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制造商 系列 包装 产品状态 连接器类型 触点类型 位置数量 行数 行间距 - 配对 绝缘高度 已加载位置数 样式 配对间距 遮蔽 安装类型 触点总长度 端接方式 触点形状 触点长度 - 引脚部分 固定类型 触点长度 - 配对部分 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点表面处理 - 引脚 触点材料 绝缘材料 特性 工作温度 电流额定值(安培)

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 连接器类型 触点类型 位置数量 行数 行间距 - 配对 绝缘高度 已加载位置数 样式 配对间距 遮蔽 安装类型 触点总长度 端接方式 触点形状 触点长度 - 引脚部分 固定类型 触点长度 - 配对部分 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点表面处理 - 引脚 触点材料 绝缘材料 特性 工作温度 电流额定值(安培)
DF11-14DP-2DSA(24)

DF11-14DP-2DSA(24)

CONN HEADER VERT 14POS 2MM

Hirose Electric Co Ltd

2,787 -
DF11-14DP-2DSA(24)

数据表

DF11 Tube Active Header Male Pin 14 2 0.079" (2.00mm) 0.260" (6.60mm) All Board to Board or Cable 0.079" (2.00mm) Shrouded - 4 Wall Through Hole 0.299" (7.60mm) Solder Square 0.118" (3.00mm) Detent Lock 0.118" (3.00mm) Tin Tin Brass Polyamide (PA), Nylon - 2A
TSM-106-01-L-DV-005

TSM-106-01-L-DV-005

CONN HEADER SMD 12POS 2.54MM

Samtec Inc.

0 -
TSM-106-01-L-DV-005

数据表

TSM Tube Active Header, Cuttable Male Pin 12 2 0.100" (2.54mm) 0.100" (2.54mm) 11 Board to Board or Cable 0.100" (2.54mm) Unshrouded Surface Mount - Solder Square - Push-Pull 0.230" (5.84mm) Gold Tin Phosphor Bronze Liquid Crystal Polymer (LCP) - -
9-146274-0-06

9-146274-0-06

CONN HEADER VERT 6POS 2.54MM

TE Connectivity AMP Connectors

326 -
9-146274-0-06

数据表

AMPMODU Mod II Bulk Active Header, Breakaway Male Pin 6 1 - 0.090" (2.29mm) All Board to Board or Cable 0.100" (2.54mm) Unshrouded Through Hole 0.533" (13.55mm) Solder Square 0.125" (3.18mm) Push-Pull 0.318" (8.08mm) Tin Tin Copper Alloy Liquid Crystal Polymer (LCP) - 3A
TSW-115-07-G-S-009

TSW-115-07-G-S-009

CONN HDR .100" 15POS

Samtec Inc.

0 -
TSW-115-07-G-S-009

数据表

TSW Bulk Active Header Male Pin 15 1 - 0.100" (2.54mm) 14 Board to Board or Cable 0.100" (2.54mm) Unshrouded Through Hole 0.430" (10.92mm) Solder Square 0.100" (2.54mm) Push-Pull 0.230" (5.84mm) Gold Gold Phosphor Bronze Polybutylene Terephthalate (PBT) - -
TSM-107-01-F-DV-006

TSM-107-01-F-DV-006

CONN HEADER SMD 14POS 2.54MM

Samtec Inc.

0 -
TSM-107-01-F-DV-006

数据表

TSM Tube Active Header, Cuttable Male Pin 14 2 0.100" (2.54mm) 0.100" (2.54mm) 13 Board to Board or Cable 0.100" (2.54mm) Unshrouded Surface Mount - Solder Square - Push-Pull 0.230" (5.84mm) Gold Tin Phosphor Bronze Liquid Crystal Polymer (LCP) - -
TSW-106-14-S-D-LL

TSW-106-14-S-D-LL

CONN HEADER VERT 12POS 2.54MM

Samtec Inc.

