富聪科技订单满¥1000免运费
关注我们:

散热器

制造商 系列 包装 产品状态 类型 冷却封装 形状 长度 宽度 直径 Fin 高度 附件方式 功耗 @ 温升 热阻 @ 强制气流 热阻 @ 自然对流 材质 材料表面处理

全部重置
全部应用
结果
图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 冷却封装 形状 长度 宽度 直径 Fin 高度 附件方式 功耗 @ 温升 热阻 @ 强制气流 热阻 @ 自然对流 材质 材料表面处理
ATS-X51400K-C1-R0

ATS-X51400K-C1-R0

MAXIFLOW 39.25X39.25X14.5MM T766

Advanced Thermal Solutions Inc.

115 -
ATS-X51400K-C1-R0

数据表

maxiFLOW, superGRIP™ Bulk Active Top Mount BGA Square, Angled Fins 1.575" (40.00mm) 1.575" (40.00mm) - 0.571" (14.50mm) Clip, Thermal Material - 2.50°C/W @ 200 LFM - Aluminum Blue Anodized
ATS-X51425K-C1-R0

ATS-X51425K-C1-R0

MAXIFLOW 41.75X41.75X14.5MM T766

Advanced Thermal Solutions Inc.

125 -
ATS-X51425K-C1-R0

数据表

- Bulk Active - - - - - - - - - - - - -
ATS-X53450R-C1-R0

ATS-X53450R-C1-R0

STR FIN 44.25X44.25X19.5MM T766

Advanced Thermal Solutions Inc.

125 -
ATS-X53450R-C1-R0

数据表

- Bulk Active - - - - - - - - - - - - -
4-1542005-0

4-1542005-0

HEAT SINK BGA 25MM 7FIN RADIAL

TE Connectivity AMP Connectors

257 -
4-1542005-0

数据表

- Box Active - BGA Cylindrical - - 1.375" (34.92mm) OD 0.894" (22.71mm) Clip - 3.80°C/W @ 200 LFM 10.50°C/W Aluminum Black Anodized
DHS-B10670-04A

DHS-B10670-04A

HEATSINK ASSY LGA2011 NARROW

Delta Electronics

288 -
DHS-B10670-04A

数据表

- Box Not For New Designs Board Level LGA Rectangular, Fins 4.173" (106.00mm) 2.756" (70.00mm) - 1.004" (25.50mm) Bolt On - - 0.26°C/W Aluminum -
127791

127791

5.64" WIDE X 36" MULTI CHANNEL 7

Wakefield-Vette

154 -
127791

数据表

- Box Active Top Mount, Extrusion - Rectangular, Fins 36.000" (914.40mm) 5.640" (143.26mm) - 1.000" (25.40mm) Adhesive - - 0.57°C/W Aluminum -
127761

127761

5.86" X 36" FLATBACK HEATSINK 14

Wakefield-Vette

30 -
127761

数据表

- Box Active Top Mount, Extrusion - Rectangular, Fins 36.000" (914.40mm) 5.860" (148.84mm) - 2.000" (50.80mm) Adhesive - - 0.28°C/W Aluminum -
127757

127757

4.461" WIDE X 36" FLATBACK HEATS

Wakefield-Vette

46 -
127757

数据表

- Box Active Top Mount, Extrusion - Rectangular, Fins 36.000" (914.40mm) 4.461" (113.31mm) - 1.310" (33.27mm) Adhesive - - 0.45°C/W Aluminum -
127689

127689

3.375" X 12" H STYLE HEATSINK 17

Wakefield-Vette

52 -
127689

数据表

- Box Active Board Level, Extrusion - Rectangular, Fins 12.000" (304.80mm) 3.750" (95.25mm) - 9.000" (228.60mm) Bolt On - - 0.15°C/W Aluminum -
ATS-UC-NF-201

ATS-UC-NF-201

CPU HEAT SINK NO FAN COPPER

Advanced Thermal Solutions Inc.

105 -
ATS-UC-NF-201

数据表

- Box Active Top Mount, Skived Intel LGA2011 & LGA2066 CPU Cooler Square, Fins 3.543" (90.00mm) 3.543" (90.00mm) - 1.102" (28.00mm) Push Pin - - - Copper Nickel
ATS-UC-QFLOW-200

ATS-UC-QFLOW-200

QUADFLOW HEATSINK 1U CU FINS

Advanced Thermal Solutions Inc.

