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| 图片 | 厂商料号 | 库存情况 | 价格 | 数量 | 数据表 | 系列 | 包装 | 产品状态 | 连接器类型 | 触点类型 | 位置数量 | 行数 | 行间距 - 配对 | 绝缘高度 | 已加载位置数 | 样式 | 配对间距 | 遮蔽 | 安装类型 | 触点总长度 | 端接方式 | 触点形状 | 触点长度 - 引脚部分 | 固定类型 | 触点长度 - 配对部分 | 触点表面处理 - 配对 | 触点表面处理厚度 - 配对部分 | 触点表面处理 - 引脚 | 触点材料 | 绝缘材料 | 特性 | 工作温度 | 电流额定值（安培） |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
T2M-125-01-L-D-TH-DSCONN HEADER VERT 50POS 2MM |
125 | - |
|
数据表 |
Tiger Eye™ T2M | Tube | Active | Header | Male Pin | 50 | 2 | 0.079" (2.00mm) | 0.228" (5.80mm) | All | Board to Board or Cable | 0.079" (2.00mm) | Shrouded - 4 Wall | Through Hole | 0.302" (7.67mm) | Solder | Square | 0.117" (2.97mm) | Push-Pull | - | Gold | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Mating Flange | 3.8A | ||
|
MTMM-102-05-G-S-215CONN HEADER VERT 2POS 2MM |
0 | - |
|
数据表 |
MTMM | Bulk | Active | Header, Cuttable | Male Pin | 2 | 1 | - | 0.059" (1.50mm) | All | Board to Board or Cable | 0.079" (2.00mm) | Unshrouded | Through Hole | 0.377" (9.58mm) | Solder | Square | 0.103" (2.62mm) | Push-Pull | 0.215" (5.46mm) | Gold | Gold | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | 3A | ||
|
|
224560-E50-PIN, VERTICAL, SMT/THR |
156 | - |
|
数据表 |
MICROSPEED | Tape & Reel (TR) | Active | Header | Male Pin | 50 | 2 | 0.059" (1.50mm) | 0.504" (12.80mm) | All | Board to Cable/Wire | 0.039" (1.00mm) | Shrouded - 4 Wall | Surface Mount, Through Hole | - | Solder | Square | 0.047" (1.20mm) | Latch Holder | 0.114" (2.90mm) | Gold | Tin | Copper Alloy | Liquid Crystal Polymer (LCP) | Board Guide, Pick and Place | 1A | ||
|
825433-5CONN HEADER VERT 5POS 2.54MM |
22,792 | - |
|
数据表 |
AMPMODU Mod II | Bulk | Active | Header, Breakaway | Male Pin | 5 | 1 | - | 0.110" (2.79mm) | All | Board to Board or Cable | 0.100" (2.54mm) | Unshrouded | Through Hole | 0.500" (12.70mm) | Solder | Square | 0.126" (3.20mm) | Push-Pull | 0.264" (6.70mm) | Gold | Tin | Brass | Polybutylene Terephthalate (PBT) | - | 5A | ||
|
|
HMTSW-103-09-TM-D-430-RACONN HEADER R/A 6POS 2.54MM |
0 | - |
|
数据表 |
Flex Stack, HMTSW | Bulk | Active | Header | Male Pin | 6 | 2 | 0.100" (2.54mm) | 0.240" (6.10mm) | All | Board to Board or Cable | 0.100" (2.54mm) | Unshrouded | Through Hole, Right Angle | - | Solder | Square | - | Push-Pull | 0.430" (10.92mm) | Tin | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | 3A | ||
|
|
HMTSW-104-08-G-S-350CONN HEADER VERT 4POS 2.54MM |
0 | - |
|
数据表 |
Flex Stack, HMTSW | Bulk | Active | Header | Male Pin | 4 | 1 | - | 0.100" (2.54mm) | All | Board to Board or Cable | 0.100" (2.54mm) | Unshrouded | Through Hole | 0.530" (13.46mm) | Solder | Square | 0.080" (2.03mm) | Push-Pull | 0.350" (8.89mm) | Gold | Gold | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | 3A | ||
|
5-146276-2CONN HEADER VERT 2POS 2.54MM |
20,898 | - |
|
数据表 |
AMPMODU Mod II | Bulk | Active | Header, Breakaway | Male Pin | 2 | 1 | - | 0.090" (2.29mm) | All | Board to Board or Cable | 0.100" (2.54mm) | Unshrouded | Through Hole | 0.533" (13.55mm) | Solder | Square | 0.125" (3.18mm) | Push-Pull | 0.318" (8.08mm) | Gold | Tin | Copper Alloy | Liquid Crystal Polymer (LCP) | - | 3A | ||
|
|
HMTSW-104-23-G-S-237CONN HEADER VERT 4POS 2.54MM |
0 | - |
|
数据表 |
Flex Stack, HMTSW | Bulk | Active | Header | Male Pin | 4 | 1 | - | 0.100" (2.54mm) | All | Board to Board or Cable | 0.100" (2.54mm) | Unshrouded | Through Hole | 0.445" (11.30mm) | Solder | Square | 0.108" (2.75mm) | Push-Pull | 0.237" (6.02mm) | Gold | Gold | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | 3A | ||
|
|
HMTSW-107-07-T-S-080-RACONN HEADER R/A 7POS 2.54MM |
0 | - |
|
数据表 |
