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电路板间隔柱、堆叠器(板对板)

制造商 系列 包装 产品状态 位置数量 间距 行间距 引脚总长度 引脚长度 - 配对部分 堆叠高度长度 引脚尾部长度 行数 安装类型 端接方式 触点表面处理 - 配对部分 触点表面处理厚度 - 配对部分 颜色

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 位置数量 间距 行间距 引脚总长度 引脚长度 - 配对部分 堆叠高度长度 引脚尾部长度 行数 安装类型 端接方式 触点表面处理 - 配对部分 触点表面处理厚度 - 配对部分 颜色
DW-12-19-L-D-500

DW-12-19-L-D-500

CONN HDR 24POS 0.1 STACK T/H

Samtec Inc.

0 -
DW-12-19-L-D-500

数据表

Flex Stack, DW Bulk Active 24 0.100" (2.54mm) 0.100" (2.54mm) 1.330" (33.782mm) 0.720" (18.288mm) 0.500" (12.700mm) 0.110" (2.794mm) 2 Through Hole Solder Gold 10.0µin (0.25µm) Black
TW-04-10-F-S-120-200

TW-04-10-F-S-120-200

FLEXIBLE SURFACE MOUNT BOARD STA

Samtec Inc.

0 -
TW-04-10-F-S-120-200

数据表

TW Bulk Active 4 0.079" (2.00mm) - 0.614" (15.596mm) 0.294" (7.468mm) 0.120" (3.048mm) 0.200" (5.080mm) 1 Through Hole Solder Gold 3.00µin (0.076µm) Black
TW-04-06-L-S-485-SM-TR

TW-04-06-L-S-485-SM-TR

FLEXIBLE SURFACE MOUNT BOARD STA

Samtec Inc.

0 -
TW-04-06-L-S-485-SM-TR

数据表

Flex Stack, TW Tape & Reel (TR) Active 4 0.079" (2.00mm) - 0.605" (15.367mm) 0.120" (3.048mm) 0.485" (12.319mm) - 1 Surface Mount Solder Gold 10.0µin (0.25µm) Black
ZW-04-20-G-S-555-330

ZW-04-20-G-S-555-330

FLEXIBLE BOARD STACKING HEADER,

Samtec Inc.

0 -
ZW-04-20-G-S-555-330

数据表

Flex Stack, ZW Bulk Active - - - - - - - - - - - - -
ZW-10-08-T-S-334-098

ZW-10-08-T-S-334-098

FLEXIBLE BOARD STACKING HEADER,

Samtec Inc.

0 -
ZW-10-08-T-S-334-098

数据表

Flex Stack, ZW Bulk Active - - - - - - - - - - - - -
ZW-02-20-G-D-320-055

ZW-02-20-G-D-320-055

FLEXIBLE BOARD STACKING HEADER,

Samtec Inc.

0 -
ZW-02-20-G-D-320-055

数据表

Flex Stack, ZW Bulk Active - - - - - - - - - - - - -
54112-104140850LF

54112-104140850LF

CONN HDR STACK

Amphenol ICC (FCI)

0 -
54112-104140850LF

数据表

BERGSTIK®, MezzSelect™, Basics+ Bag Active 14 0.100" (2.54mm) 0.100" (2.54mm) 0.660" (16.764mm) 0.230" (5.842mm) 0.335" (8.500mm) 0.095" (2.413mm) 2 Through Hole Solder Gold, GXT™ 30.0µin (0.76µm) Black
59132-G30-05-064LF

59132-G30-05-064LF

CONN HDR STACK

Amphenol ICC (FCI)

0 -
59132-G30-05-064LF

数据表

Minitek® MezzSelect™, Basics+ Bag Active 10 0.079" (2.00mm) 0.079" (2.000mm) 0.531" (13.487mm) 0.161" (4.089mm) 0.252" (6.400mm) 0.118" (3.000mm) 2 Through Hole Solder Gold 30.0µin (0.76µm) Black
54121-103360800LF

54121-103360800LF

CONN HDR 36POS 0.100" STACK T/H

Amphenol ICC (FCI)

0 -
54121-103360800LF

数据表

BERGSTIK®, MezzSelect™, Basics+ Bag Active 36 0.100" (2.54mm) - 0.626" (15.900mm) 0.191" (4.851mm) 0.315" (8.000mm) 0.120" (3.050mm) 1 Through Hole Solder Gold, GXT™ 30.0µin (0.76µm) Black
0877620024

0877620024

CONN HDR 12POS 0.079 STACK SMD

Molex

0 -
0877620024

数据表

Milli-Grid 87762 Tube Active 12 0.079" (2.00mm) 0.079" (2.00mm) 0.813" (20.650mm) 0.262" (6.655mm) 0.453" (11.500mm) - 2 Surface Mount Solder Gold - Black
75970-1AL-06LF

75970-1AL-06LF

CONN HDR 6POS 0.1" STACK T/H

Amphenol ICC (FCI)

0 -
75970-1AL-06LF

数据表

BERGSTIK®, MezzSelect™, Basics+ Bag Active 6 0.100" (2.54mm) - 0.906" (23.000mm) 0.335" (8.500mm) 0.236" (6.000mm) 0.335" (8.500mm) 1 Through Hole Solder Gold, GXT™ 30.0µin (0.76µm) Black
HDWM-06-58-S-S-307-SM

HDWM-06-58-S-S-307-SM

CONN HDR 6POS 0.05 STACK SMD

Samtec Inc.

