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制造商 系列 包装 产品状态 类型 冷却封装 形状 长度 宽度 直径 Fin 高度 附件方式 功耗 @ 温升 热阻 @ 强制气流 热阻 @ 自然对流 材质 材料表面处理

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 冷却封装 形状 长度 宽度 直径 Fin 高度 附件方式 功耗 @ 温升 热阻 @ 强制气流 热阻 @ 自然对流 材质 材料表面处理
AH10928V07500IE

AH10928V07500IE

ALUMINUM EXTRUSION 7.5"

Ohmite

54 -
AH10928V07500IE

数据表

HS Box Active Board Level, Vertical, Extrusion Aluminum Housed Resistor Rectangular, Fins 7.500" (190.50mm) 9.750" (247.65mm) - 2.280" (57.91mm) Bolt On - - - Aluminum Alloy Unfinished
ATS-EXL117-300-R0

ATS-EXL117-300-R0

PCIE EXTRUSION PROFILE, AL6063

Advanced Thermal Solutions Inc.

125 -
ATS-EXL117-300-R0

数据表

- Bulk Active Top Mount, Extrusion - Rectangular, Fins 11.811" (300.00mm) 9.213" (234.00mm) - 0.492" (12.50mm) Adhesive - 1.10°C/W @ 200 LFM 6.90°C/W Aluminum Degreased
122263

122263

HEATSINK 16681 PROFILE 12"

Wakefield-Vette

52 -
122263

数据表

- Box Active Top Mount, Extrusion Power Modules Rectangular, Fins 12.000" (304.80mm) 8.400" (213.36mm) - 1.400" (35.56mm) Adhesive - - - Aluminum Unfinished
127685

127685

10.08" WIDE X 12" FLATBACK HEATS

Wakefield-Vette

46 -
127685

数据表

- Box Active Top Mount, Extrusion - Rectangular, Fins 12.000" (304.80mm) 10.080" (256.03mm) - 2.905" (73.79mm) Adhesive - - 0.13°C/W Aluminum -
125431

125431

7.343WX36" EXTRUSIO 13454 XX4771

Wakefield-Vette

67 -
125431

数据表

- Box Active Top Mount, Extrusion - Rectangular, Fins 36.000" (914.40mm) 7.343" (186.51mm) - 1.312" (33.32mm) Adhesive - - 0.28°C/W Aluminum -
510-14M

510-14M

HEATSINK FOR PWR MOD/IGBT/RELAY

Wakefield-Vette

34 -
510-14M

数据表

510 Bulk Active Top Mount, Extrusion Power Modules Rectangular, Fins 14.000" (355.60mm) 7.380" (187.45mm) - 3.106" (78.89mm) Adhesive - - 0.21°C/W Aluminum -
ATS-UC-QFLOW-100

ATS-UC-QFLOW-100

QUADFLOW HEATSINK 1U AL FINS

Advanced Thermal Solutions Inc.

149 -
ATS-UC-QFLOW-100

数据表

quadFLOW™ Box Active Top Mount, Zipper Fin Intel LGA2011 & LGA2066 CPU Cooler Square, Fins 3.637" (92.38mm) 3.626" (92.11mm) - 1.142" (29.00mm) Push Pin - - - Aluminum Nickel
127688

127688

12.203" WIDE X 12" FLATBACK HEAT

Wakefield-Vette

56 -
127688

数据表

- Box Active Top Mount, Extrusion - Rectangular, Fins 12.000" (304.80mm) 12.203" (309.96mm) - 2.870" (72.90mm) Adhesive - - 0.18°C/W Aluminum -
ATS-UC-DFLOW-200

ATS-UC-DFLOW-200

DUALFLOW HEATSINK 1U CU FINS

Advanced Thermal Solutions Inc.

88 -
ATS-UC-DFLOW-200

数据表

dualFLOW™ Box Active Top Mount, Zipper Fin Intel LGA2011 & LGA2066 CPU Cooler Square, Fins 3.637" (92.38mm) 3.626" (92.11mm) - 1.142" (29.00mm) Push Pin - - - Copper Nickel
125657

125657

8.40WX36" EXTRUSION 16681

Wakefield-Vette

26 -
125657

数据表

- Box Active Top Mount, Extrusion - Rectangular, Fins 36.000" (914.40mm) 8.400" (213.36mm) - 1.400" (35.56mm) Adhesive - - - Aluminum -
ATS-EXL77-1220-R0

ATS-EXL77-1220-R0

HEATSINK AL6063 1220X120.75X16.6

Advanced Thermal Solutions Inc.

