富聪科技订单满¥1000免运费
关注我们:

RFI 和 EMI - 接触件、弹性条和垫圈

制造商 系列 包装 产品状态 类型 形状 长度 高度 材质 电镀 电镀 - 厚度 宽度 附件方式 工作温度

全部重置
全部应用
结果
图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 形状 长度 高度 材质 电镀 电镀 - 厚度 宽度 附件方式 工作温度
0098054002

0098054002

RFI FINGERSTOCK BECU ADH

Laird Technologies EMI

0 -
0098054002

数据表

Ultrasoft All-Purpose Bulk Active Fingerstock - 16.000" (406.40mm) 0.110" (2.79mm) Beryllium Copper - - 0.280" (7.11mm) Adhesive 121°C
0097054017

0097054017

RFI FINGERSTOCK BECU TIN ADH

Laird Technologies EMI

0 -
0097054017

数据表

All-Purpose Bulk Active Fingerstock - 15.984" (406.00mm) 0.110" (2.79mm) Beryllium Copper Tin 299.99µin (7.62µm) 0.280" (7.11mm) Adhesive 121°C
4520AC51K09600

4520AC51K09600

RFI FOF GASKET PU

Laird Technologies EMI

0 -
4520AC51K09600

数据表

51K Bulk Active Fabric Over Foam Square 96.000" (2.44m) 2.000" (50.80mm) Polyurethane Foam, Nickel-Copper Polyester (NI/CU) - - 2.000" (50.80mm) - -
25-78FS-BD-85.875-NTP

25-78FS-BD-85.875-NTP

RFI FINGERSTOCK BECU UNPLAT ADH

Leader Tech Inc.

0 -
25-78FS-BD-85.875-NTP

数据表

- Bulk Active Fingerstock - 85.920" (2.18m) 0.250" (6.35mm) Beryllium Copper Unplated - 0.780" (19.81mm) Adhesive -55°C ~ 121°C
0078007217

0078007217

RFI FINGERSTOCK BECU TIN SLOT

Laird Technologies EMI

0 -
0078007217

数据表

Ultrasoft Hook-on Bulk Active Fingerstock - 16.200" (411.48mm) 0.152" (3.86mm) Beryllium Copper Tin 299.21µin (7.60µm) 0.600" (15.24mm) Slot 121°C
4688PA51H09600

4688PA51H09600

RFI FOF GASKET PU ADH

Laird Technologies EMI

0 -
4688PA51H09600

数据表

51H Bulk Active Fabric Over Foam Rectangle 96.000" (2.44m) 0.079" (2.00mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - 0.118" (3.00mm) Adhesive -
37-131-1007-09600

37-131-1007-09600

RFI FOF GASKET NI/CU NICKEL ADH

Parker Chomerics

0 -
37-131-1007-09600

数据表

SOFT-SHIELD® 3700 Box Active Fabric Over Foam Rectangle 8.00' (2.44m) 0.075" (1.91mm) Nickel-Copper Polyester (NI/CU) Nickel - 1.614" (41.00mm) Adhesive -40°C ~ 125°C
0097054219

0097054219

RFI FINGERSTOCK BECU NICKEL ADH

Laird Technologies EMI

0 -
0097054219

数据表

Foldover Bulk Active Fingerstock - 15.984" (406.00mm) 0.080" (2.03mm) Beryllium Copper Nickel 299.99µin (7.62µm) 0.250" (6.35mm) Adhesive 121°C
0097060719

0097060719

RFI FINGERSTOCK BECU NICKEL CLIP

Laird Technologies EMI

0 -
0097060719

数据表

- Bulk Active Fingerstock - 16.000" (406.40mm) 0.170" (4.32mm) Beryllium Copper Nickel 299.21µin (7.60µm) - Clip 121°C
0098053817

0098053817

AP,STR,SNB,USF,PSA/.250X.780X.37

Laird Technologies EMI

0 -
0098053817

数据表

* Bulk Active - - - - - - - - - -
0C97044017

0C97044017

RFI FINGERSTOCK BECU TIN HARDWR

Laird Technologies EMI

0 -
0C97044017

数据表

Large Enclosure Bulk Active Fingerstock - 25.00' (7.60m) 0.410" (10.41mm) Beryllium Copper Tin 299.99µin (7.62µm) 1.630" (41.40mm) Hardware, Rivet, Solder 121°C
8516-0359-56

8516-0359-56

MILCONNECTOR,MIM613 35.12X30.15X

Laird Technologies EMI

0 -
8516-0359-56

数据表

MIL Connector Bulk Active - - - - - - - - - -
8864-0110-93

8864-0110-93

RFI GASKET

Laird Technologies EMI

0 -
8864-0110-93

数据表

Electroseal™ Bulk Active Gasket Round - 0.250" (6.35mm) - - - 0.250" (6.35mm) - -
4358PA51G09600

4358PA51G09600

RFI FOF GASKET PU ADH

Laird Technologies EMI

0 -
4358PA51G09600

数据表

51G Bulk Active Fabric Over Foam D-Shape 8.00' (2.44m) 0.630" (16.00mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - 0.098" (2.49mm) Adhesive -40°C ~ 85°C
0098051502

0098051502

RFI FINGERSTOCK BECU ADH

Laird Technologies EMI

0 -
0098051502

数据表

Ultrasoft Foldover Bulk Active Fingerstock - 24.000" (609.60mm) 0.230" (5.84mm) Beryllium Copper - 299.21µin (7.60µm) 0.760" (19.30mm) Adhesive 121°C
4912PA51H08400

4912PA51H08400

RFI FOF GASKET PU ADH

Laird Technologies EMI

0 -
4912PA51H08400

数据表

ECOGREEN™ Bulk Active Fabric Over Foam D-Shape 7.00' (2.13m) 0.090" (2.29mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - 0.150" (3.81mm) Adhesive -40°C ~ 70°C
13-30RH-SN-0.356

13-30RH-SN-0.356

RFI FINGERSTOCK BECU TIN ADH

Leader Tech Inc.

0 -
13-30RH-SN-0.356

数据表

- Bulk Active Fingerstock - 0.356" (9.04mm) 0.130" (3.30mm) Beryllium Copper Tin Flash 0.300" (7.62mm) Adhesive -55°C ~ 121°C
3-S-23T-BD-24-NTP

3-S-23T-BD-24-NTP

RFI FINGERSTOCK BECU UNPLAT ADH

Leader Tech Inc.

0 -
3-S-23T-BD-24-NTP

数据表

- Bulk Active Fingerstock - 24.000" (609.60mm) 0.030" (0.76mm) Beryllium Copper Unplated - 0.230" (5.84mm) Adhesive -55°C ~ 121°C
7-19PCI-SS-14.6

7-19PCI-SS-14.6

RFI FINGERSTOCK BECU ADH

Leader Tech Inc.

0 -
7-19PCI-SS-14.6

数据表

- Bulk Active Fingerstock - 14.600" (370.84mm) 0.070" (1.78mm) Beryllium Copper - - 0.180" (4.57mm) Adhesive -55°C ~ 121°C
7-19PCI-SS-4.6

7-19PCI-SS-4.6

RFI FINGERSTOCK BECU ADH

Leader Tech Inc.

0 -
7-19PCI-SS-4.6

数据表

- Bulk Active Fingerstock - 4.600" (116.84mm) 0.070" (1.78mm) Beryllium Copper - - 0.180" (4.57mm) Adhesive -55°C ~ 121°C
富聪科技

搜索

富聪科技

产品

富聪科技

电话

富聪科技

用户