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矩形电缆组件

制造商 系列 包装 产品状态 连接器类型 位置数量 间距 - 连接器 间距 - 电缆 长度 特性 颜色 行数 屏蔽 用途 电缆端接 触点表面处理 触点表面处理厚度

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 连接器类型 位置数量 间距 - 连接器 间距 - 电缆 长度 特性 颜色 行数 屏蔽 用途 电缆端接 触点表面处理 触点表面处理厚度
24-002-200

24-002-200

DIP CABLE M-F 24POS

Aries Electronics

0 -
24-002-200

数据表

200 Bulk Active DIP to DIP, Reversed 24 0.100" (2.54mm) 0.050" (1.27mm) 0.667' (203.20mm, 8.00") Strain Relief Multiple, Ribbon 2 Unshielded Socket (0.1"), Board In Solder Gold 10.0µin (0.25µm)
24-005.5-200

24-005.5-200

DIP CABLE M-F 24POS

Aries Electronics

0 -
24-005.5-200

数据表

200 Bulk Active DIP to DIP, Reversed 24 0.100" (2.54mm) 0.050" (1.27mm) 0.458' (139.70mm, 5.50") Strain Relief Multiple, Ribbon 2 Unshielded Socket (0.1"), Board In Solder Gold 10.0µin (0.25µm)
22-010-157

22-010-157

CABLE 22POS .100 JUMPER 10 INCH

Aries Electronics

0 -
22-010-157

数据表

157 Bulk Active Plug to Plug 22 0.100" (2.54mm) 0.100" (2.54mm) 0.833' (254.00mm, 10.00") - Multiple, Ribbon 1 Unshielded - Solder Gold 10.0µin (0.25µm)
20-012-215

20-012-215

DIP CABLE M-F 20POS

Aries Electronics

0 -
20-012-215

数据表

215 Bulk Active DIP to DIP, Reversed 20 0.100" (2.54mm) 0.050" (1.27mm) 1.00' (304.80mm) Strain Relief Multiple, Ribbon 2 Unshielded Socket (0.1"), Board In Solder Gold 10.0µin (0.25µm)
16-012-208

16-012-208

DIP CABLE M-F 16POS

Aries Electronics

0 -
16-012-208

数据表

208 Bulk Active DIP to DIP 16 0.100" (2.54mm) 0.050" (1.27mm) 1.00' (304.80mm) Strain Relief Multiple, Ribbon 2 Unshielded Socket (0.1"), Board In Solder Gold 10.0µin (0.25µm)
18-012-212

18-012-212

DIP CABLE M-F 18POS

Aries Electronics

0 -
18-012-212

数据表

212 Bulk Active DIP to DIP 18 0.100" (2.54mm) 0.050" (1.27mm) 1.00' (304.80mm) Strain Relief Multiple, Ribbon 2 Unshielded Socket (0.1"), Board In Solder Gold 10.0µin (0.25µm)
28-024-206

28-024-206

DIP CABLE M-F 28POS

Aries Electronics

0 -
28-024-206

数据表

206 Bulk Active DIP to Cable 28 0.100" (2.54mm) 0.050" (1.27mm) 2.00' (609.60mm) Strain Relief Multiple, Ribbon 2 Unshielded Socket (0.1"), Board In Solder Gold 10.0µin (0.25µm)
28-012-112

28-012-112

DECI-CENTER JUMPERS 28POS

Aries Electronics

0 -
28-012-112

数据表

112 Bulk Active DIP to Pitch Bar 28 0.100" (2.54mm) 0.039" (1.00mm) 1.00' (304.80mm) - Multiple, Ribbon 2 Unshielded - Solder Gold 10.0µin (0.25µm)
28-012-113

28-012-113

DECI-CENTER JUMPERS 28POS

Aries Electronics

0 -
28-012-113

数据表

113 Bulk Active DIP to Pitch Bar 28 0.100" (2.54mm) 0.039" (1.00mm) 1.00' (304.80mm) - Multiple, Ribbon 2 Unshielded - Solder Gold 10.0µin (0.25µm)
28-012-114

28-012-114

DECI-CENTER JUMPERS 28POS

Aries Electronics

0 -
28-012-114

数据表

114 Bulk Active DIP to Pitch Bar 28 0.100" (2.54mm) 0.039" (1.00mm) 1.00' (304.80mm) - Multiple, Ribbon 2 Unshielded - Solder Gold 10.0µin (0.25µm)
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