29 -
ATS-EXL77-1220-R0

数据表

- Box Active Top Mount, Extrusion - Rectangular, Fins 48.032" (1220.00mm) 4.754" (120.75mm) - 0.654" (16.60mm) Adhesive - 1.00°C/W @ 200 LFM 12.00°C/W Aluminum Degreased
ATS-UC-QFLOW-VC-200

ATS-UC-QFLOW-VC-200

QUADFLOW HEATSINK 1U VAPOR

Advanced Thermal Solutions Inc.

82 -
ATS-UC-QFLOW-VC-200

数据表

quadFLOW™ Box Active Top Mount, Zipper Fin Intel LGA2011 & LGA2066 CPU Cooler Square, Fins 3.637" (92.38mm) 3.626" (92.11mm) - 1.142" (29.00mm) Push Pin - - - Copper Nickel
125625

125625

11.811WX12" EXTRUSION 19740

Wakefield-Vette

43 -
125625

数据表

- Box Active Top Mount, Extrusion - Rectangular, Fins 12.000" (304.80mm) 11.811" (300.00mm) - 3.287" (83.49mm) Adhesive - - 0.12°C/W Aluminum -
127797

127797

7.62" WIDE X 36" FLATBACK W/MOUN

Wakefield-Vette

117 -
127797

数据表

- Box Active Top Mount, Extrusion - Rectangular, Fins 36.000" (914.40mm) 7.620" (193.55mm) - 3.075" (78.11mm) Bolt On - - 0.17°C/W Aluminum -
ATS-EXL117-1220-R0

ATS-EXL117-1220-R0

PCIE EXTRUSION PROFILE, AL6063

Advanced Thermal Solutions Inc.

30 -
ATS-EXL117-1220-R0

数据表

- Bulk Active Top Mount, Extrusion - Rectangular, Fins 48.032" (1220.00mm) 9.213" (234.00mm) - 0.492" (12.50mm) Adhesive - 1.10°C/W @ 200 LFM 6.90°C/W Aluminum Degreased
ATS-PCB1065

ATS-PCB1065

HEATSINK TO-220 CLIP-ON BLACK

Advanced Thermal Solutions Inc.

1,555 -
ATS-PCB1065

数据表

- Bulk Active Board Level TO-220 Rectangular, Fins 0.748" (19.00mm) 0.504" (12.80mm) - 0.500" (12.70mm) Clip - 10.20°C/W @ 200 LFM 27.30°C/W Aluminum Black Anodized
HSS-B20-065V-02

HSS-B20-065V-02

HEATSINK TO-220 2.9W ALUMINUM

Same Sky (Formerly CUI Devices)

1,211 -
HSS-B20-065V-02

数据表

HSS Bag Active Board Level TO-220 Rectangular, Fins 0.748" (19.00mm) 0.504" (12.80mm) - 0.500" (12.70mm) PC Pin 2.9W @ 75°C 7.24°C/W @ 200 LFM 25.92°C/W Aluminum Black Anodized
ATS-PCB1024

ATS-PCB1024

HEATSINK TO-220 BLACK

Advanced Thermal Solutions Inc.

2,581 -
ATS-PCB1024

数据表

- Bulk Active Board Level TO-220 Rectangular, Fins 1.180" (29.97mm) 1.000" (25.40mm) - 0.500" (12.70mm) Bolt On - 11.00°C/W @ 200 LFM 16.70°C/W Aluminum Black Anodized
HSS-B20-0953H-02

HSS-B20-0953H-02

HEATSINK TO-220 2.9W ALUMINUM

Same Sky (Formerly CUI Devices)

2,197 -
HSS-B20-0953H-02

数据表

HSS Bag Active Board Level, Vertical TO-220 Rectangular, Fins 0.500" (12.70mm) 0.504" (12.80mm) - 0.748" (19.00mm) PC Pin 2.9W @ 75°C 7.24°C/W @ 200 LFM 25.92°C/W Aluminum Black Anodized
HSS-B20-061H-02

HSS-B20-061H-02

HEATSINK TO-220 2.9W ALUMINUM

Same Sky (Formerly CUI Devices)

2,578 -
HSS-B20-061H-02

数据表

HSS Bag Active Board Level, Vertical TO-220 Rectangular, Fins 0.500" (12.70mm) 0.504" (12.80mm) - 0.748" (19.00mm) PC Pin 2.9W @ 75°C 7.24°C/W @ 200 LFM 25.92°C/W Aluminum Black Anodized
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