reel (TR) Active 2.2 µF ±20% X7R -55°C ~ 125°C Low ESL (Stacked) J-Lead - SMPS Filtering, Bypass, Decoupling 250V - Surface Mount, MLCC - Stacked SMD, 2 J-Lead 0.217" (5.50mm) 0.236" L x 0.197" W (6.00mm x 5.00mm) -
CKG57NX7T2J105M500JH

CKG57NX7T2J105M500JH

CAP CER 1UF 630V X7T SMD

TDK Corporation

7,680 -
CKG57NX7T2J105M500JH

数据表

MEGACAP, CKG Tape & Reel (TR) Active 1 µF ±20% X7T -55°C ~ 125°C Low ESL (Stacked) J-Lead - SMPS Filtering, Bypass, Decoupling 630V - Surface Mount, MLCC - Stacked SMD, 2 J-Lead 0.217" (5.50mm) 0.236" L x 0.197" W (6.00mm x 5.00mm) -
CKG57NX7S1E476M500JH

CKG57NX7S1E476M500JH

CAP CER 47UF 25V X7S SMD

TDK Corporation

4,751 -
CKG57NX7S1E476M500JH

数据表

MEGACAP, CKG Tape & Reel (TR) Active 47 µF ±20% X7S -55°C ~ 125°C Low ESL (Stacked) J-Lead - SMPS Filtering, Bypass, Decoupling 25V - Surface Mount, MLCC - Stacked SMD, 2 J-Lead 0.217" (5.50mm) 0.236" L x 0.197" W (6.00mm x 5.00mm) -
CKG57NX7R1H106M500JH

CKG57NX7R1H106M500JH

CAP CER 10UF 50V X7R SMD

TDK Corporation

3,793 -
CKG57NX7R1H106M500JH

数据表

MEGACAP, CKG Tape & Reel (TR) Active 10 µF ±20% X7R -55°C ~ 125°C Low ESL (Stacked) J-Lead - SMPS Filtering, Bypass, Decoupling 50V - Surface Mount, MLCC - Stacked SMD, 2 J-Lead 0.217" (5.50mm) 0.236" L x 0.197" W (6.00mm x 5.00mm) -
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