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MWCT2013AVLH

MWCT2013AVLH

NEVIS3A_WCT,64LQFP

NXP USA Inc.

0 -
MWCT2013AVLH

数据表

- 64-LQFP Tray Active Wireless Power Transmitter - - - - Surface Mount 64-LQFP (10x10) -
MC35FS6503CAER2

MC35FS6503CAER2

FS6500

NXP USA Inc.

0 -
MC35FS6503CAER2

数据表

- 48-LQFP Exposed Pad Tape & Reel (TR) Active System Basis Chip - -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7) 1V ~ 5V
MAX20069BGTLA/V+

MAX20069BGTLA/V+

AUTOMOTIVE I2C-CONTROLLED 4-CHAN

Analog Devices Inc./Maxim Integrated

0 -
MAX20069BGTLA/V+

数据表

- 40-WFQFN Exposed Pad Tube Active TFT-LCD Panels: Gamma Buffer, VCOM Driver 2.2mA -40°C ~ 105°C (TA) - - Surface Mount 40-TQFN (6x6) 2.8V ~ 5.5V, 4.5V ~ 42V
MAX5043ETN+T

MAX5043ETN+T

IC PWR W/MOSFET HS 56-TQFN

Analog Devices Inc./Maxim Integrated

0 -
MAX5043ETN+T

数据表

- 56-WFQFN Exposed Pad Tape & Reel (TR) Obsolete General Purpose 20mA -40°C ~ 85°C - - Surface Mount 56-TQFN (8x8) 20V ~ 76V
MC33FS6600M0ESR2

MC33FS6600M0ESR2

SAFETY SBC FOR S32S2 MCU

NXP USA Inc.

0 -
MC33FS6600M0ESR2

数据表

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active Safety - -40°C ~ 125°C (TA) Automotive - Surface Mount, Wettable Flank 56-HVQFN (8x8) 2.7V ~ 60V
MC33FS6600M1ESR2

MC33FS6600M1ESR2

SAFETY SBC FOR S32S2 MCU

NXP USA Inc.

0 -
MC33FS6600M1ESR2

数据表

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active Safety - -40°C ~ 125°C (TA) Automotive - Surface Mount, Wettable Flank 56-HVQFN (8x8) 2.7V ~ 60V
MC33FS6600M2ESR2

MC33FS6600M2ESR2

SAFETY SBC FOR S32S2 MCU

NXP USA Inc.

0 -
MC33FS6600M2ESR2

数据表

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active Safety - -40°C ~ 125°C (TA) Automotive - Surface Mount, Wettable Flank 56-HVQFN (8x8) 2.7V ~ 60V
MC33PF8200CXES

MC33PF8200CXES

IC POWER MANAGEMENT LS1043A

NXP USA Inc.

0 -
MC33PF8200CXES

数据表

- 56-VFQFN Exposed Pad Tray Active High Performance i.MX 8, S32x Processor Based - -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8) 2.5V ~ 5.5V
MC33PF8200D2ES

MC33PF8200D2ES

IC POWER MANAGEMENT

NXP USA Inc.

0 -
MC33PF8200D2ES

数据表

- 56-VFQFN Exposed Pad Tray Active High Performance i.MX 8, S32x Processor Based - -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8) 2.5V ~ 5.5V
MC33PF8200DBES

MC33PF8200DBES

IC POWER MANAGEMENT I.MX8QM

NXP USA Inc.

0 -
MC33PF8200DBES

数据表

- 56-VFQFN Exposed Pad Tray Active High Performance i.MX 8, S32x Processor Based - -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8) 2.5V ~ 5.5V
MC33PF8200DFES

MC33PF8200DFES

I.MX8QXP WITH DDR3L

NXP USA Inc.

0 -
MC33PF8200DFES

数据表

- 56-VFQFN Exposed Pad Tray Active High Performance i.MX 8, S32x Processor Based - -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8) 2.5V ~ 5.5V
MC33PF8200DHES

MC33PF8200DHES

IC POWER MANAGEMENT I.MX8QM

NXP USA Inc.

0 -
MC33PF8200DHES

数据表

- 56-VFQFN Exposed Pad Tray Active High Performance i.MX 8, S32x Processor Based - -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8) 2.5V ~ 5.5V
MC33PF8200ESES

MC33PF8200ESES

IC POWER MANAGEMENT I.MX8QM

NXP USA Inc.

0 -
MC33PF8200ESES

数据表

- 56-VFQFN Exposed Pad Tray Active High Performance i.MX 8, S32x Processor Based - -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8) 2.7V ~ 5.5V
MC33PF8200ETES

MC33PF8200ETES

IC POWER MANAGEMENT I.MX8QM

NXP USA Inc.

0 -
MC33PF8200ETES

数据表

- 56-VFQFN Exposed Pad Tray Active High Performance i.MX 8, S32x Processor Based - -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8) 2.7V ~ 5.5V
MC33PF8200DMES

MC33PF8200DMES

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

0 -
MC33PF8200DMES

数据表

- 56-VFQFN Exposed Pad Tray Active High Performance i.MX 8, S32x Processor Based - -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8) 2.5V ~ 5.5V
MC33PF8200DNES

MC33PF8200DNES

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

0 -
MC33PF8200DNES

数据表

- 56-VFQFN Exposed Pad Tray Active High Performance i.MX 8, S32x Processor Based - -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8) 2.5V ~ 5.5V
MC33PF8200EMES

MC33PF8200EMES

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

0 -
MC33PF8200EMES

数据表

- 56-VFQFN Exposed Pad Tray Active High Performance i.MX 8, S32x Processor Based - -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8) 2.5V ~ 5.5V
MC33FS6600M2KSR2

MC33FS6600M2KSR2

SAFETY POWER MANAGEMENT IC, QFN5

NXP USA Inc.

0 -
MC33FS6600M2KSR2

数据表

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active - - -40°C ~ 125°C (TA) Automotive - Surface Mount, Wettable Flank 56-HVQFN (8x8) 2.7V ~ 60V
MC33FS6600M1KSR2

MC33FS6600M1KSR2

SAFETY POWER MANAGEMENT IC, QFN5

NXP USA Inc.

0 -
MC33FS6600M1KSR2

数据表

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active - - -40°C ~ 125°C (TA) Automotive - Surface Mount, Wettable Flank 56-HVQFN (8x8) 2.7V ~ 60V
MC33FS6600M0KSR2

MC33FS6600M0KSR2

SAFETY POWER MANAGEMENT IC, QFN5

NXP USA Inc.

0 -
MC33FS6600M0KSR2

数据表

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active - - -40°C ~ 125°C (TA) Automotive - Surface Mount, Wettable Flank 56-HVQFN (8x8) 2.7V ~ 60V
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