Flex Stack, HMTSW | Bulk | Active | Header | Male Pin | 7 | 1 | - | 0.122" (3.10mm) | All | Board to Board or Cable | 0.100" (2.54mm) | Unshrouded | Through Hole, Right Angle | - | Solder | Square | - | Push-Pull | 0.080" (2.03mm) | Tin | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | 3A | ||
|
0022102031CONN HEADER VERT 3POS 2.54MM |
19,509 | - |
|
数据表 |
KK254, 4030 | Bulk | Active | Header | Male Pin | 3 | 1 | - | 0.130" (3.30mm) | All | Board to Board or Cable | 0.100" (2.54mm) | Unshrouded | Through Hole | 0.560" (14.22mm) | Solder | Square | 0.135" (3.43mm) | Push-Pull | 0.295" (7.49mm) | Gold | Tin | - | Polyamide (PA), Nylon | - | - | ||
|
|
HMTSW-107-07-T-S-100-RACONN HEADER R/A 7POS 2.54MM |
0 | - |
|
数据表 |
Flex Stack, HMTSW | Bulk | Active | Header | Male Pin | 7 | 1 | - | 0.122" (3.10mm) | All | Board to Board or Cable | 0.100" (2.54mm) | Unshrouded | Through Hole, Right Angle | - | Solder | Square | - | Push-Pull | 0.100" (2.54mm) | Tin | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | 3A | ||
|
|
HMTSW-107-07-T-S-130-RACONN HEADER R/A 7POS 2.54MM |
0 | - |
|
数据表 |
Flex Stack, HMTSW | Bulk | Active | Header | Male Pin | 7 | 1 | - | 0.122" (3.10mm) | All | Board to Board or Cable | 0.100" (2.54mm) | Unshrouded | Through Hole, Right Angle | - | Solder | Square | - | Push-Pull | 0.130" (3.30mm) | Tin | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | 3A | ||
|
|
DF51K-10DP-2DSA(800)CONN HDR 2MM DUAL TIN PCB 10POS |
8,615 | - |
|
数据表 |
SignalBee™ DF51K | Bulk | Active | Header | Male Pin | 10 | 2 | 0.079" (2.00mm) | 0.331" (8.40mm) | All | Board to Cable/Wire | 0.079" (2.00mm) | Shrouded - 4 Wall | Through Hole | - | Solder | Square | 0.118" (3.00mm) | Latch Holder | - | Tin | Tin | Brass | Polybutylene Terephthalate (PBT), Glass Filled | - | Varies by Wire Gauge | ||
|
|
MTLW-103-07-L-S-195CONN HEADER VERT 3POS 2.54MM |
0 | - |
|
数据表 |
Flex Stack, MTLW | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
|
1586037-2CONN HEADER VERT 2POS |
17,188 | - |
|
数据表 |
VAL-U-LOK | Bulk | Active | Header | Male Pin | 2 | 1 | - | 0.504" (12.80mm) | All | Board to Cable/Wire | - | Shrouded - 4 Wall | Through Hole | - | Solder | Square | 0.138" (3.50mm) | Locking Ramp | - | Tin | Tin | Brass Alloy | Polyamide (PA), Nylon | - | 9A | ||
|
|
FWJ-02-02-T-SCONN HEADER VERT 2POS 3.96MM |
0 | - |
|
数据表 |
FWJ | Bulk | Active | Header | Male Pin | 2 | 1 | - | 0.125" (3.18mm) | All | Board to Board | 0.156" (3.96mm) | Unshrouded | Through Hole | 0.800" (20.32mm) | Solder | Square | 0.175" (4.45mm) | Push-Pull | 0.500" (12.70mm) | Tin | Tin | Phosphor Bronze | Polybutylene Terephthalate (PBT) | - | - | ||
|
|
HMTSW-104-08-G-S-270.100" HIGH-TEMP VARIABLE POST HE |
0 | - |
|
数据表 |
Flex Stack, HMTSW | Bulk | Active | Header | Male Pin | 4 | 1 | - | 0.100" (2.54mm) | All | Board to Board or Cable | 0.100" (2.54mm) | Unshrouded | Through Hole | 0.530" (13.46mm) | Solder | Square | 0.160" (4.06mm) | Push-Pull | 0.270" (6.86mm) | Gold | Gold | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | 3A | ||
|
|
B5P-VH-FB-BCONN HEADER VERT 5POS 3.96MM |
16,318 | - |
|
数据表 |
VH | Bulk | Active | Header | Male Pin | 5 | 1 | - | 0.433" (11.00mm) | All | Board to Cable/Wire | 0.156" (3.96mm) | Shrouded - 4 Wall | Through Hole | - | Solder | Square | 0.146" (3.70mm) | Locking Ramp | - | Tin | Tin | Copper Alloy | Polybutylene Terephthalate (PBT), Glass Filled | Board Guide | 10A | ||
|
|
HTMS-102-01-G-S-SMCONN HDR .050" 10POS |
0 | - |
|
数据表 |
HTMS | Bulk | Active | Header | Male Pin | 2 | 1 | - | 0.100" (2.54mm) | All | Board to Board | 0.050" (1.27mm) | Unshrouded | Surface Mount | - | Solder | Square | - | Push-Pull | 0.230" (5.84mm) | Gold | Gold | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | 5A per Contact | ||
|
|
HTSW-108-09-T-S-RECONN HEADER R/A 8POS 2.54MM |
0 | - |
|
数据表 |
HTSW | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
