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硅电容器

制造商	系列	封装/外壳	包装	产品状态	电容	容差	ESR（等效串联电阻）	等效串联电感 (ESL)	应用	特性	工作温度	电压 - 击穿	高度	尺寸 / 尺寸
IPDiA MACOM Technology Solutions Microchip Technology Murata Electronics ROHM Semiconductor Skyworks Solutions Inc. Vishay Electro-Films	* - 4M 90 91 91xxxx ATSC BBEC BBSC HSSC HTSC LPSC MBC50 NC RASMID™ RFCS SC UBDC UBEC UBSC ULSC UWSC WASC WBSC WLSC XBSC XTSC	- 01005 (0402 Metric) 0201 (0603 Metric) 0202 (0505 Metric) 0303 (0808 Metric) 0402 (1005 Metric) 0504 (1210 Metric) 0505 (1313 Metric) 0605 (1513 Metric) 0805 (2012 Metric) Die Nonstandard Nonstandard Chip Nonstandard SMD	Bulk Cut Tape (CT) Tape & Reel (TR) Tray	Active Discontinued at InFortune Obsolete	- 0.022 µF 0.033 µF 0.047 µF 0.1 µF 0.2 pF 0.3 pF 0.4 pF 0.5 pF 0.6 pF 0.7 pF 0.8 pF 0.9 pF 1 pF 1 µF 1.2 pF 1.5 pF 1.8 pF 10 pF 100 pF 1000 pF 10000 pF 12 pF 15 pF 150 pF 18 pF 180 pF 2 pF 2.2 pF 2.5 pF 2.6 pF 2.7 pF 2.8 pF 20 pF 200 pF 22 pF 22.5 pF 220 pF 23 pF 24 pF 25 pF 27 pF 270 pF 2700 pF 28 pF 29 pF 3 pF 3.3 pF 3.75 pF 3.8 pF 3.9 pF 30 pF 300 pF 33 pF 333 pF 350 pF 3700 pF 39 pF 4 pF 4.7 pF 400 pF 44 pF 460 pF 47 pF 470 pF 4700 pF 48 pF 49 pF 5 pF 5.6 pF 50 pF 500 pF 51 pF 56 pF 5600 pF 6 pF 6.8 pF 68 pF 75 pF 8 pF 8.2 pF 80 pF 82 pF 88 pF 9.9 pF 91 pF 99 pF	- ±0.1pF ±10% ±15% ±2.5% ±20% ±5%	- 14 mOhms 220 mOhms 30 mOhms 300 mOhms 400 mOhms 50 mOhms 500 mOhms	- 100pH 20pH 50pH 6pH	- High Stability High Stability, High Temperature, Wirebond and Embedded High Stability, Vertical Silicon Cap, Wirebond High Stability, Wirebond and Embedded High Temperature	- High Reliability High Reliability, Low Profile Low Profile	- -55°C ~ 125°C -55°C ~ 150°C -55°C ~ 200°C -55°C ~ 250°C -65°C ~ 200°C	- 10 V 100 V 11 V 150 V 16 V 200 V 25 V 30 V 50 V	- 0.004" (0.10mm) 0.005" (0.12mm) 0.005" (0.13mm) 0.006" (0.14mm) 0.006" (0.15mm) 0.007" (0.18mm) 0.008" (0.20mm) 0.010" (0.25mm) 0.011" (0.27mm) 0.012" (0.30mm) 0.016" (0.41mm) 0.017" (0.44mm) 0.179" (4.55mm)	- 0.010" L x 0.010" W (0.25mm x 0.25mm) 0.012" L x 0.012" W (0.29mm x 0.29mm) 0.012" L x 0.012" W (0.30mm x 0.30mm) 0.015" L x 0.015" W (0.38mm x 0.38mm) 0.016" L x 0.008" W (0.40mm x 0.20mm) 0.018" L x 0.018" W (0.46mm x 0.46mm) 0.019" L x 0.019" W (0.50mm x 0.50mm) 0.020" L x 0.010" W (0.50mm x 0.25mm) 0.020" L x 0.020" W (0.50mm x 0.50mm) 0.020" L x 0.020" W (0.51mm x 0.51mm) 0.020" L x 0.049" W (0.50mm x 1.25mm) 0.020" L x 0.064" W (0.50mm x 1.63mm) 0.020" L x 0.079" W (0.50mm x 2.00mm) 0.021" L x 0.021" W (0.55mm x 0.55mm) 0.022" L x 0.022" W (0.56mm x 0.56mm) 0.024" L x 0.012" W (0.60mm x 0.30mm) 0.025" L x 0.025" W (0.63mm x 0.63mm) 0.030" L x 0.030" W (0.76mm x 0.76mm) 0.031" L x 0.024" W (0.80mm x 0.60mm) 0.031" L x 0.031" W (0.80mm x 0.80mm) 0.032" L x 0.032" W (0.83mm x 0.83mm) 0.039" L x 0.020" W (1.00mm x 0.50mm) 0.040" L x 0.020" W (1.02mm x 0.51mm) 0.040" L x 0.040" W (1.02mm x 1.02mm) 0.047" L x 0.028" W (1.20mm x 0.70mm) 0.049" L x 0.039" W (1.25mm x 1.00mm) 0.050" L x 0.050" W (1.27mm x 1.27mm) 0.052" L x 0.052" W (1.32mm x 1.32mm) 0.055" L x 0.036" W (1.40mm x 0.91mm) 0.063" L x 0.052" W (1.59mm x 1.32mm) 0.068" L x 0.068" W (1.73mm x 1.73mm) 0.087" L x 0.055" W (2.20mm x 1.40mm) 1.417" L x 0.512" W (36.00mm x 13.00mm) 2.461" L x 1.772" W (62.50mm x 45.00mm)

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结果

图片厂商料号库存情况价格数量数据表系列封装/外壳包装产品状态电容容差 ESR（等效串联电阻）等效串联电感 (ESL) 应用特性工作温度电压 - 击穿高度尺寸 / 尺寸

GC84300-00

GC84300-00

SI CAPACITOR NON HERMETIC CHIP

Microchip Technology

7,082

-

询价单

数据表

-

Nonstandard SMD

Tray

Active

300 pF

±10%

-

-

-

-

-55°C ~ 150°C

100 V

0.007" (0.18mm)

0.050" L x 0.050" W (1.27mm x 1.27mm)

GC84100-00

GC84100-00

SI CAPACITOR NON HERMETIC CHIP

Microchip Technology

9,989

-

询价单

数据表

-

Nonstandard SMD

Tray

Active

100 pF

±10%

-

-

-

-

-55°C ~ 150°C

100 V

0.007" (0.18mm)

0.030" L x 0.030" W (0.76mm x 0.76mm)

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