0 -
TSW-106-14-S-D-LL

数据表

TSW Bulk Active Header Male Pin 12 2 0.100" (2.54mm) 0.100" (2.54mm) All Board to Board or Cable 0.100" (2.54mm) Unshrouded Through Hole 0.530" (13.46mm) Kinked Pin, Solder Square 0.110" (2.79mm) Push-Pull 0.320" (8.13mm) Gold Tin Phosphor Bronze Polybutylene Terephthalate (PBT) - -
MTLW-107-06-L-S-125

MTLW-107-06-L-S-125

.100" LOW PROFILE VARIABLE POST

Samtec Inc.

0 -
MTLW-107-06-L-S-125

数据表

Flex Stack, MTLW Bulk Active Header Male Pin 7 1 - 0.060" (1.52mm) All Board to Board or Cable 0.100" (2.54mm) Unshrouded Through Hole 0.300" (7.62mm) Solder Square 0.115" (2.92mm) Push-Pull 0.125" (3.18mm) Gold Tin Phosphor Bronze Liquid Crystal Polymer (LCP) - 5.2A per Contact
HTSW-108-08-T-T

HTSW-108-08-T-T

CONN HEADER VERT 24POS 2.54MM

Samtec Inc.

0 -
HTSW-108-08-T-T

数据表

HTSW Bulk Active - - - - - - - - - - - - - - - - - - - - - - -
HMTSW-104-13-G-D-935

HMTSW-104-13-G-D-935

CONN HEADER VERT 8POS 2.54MM

Samtec Inc.

0 -
HMTSW-104-13-G-D-935

数据表

Flex Stack, HMTSW Bulk Active Header Male Pin 8 2 0.100" (2.54mm) 0.100" (2.54mm) All Board to Board or Cable 0.100" (2.54mm) Unshrouded Through Hole 1.230" (31.24mm) Solder Square 0.195" (4.95mm) Push-Pull 0.935" (23.75mm) Gold Gold Phosphor Bronze Liquid Crystal Polymer (LCP) - 3A
HMTSW-104-13-G-D-937

HMTSW-104-13-G-D-937

CONN HEADER VERT 8POS 2.54MM

Samtec Inc.

0 -
HMTSW-104-13-G-D-937

数据表

Flex Stack, HMTSW Bulk Active Header Male Pin 8 2 0.100" (2.54mm) 0.100" (2.54mm) All Board to Board or Cable 0.100" (2.54mm) Unshrouded Through Hole 1.230" (31.24mm) Solder Square 0.193" (4.90mm) Push-Pull 0.937" (23.80mm) Gold Gold Phosphor Bronze Liquid Crystal Polymer (LCP) - 3A
HTSW-108-14-L-D-LL

HTSW-108-14-L-D-LL

CONN HEADER VERT 16POS 2.54MM

Samtec Inc.

0 -
HTSW-108-14-L-D-LL

数据表

HTSW Bulk Active - - - - - - - - - - - - - - - - - - - - - - -
MTLW-111-24-T-S-320

MTLW-111-24-T-S-320

CONN HEADER VERT 11POS 2.54MM

Samtec Inc.

0 -
MTLW-111-24-T-S-320

数据表

Flex Stack, MTLW Bulk Active Header Male Pin 11 1 - 0.060" (1.52mm) All Board to Board or Cable 0.100" (2.54mm) Unshrouded Through Hole 0.480" (12.19mm) Solder Square 0.100" (2.54mm) Push-Pull 0.320" (8.13mm) Tin Tin Phosphor Bronze Liquid Crystal Polymer (LCP) - 5.2A per Contact
HMTSW-107-08-L-D-170

HMTSW-107-08-L-D-170

CONN HEADER VERT 14POS 2.54MM

Samtec Inc.

0 -
HMTSW-107-08-L-D-170

数据表

Flex Stack, HMTSW Bulk Active Header Male Pin 14 2 0.100" (2.54mm) 0.100" (2.54mm) All Board to Board or Cable 0.100" (2.54mm) Unshrouded Through Hole 0.530" (13.46mm) Solder Square 0.260" (6.60mm) Push-Pull 0.170" (4.32mm) Gold Tin Phosphor Bronze Liquid Crystal Polymer (LCP) - 3A
HMTSW-107-08-L-D-250

HMTSW-107-08-L-D-250

CONN HEADER VERT 14POS 2.54MM

Samtec Inc.