99 -
ATS-UC-QFLOW-200

数据表

quadFLOW™ Box Active Top Mount, Zipper Fin Intel LGA2011 & LGA2066 CPU Cooler Square, Fins 3.637" (92.38mm) 3.626" (92.11mm) - 1.142" (29.00mm) Push Pin - - - Copper Nickel
127779

127779

11.42" WIDE X 36" FLATBACK HEAT

Wakefield-Vette

26 -
127779

数据表

- Box Active Top Mount, Extrusion - Rectangular, Fins 36.000" (914.40mm) 11.420" (290.07mm) - 2.559" (65.00mm) Adhesive - - 0.19°C/W Aluminum -
262-75ABE375

262-75ABE375

HEATSINK VERT/HORIZ TO-220

Wakefield-Vette

4,580 -
262-75ABE375

数据表

262 Bulk Active Board Level, Vertical TO-220 Rectangular, Fins 0.750" (19.05mm) 0.570" (14.47mm) - 0.500" (12.70mm) Press Fit and PC Pin 3.0W @ 80°C 10.00°C/W @ 200 LFM 26.70°C/W Aluminum Black Anodized
ATS-PCB1032

ATS-PCB1032

HEATSINK CLIP-ON TO-220 BLK

Advanced Thermal Solutions Inc.

2,494 -
ATS-PCB1032

数据表

- Bulk Active Board Level TO-220 Rectangular, Fins 0.850" (21.59mm) 1.000" (25.40mm) - 0.500" (12.70mm) Bolt On - 9.00°C/W @ 200 LFM 20.00°C/W Aluminum Black Anodized
HSB31-212105

HSB31-212105

HEAT SINK, BGA, 21 X 21 X 5 MM

Same Sky (Formerly CUI Devices)

1,836 -
HSB31-212105

数据表

HSB Box Active Top Mount BGA Square, Pin Fins 0.827" (21.00mm) 0.827" (21.00mm) - 0.197" (5.00mm) Adhesive (Not Included) 3.0W @ 75°C 9.90°C/W @ 200 LFM 25.33°C/W Aluminum Alloy Black Anodized
650-B

650-B

HEATSINK FOR DIPS

Wakefield-Vette

8,889 -
650-B

数据表

650 Bulk Active Top Mount 14-DIP and 16-DIP Rectangular, Fins 0.250" (6.35mm) 0.740" (18.80mm) - 0.240" (6.10mm) Thermal Tape, Adhesive (Not Included) 0.5W @ 40°C 4.00°C/W @ 300 LFM - Aluminum Black Anodized
ATS-PCB1033

ATS-PCB1033

HEATSINK CLIP-ON TO-220 W/TAB

Advanced Thermal Solutions Inc.

2,269 -
ATS-PCB1033

数据表

- Bulk Active Board Level, Vertical TO-220 Rectangular, Fins 0.850" (21.59mm) 1.000" (25.40mm) - 0.500" (12.70mm) Bolt On and PC Pin - 9.00°C/W @ 200 LFM 20.00°C/W Aluminum Black Anodized
V7477Y

V7477Y

HEATSINK ALUM ANOD

Assmann WSW Components

200 -
V7477Y

数据表

- Tray Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Square, Fins 1.181" (30.00mm) 1.181" (30.00mm) - 0.500" (12.70mm) Bolt On and PC Pin - - 9.00°C/W Aluminum Black Anodized
HSB34-282811

HSB34-282811

HEAT SINK, BGA, 28 X 28 X 11.2 M

Same Sky (Formerly CUI Devices)

1,105 -
HSB34-282811

数据表

HSB Box Active Top Mount BGA Square, Pin Fins 1.102" (28.00mm) 1.102" (28.00mm) - 0.441" (11.20mm) Adhesive (Not Included) 5.0W @ 75°C 5.10°C/W @ 200 LFM 15.05°C/W Aluminum Alloy Black Anodized
630-35AB

630-35AB

HEATSINK FOR 35MM BGA

Wakefield-Vette

2,831 -
630-35AB

数据表

630 Bulk Active Top Mount BGA Square, Pin Fins 1.378" (35.00mm) 1.378" (35.00mm) - 0.350" (8.89mm) Thermal Tape, Adhesive (Not Included) - 5.00°C/W @ 500 LFM - Aluminum Black Anodized
共 122183 条记录«上一页1... 5556575859606162...6110下一页»
富聪科技

搜索

富聪科技

产品

富聪科技

电话

富聪科技

用户