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制造商 系列 包装 产品状态 类型 冷却封装 形状 长度 宽度 直径 Fin 高度 附件方式 功耗 @ 温升 热阻 @ 强制气流 热阻 @ 自然对流 材质 材料表面处理

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 冷却封装 形状 长度 宽度 直径 Fin 高度 附件方式 功耗 @ 温升 热阻 @ 强制气流 热阻 @ 自然对流 材质 材料表面处理
530102B00150G

530102B00150G

HEAT SINK 1.75" HIGH RISE TO-220

Boyd Laconia, LLC

2,671 -
530102B00150G

数据表

- Bulk Active Board Level, Vertical TO-220 Square, Fins 1.750" (44.45mm) 0.490" (12.44mm) - 1.750" (44.45mm) Clip and Board Mounts 4.0W @ 30°C 1.50°C/W @ 400 LFM 6.30°C/W Aluminum Black Anodized
531302B02500G

531302B02500G

HEATSINK TO-220 H=2.5" BLK W/PIN

Boyd Laconia, LLC

1,034 -
531302B02500G

数据表

- Bulk Active Board Level, Vertical TO-220, TO-202 Rectangular, Fins 2.500" (63.50mm) 1.375" (34.93mm) - 0.500" (12.70mm) Bolt On and PC Pin 6.0W @ 40°C 4.00°C/W @ 500 LFM 8.00°C/W Aluminum Black Anodized
6030B-TTG

6030B-TTG

THM,10594B-TT REV BB(COPPER)G

Boyd Laconia, LLC

2,395 -
6030B-TTG

数据表

- Bulk Active Board Level, Vertical TO-220 Rectangular, Fins 1.180" (29.97mm) 1.000" (25.40mm) - 0.500" (12.70mm) Bolt On and PC Pin - - - Copper Tin, Black Paint
530101B00150G

530101B00150G

HEATSINK 1.75" HI RISE TO-218

Boyd Laconia, LLC

3,446 -
530101B00150G

数据表

- Bulk Active Board Level, Vertical TO-218 Square, Fins 1.750" (44.45mm) 0.490" (12.44mm) - 1.750" (44.45mm) Clip and Board Mounts 4.0W @ 30°C 1.50°C/W @ 400 LFM 6.30°C/W Aluminum Black Anodized
7109DG

7109DG

TOP MOUNT HEATSINK .45" D2PAK

Boyd Laconia, LLC

5,401 -
7109DG

数据表

- Bag Active Top Mount TO-263 (D²Pak) Rectangular, Fins 0.763" (19.38mm) 1.000" (25.40mm) - 0.450" (11.43mm) SMD Pad 2.0W @ 30°C 3.00°C/W @ 300 LFM 11.00°C/W Copper Tin
531002B02500G

531002B02500G

HEATSINK TO-220 W/PINS 1" TALL

Boyd Laconia, LLC

584 -
531002B02500G

数据表

- Bulk Active Board Level, Vertical TO-220 Rectangular, Fins 1.000" (25.40mm) 1.375" (34.93mm) - 0.500" (12.70mm) Bolt On and PC Pin 2.0W @ 30°C 4.00°C/W @ 400 LFM 13.40°C/W Aluminum Black Anodized
593002B03400G

593002B03400G

HEATSINK TWISTED FIN TO-220

Boyd Laconia, LLC

7,169 -
593002B03400G

数据表

Channel 5900 Bulk Active Board Level, Vertical TO-220 Rectangular, Fins 1.180" (29.97mm) 0.942" (23.93mm) - 0.500" (12.70mm) Bolt On and PC Pin 1.0W @ 20°C 4.00°C/W @ 600 LFM 13.40°C/W Aluminum Black Anodized
532702B02500G

532702B02500G

HEATSINK TO-220 SOLDERPIN 50.8MM

Boyd Laconia, LLC

484 -
532702B02500G

数据表

- Bulk Active Board Level, Vertical TO-220 Rectangular, Fins 2.000" (50.80mm) 1.650" (41.91mm) - 1.000" (25.40mm) Bolt On and PC Pin 10.0W @ 50°C 2.00°C/W @ 300 LFM 4.80°C/W Aluminum Black Anodized
530001B02500G

530001B02500G

HEATSINK TO-218 10W H=2.5" BLK

Boyd Laconia, LLC

1,826 -
530001B02500G

数据表

- Bulk Active Board Level, Vertical TO-218 Rectangular, Fins 2.500" (63.50mm) 1.650" (41.91mm) - 1.000" (25.40mm) Bolt On and PC Pin 20.0W @ 60°C 2.00°C/W @ 300 LFM 8.00°C/W Aluminum Black Anodized
7023B-MTG

7023B-MTG

BOARD LEVEL HEATSINK 1.95" TO220

Boyd Laconia, LLC

1,102 -
7023B-MTG

数据表

- Bulk Active Board Level, Vertical TO-220 Rectangular, Fins 1.950" (49.53mm) 1.900" (48.26mm) - 0.950" (24.13mm) Bolt On and PC Pin 3.0W @ 20°C 2.50°C/W @ 400 LFM 4.40°C/W Aluminum Black Anodized
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