0 -
HMTSW-107-08-L-D-250

数据表

Flex Stack, HMTSW Bulk Active Header Male Pin 14 2 0.100" (2.54mm) 0.100" (2.54mm) All Board to Board or Cable 0.100" (2.54mm) Unshrouded Through Hole 0.530" (13.46mm) Solder Square 0.180" (4.57mm) Push-Pull 0.250" (6.35mm) Gold Tin Phosphor Bronze Liquid Crystal Polymer (LCP) - 3A
HMTSW-107-08-L-D-335

HMTSW-107-08-L-D-335

CONN HEADER VERT 14POS 2.54MM

Samtec Inc.

0 -
HMTSW-107-08-L-D-335

数据表

Flex Stack, HMTSW Bulk Active Header Male Pin 14 2 0.100" (2.54mm) 0.100" (2.54mm) All Board to Board or Cable 0.100" (2.54mm) Unshrouded Through Hole 0.530" (13.46mm) Solder Square 0.095" (2.41mm) Push-Pull 0.335" (8.51mm) Gold Tin Phosphor Bronze Liquid Crystal Polymer (LCP) - 3A
HMTSW-107-08-L-D-340

HMTSW-107-08-L-D-340

CONN HEADER VERT 14POS 2.54MM

Samtec Inc.

0 -
HMTSW-107-08-L-D-340

数据表

Flex Stack, HMTSW Bulk Active Header Male Pin 14 2 0.100" (2.54mm) 0.100" (2.54mm) All Board to Board or Cable 0.100" (2.54mm) Unshrouded Through Hole 0.530" (13.46mm) Solder Square 0.090" (2.29mm) Push-Pull 0.340" (8.64mm) Gold Tin Phosphor Bronze Liquid Crystal Polymer (LCP) - 3A
TSM-107-01-F-DV-008

TSM-107-01-F-DV-008

CONN HEADER SMD 14POS 2.54MM

Samtec Inc.

0 -
TSM-107-01-F-DV-008

数据表

TSM Tube Active Header, Cuttable Male Pin 14 2 0.100" (2.54mm) 0.100" (2.54mm) 13 Board to Board or Cable 0.100" (2.54mm) Unshrouded Surface Mount - Solder Square - Push-Pull 0.230" (5.84mm) Gold Tin Phosphor Bronze Liquid Crystal Polymer (LCP) - -
HTSW-105-08-G-D-RA-008

HTSW-105-08-G-D-RA-008

CONN HEADER R/A 10POS 2.54MM

Samtec Inc.

0 -
HTSW-105-08-G-D-RA-008

数据表

HTSW Bulk Active Header Male Pin 10 2 0.100" (2.54mm) 0.240" (6.10mm) 9 Board to Board or Cable 0.100" (2.54mm) Unshrouded Through Hole, Right Angle - Solder Square 0.090" (2.29mm) Push-Pull 0.230" (5.84mm) Gold Gold Phosphor Bronze Liquid Crystal Polymer (LCP) - Varies by Wire Gauge
HTSW-106-17-G-D

HTSW-106-17-G-D

CONN HEADER VERT 12POS 2.54MM

Samtec Inc.

0 -
HTSW-106-17-G-D

数据表

HTSW Bulk Active - - - - - - - - - - - - - - - - - - - - - - -
DF13C-3P-1.25V(76)

DF13C-3P-1.25V(76)

CONN HEADER SMD 3POS 1.25MM

Hirose Electric Co Ltd

2,569 -
DF13C-3P-1.25V(76)

数据表

DF13 Tube Active Header Male Pin 3 1 - 0.189" (4.80mm) All Board to Cable/Wire 0.049" (1.25mm) Shrouded - 3 Wall Surface Mount - Solder Square - Detent Lock - Gold Gold Brass Polyamide (PA), Nylon Solder Retention 1A
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