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RFI 和 EMI - 接触件、弹性条和垫圈

制造商 系列 包装 产品状态 类型 形状 长度 高度 材质 电镀 电镀 - 厚度 宽度 附件方式 工作温度

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 形状 长度 高度 材质 电镀 电镀 - 厚度 宽度 附件方式 工作温度
8409016854

8409016854

RFI GASKET BECU

Laird Technologies EMI

0 -
8409016854

数据表

Electronit Bulk Active Gasket Rectangle - 0.283" (7.20mm) Beryllium Copper - - 1.035" (26.30mm) - -31°C ~ 100°C
4096PAX1R03937

4096PAX1R03937

RFI FOF GASKET PU ADH

Laird Technologies EMI

0 -
4096PAX1R03937

数据表

EcoTemp™ 85 X1R Bulk Active Fabric Over Foam Rectangle 39.370" (1.00m) 0.080" (2.03mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - 0.275" (6.99mm) Adhesive -40°C ~ 85°C
4295PAX1R03937

4295PAX1R03937

RFI FOF GASKET PU ADH

Laird Technologies EMI

0 -
4295PAX1R03937

数据表

EcoTemp™ 85 X1R Bulk Active Fabric Over Foam D-Shape 39.370" (1.00m) 0.170" (4.32mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - 0.250" (6.35mm) Adhesive -40°C ~ 85°C
0C97043817

0C97043817

RFI FINGERSTOCK BECU TIN HARDWR

Laird Technologies EMI

0 -
0C97043817

数据表

Large Enclosure Bulk Active Fingerstock - 25.00' (7.60m) 0.250" (6.35mm) Beryllium Copper Tin 299.99µin (7.62µm) 1.090" (27.69mm) Hardware, Rivet, Solder 121°C
0C97043819

0C97043819

RFI FINGERSTOCK BECU NICK HARDWR

Laird Technologies EMI

0 -
0C97043819

数据表

Large Enclosure Bulk Active Fingerstock - 25.00' (7.60m) 0.250" (6.35mm) Beryllium Copper Nickel 299.99µin (7.62µm) 1.090" (27.69mm) Hardware, Rivet, Solder 121°C
4105PA51H03937

4105PA51H03937

RFI FOF GASKET PU ADH

Laird Technologies EMI

0 -
4105PA51H03937

数据表

51H Bulk Active Fabric Over Foam D-Shape 39.370" (1.00m) 0.375" (9.53mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - 0.500" (12.70mm) Adhesive -40°C ~ 70°C
4788PAX1R03937

4788PAX1R03937

RFI FOF GASKET PU ADH

Laird Technologies EMI

0 -
4788PAX1R03937

数据表

EcoTemp™ 85 X1R Bulk Active Fabric Over Foam Rectangle 39.370" (1.00m) 0.125" (3.18mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - 0.250" (6.35mm) Adhesive -40°C ~ 85°C
8011-2007

8011-2007

ECMR,NEOSP,MON,RL 11.1MM

Laird Technologies EMI

0 -
8011-2007

数据表

- Bulk Active - - - - - - - - - -
4206PA51H03937

4206PA51H03937

RFI FOF GASKET PU ADH

Laird Technologies EMI

0 -
4206PA51H03937

数据表

51H Bulk Active Fabric Over Foam Square 39.370" (1.00m) 0.395" (10.03mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - 0.395" (10.03mm) Adhesive -40°C ~ 70°C
0C97052019

0C97052019

RFI FINGERSTOCK BECU NICKEL ADH

Laird Technologies EMI

0 -
0C97052019

数据表

All-Purpose Bulk Active Fingerstock - 16.000" (406.40mm) 0.140" (3.56mm) Beryllium Copper Nickel 299.21µin (7.60µm) 0.370" (9.40mm) Adhesive 121°C
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