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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
110-93-640-61-105000

110-93-640-61-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-93-640-61-105000

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
ICO-640-BGG

ICO-640-BGG

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-640-BGG

数据表

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyester, Glass Filled 30.0µin (0.76µm) Brass
ICA-648-JGG

ICA-648-JGG

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-648-JGG

数据表

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyester, Glass Filled 30.0µin (0.76µm) Brass
110-93-652-61-001000

110-93-652-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-93-652-61-001000

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
28-6508-212

28-6508-212

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

0 -
28-6508-212

数据表

508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
28-6508-312

28-6508-312

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

0 -
28-6508-312

数据表

508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
714-93-164-41-001000

714-93-164-41-001000

SOCKET CARRIER SIP 64POS

Mill-Max Manufacturing Corp.

0 -
714-93-164-41-001000

数据表

714 Tube Active SIP 64 (1 x 64) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
APH-1422-G-H

APH-1422-G-H

APH-1422-G-H

Samtec Inc.

0 -
APH-1422-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0522-G-H

APH-0522-G-H

APH-0522-G-H

Samtec Inc.

0 -
APH-0522-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0622-G-H

APH-0622-G-H

APH-0622-G-H

Samtec Inc.

0 -
APH-0622-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1622-G-H

APH-1622-G-H

APH-1622-G-H

Samtec Inc.

0 -
APH-1622-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1222-G-H

APH-1222-G-H

APH-1222-G-H

Samtec Inc.

0 -
APH-1222-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1322-G-H

APH-1322-G-H

APH-1322-G-H

Samtec Inc.

0 -
APH-1322-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0822-G-H

APH-0822-G-H

APH-0822-G-H

Samtec Inc.

0 -
APH-0822-G-H

数据表

* - Active - - - - - - - - - - - - - - -
110-43-318-61-801000

110-43-318-61-801000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-43-318-61-801000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
37-0508-21

37-0508-21

CONN SOCKET SIP 37POS GOLD

Aries Electronics

0 -
37-0508-21

数据表

508 Bulk Active SIP 37 (1 x 37) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap - -55°C ~ 125°C Tin Polyamide (PA46), Nylon 4/6 200.0µin (5.08µm) Brass
37-0508-31

37-0508-31

CONN SOCKET SIP 37POS GOLD

Aries Electronics

0 -
37-0508-31

数据表

508 Bulk Active SIP 37 (1 x 37) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap - -55°C ~ 125°C Tin Polyamide (PA46), Nylon 4/6 200.0µin (5.08µm) Brass
517-83-296-19-131111

517-83-296-19-131111

CONN SOCKET PGA 296POS GOLD

Preci-Dip

0 -
517-83-296-19-131111

数据表

517 Bulk Active PGA 296 (19 x 19) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
115-93-648-61-001000

115-93-648-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
115-93-648-61-001000

数据表

115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
111-43-322-61-001000

111-43-322-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
111-43-322-61-001000

数据表

111 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
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