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陶瓷电容器

制造商 系列 包装 产品状态 电容 容差 温度系数 工作温度 特性 引线样式 额定值 应用 额定电压 失效率 安装类型 引线间距 封装/外壳 厚度(最大值) 尺寸 / 尺寸 高度 - 安装后(最大值)

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 电容 容差 温度系数 工作温度 特性 引线样式 额定值 应用 额定电压 失效率 安装类型 引线间距 封装/外壳 厚度(最大值) 尺寸 / 尺寸 高度 - 安装后(最大值)
CKG57NX7S1H226M500JH

CKG57NX7S1H226M500JH

CAP CER 22UF 50V X7S SMD

TDK Corporation

14,229 -
CKG57NX7S1H226M500JH

数据表

MEGACAP, CKG Tape & Reel (TR) Active 22 µF ±20% X7S -55°C ~ 125°C Low ESL (Stacked) J-Lead - SMPS Filtering, Bypass, Decoupling 50V - Surface Mount, MLCC - Stacked SMD, 2 J-Lead 0.217" (5.50mm) 0.236" L x 0.197" W (6.00mm x 5.00mm) -
CKG57NX7S1C107M500JH

CKG57NX7S1C107M500JH

CAP CER 100UF 16V X7S SMD

TDK Corporation

13,604 -
CKG57NX7S1C107M500JH

数据表

MEGACAP, CKG Tape & Reel (TR) Active 100 µF ±20% X7S -55°C ~ 125°C Low ESL (Stacked) J-Lead - SMPS Filtering, Bypass, Decoupling 16V - Surface Mount, MLCC - Stacked SMD, 2 J-Lead 0.217" (5.50mm) 0.236" L x 0.197" W (6.00mm x 5.00mm) -
CKG57NX7R2A106M500JH

CKG57NX7R2A106M500JH

CAP CER 10UF 100V X7R SMD

TDK Corporation

25,460 -
CKG57NX7R2A106M500JH

数据表

MEGACAP, CKG Tape & Reel (TR) Active 10 µF ±20% X7R -55°C ~ 125°C Low ESL (Stacked) J-Lead - SMPS Filtering, Bypass, Decoupling 100V - Surface Mount, MLCC - Stacked SMD, 2 J-Lead 0.217" (5.50mm) 0.236" L x 0.197" W (6.00mm x 5.00mm) -
C3225C0G2A333J200AA

C3225C0G2A333J200AA

CAP CER 0.033UF 100V C0G 1210

TDK Corporation

1,193 -
C3225C0G2A333J200AA

数据表

C Tape & Reel (TR) Active 0.033 µF ±5% C0G, NP0 -55°C ~ 125°C - - - General Purpose 100V - Surface Mount, MLCC - 1210 (3225 Metric) 0.087" (2.20mm) 0.126" L x 0.098" W (3.20mm x 2.50mm) -
C5750X7T2E225M250KE

C5750X7T2E225M250KE

CAP CER 2.2UF 250V X7T 2220

TDK Corporation

40,060 -
C5750X7T2E225M250KE

数据表

C Tape & Reel (TR) Not For New Designs 2.2 µF ±20% X7T -55°C ~ 125°C Soft Termination - - Boardflex Sensitive 250V - Surface Mount, MLCC - 2220 (5750 Metric) 0.110" (2.80mm) 0.224" L x 0.197" W (5.70mm x 5.00mm) -
C5750X7T2E225K250KE

C5750X7T2E225K250KE

CAP CER 2.2UF 250V X7T 2220

TDK Corporation

39,811 -
C5750X7T2E225K250KE

数据表

C Tape & Reel (TR) Active 2.2 µF ±10% X7T -55°C ~ 125°C Soft Termination - - Boardflex Sensitive 250V - Surface Mount, MLCC - 2220 (5750 Metric) 0.110" (2.80mm) 0.224" L x 0.197" W (5.70mm x 5.00mm) -
CGA9P1X7T2J474K250KE

CGA9P1X7T2J474K250KE

CAP CER 0.47UF 630V X7T 2220

TDK Corporation

33,015 -
CGA9P1X7T2J474K250KE

数据表

CGA Tape & Reel (TR) Active 0.47 µF ±10% X7T -55°C ~ 125°C Soft Termination - AEC-Q200 Automotive, Boardflex Sensitive 630V - Surface Mount, MLCC - 2220 (5750 Metric) 0.110" (2.80mm) 0.224" L x 0.197" W (5.70mm x 5.00mm) -
CGA9P1X7T2J474M250KE

CGA9P1X7T2J474M250KE

CAP CER 0.47UF 630V X7T 2220

TDK Corporation

430 -
CGA9P1X7T2J474M250KE

数据表

CGA Tape & Reel (TR) Active 0.47 µF ±20% X7T -55°C ~ 125°C Soft Termination - AEC-Q200 Automotive, Boardflex Sensitive 630V - Surface Mount, MLCC - 2220 (5750 Metric) 0.110" (2.80mm) 0.224" L x 0.197" W (5.70mm x 5.00mm) -
CKG57KX7S2A156M335JH

CKG57KX7S2A156M335JH

CAP CER 15UF 100V X7S SMD

TDK Corporation

4,972 -
CKG57KX7S2A156M335JH

数据表

MEGACAP, CKG Tape & Reel (TR) Active 15 µF ±20% X7S -55°C ~ 125°C Low ESL J-Lead - SMPS Filtering, Bypass, Decoupling 100V - Surface Mount, MLCC - SMD, J-Lead 0.138" (3.50mm) 0.236" L x 0.197" W (6.00mm x 5.00mm) -
C3216X6S1E106K160AB

C3216X6S1E106K160AB

CAP CER 10UF 25V X6S 1206

TDK Corporation

27,695 -
C3216X6S1E106K160AB

数据表

C Tape & Reel (TR) Not For New Designs 10 µF ±10% X6S -55°C ~ 105°C Low ESL - - General Purpose 25V - Surface Mount, MLCC - 1206 (3216 Metric) 0.071" (1.80mm) 0.126" L x 0.063" W (3.20mm x 1.60mm) -
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