0 -
HDWM-06-58-S-S-307-SM

数据表

Flex Stack, HDWM Bulk Active 6 0.050" (1.27mm) - 0.742" (18.847mm) 0.435" (11.049mm) 0.307" (7.798mm) - 1 Surface Mount Solder Gold 30.0µin (0.76µm) Black
TW-06-09-T-T-230-080

TW-06-09-T-T-230-080

CONN BRD STACK 2.00 18POS

Samtec Inc.

0 -
TW-06-09-T-T-230-080

数据表

TW Bulk Active 18 0.079" (2.00mm) 0.079" (2.00mm) 0.456" (11.582mm) 0.146" (3.708mm) 0.230" (5.842mm) 0.080" (2.032mm) 3 Through Hole Solder Tin - Black
54121-403080950LF

54121-403080950LF

CONN HDR 8POS 0.1" STACK T/H

Amphenol ICC (FCI)

0 -
54121-403080950LF

数据表

BERGSTIK®, MezzSelect™, Basics+ Bag Active 8 0.100" (2.54mm) - 0.626" (15.900mm) 0.132" (3.353mm) 0.374" (9.500mm) 0.120" (3.050mm) 1 Through Hole Solder Tin 78.7µin (2.00µm) Black
DW-12-13-L-D-750-LL

DW-12-13-L-D-750-LL

CONN HDR 24POS 0.1 STACK T/H

Samtec Inc.

0 -
DW-12-13-L-D-750-LL

数据表

Flex Stack, DW Bulk Active 24 0.100" (2.54mm) 0.100" (2.54mm) 1.230" (31.242mm) 0.370" (9.400mm) 0.750" (19.050mm) 0.110" (2.794mm) 2 Through Hole Solder Gold 10.0µin (0.25µm) Black
5-146455-6

5-146455-6

CONN HDR 6POS 0.1 STACK T/H TIN

TE Connectivity AMP Connectors

0 -
5-146455-6

数据表

AMPMODU Mod II Bulk Active 6 0.100" (2.54mm) - 0.440" (11.176mm) 0.130" (3.300mm) 0.200" (5.080mm) 0.110" (2.800mm) 1 Through Hole Solder Tin 100.0µin (2.54µm) Black
DW-09-20-L-S-750-002

DW-09-20-L-S-750-002

CONN HDR 9POS 0.1 STACK T/H GOLD

Samtec Inc.

0 -
DW-09-20-L-S-750-002

数据表

Flex Stack, DW Bulk Active 9 0.100" (2.54mm) - 1.130" (28.702mm) 0.270" (6.858mm) 0.750" (19.050mm) 0.110" (2.794mm) 1 Through Hole Solder Gold 10.0µin (0.25µm) Black
59202-T34-05-046LF

59202-T34-05-046LF

CONN HDR STACK SMD

Amphenol ICC (FCI)

0 -
59202-T34-05-046LF

数据表

Minitek® MezzSelect™, Basics+ Bag Active 10 0.079" (2.00mm) 0.079" (2.000mm) 0.547" (13.894mm) 0.366" (9.296mm) 0.181" (4.597mm) - 2 Surface Mount Solder Gold 30.0µin (0.76µm) Black
54111-109041800LF

54111-109041800LF

CONN HDR STACK

Amphenol ICC (FCI)

0 -
54111-109041800LF

数据表

BERGSTIK®, MezzSelect™, Basics+ Bag Active 4 0.100" (2.54mm) - 1.025" (26.035mm) 0.222" (5.638mm) 0.709" (18.009mm) 0.095" (2.413mm) 1 Through Hole Solder Gold, GXT™ 30.0µin (0.76µm) Black
98426-S03-04-118LF

98426-S03-04-118LF

CONN HDR 8POS 0.079" STACK T/H

Amphenol ICC (FCI)

0 -
98426-S03-04-118LF

数据表

Minitek® 2.00mm Box Active 8 0.079" (2.00mm) 0.079" (2.00mm) 0.555" (14.100mm) 0.157" (4.000mm) 0.299" (7.600mm) 0.091" (2.300mm) 2 Through Hole Solder Gold, GXT™ 15.0µin (0.38µm) Black and Cream
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