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MC33PF8100EAES

MC33PF8100EAES

IC POWER MANAGEMENT LS1046A

NXP USA Inc.

0 -
MC33PF8100EAES

数据表

- 56-VFQFN Exposed Pad Tray Active High Performance i.MX 8, S32x Processor Based - -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8) 2.7V ~ 5.5V
MC33PF8100ERES

MC33PF8100ERES

IC POWER MANAGEMENT I.MX8QM

NXP USA Inc.

0 -
MC33PF8100ERES

数据表

- 56-VFQFN Exposed Pad Tray Active High Performance i.MX 8, S32x Processor Based - -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8) 2.7V ~ 5.5V
LM2984T/NOPB

LM2984T/NOPB

IC CONV MICROPROCESSOR TO220-11

Texas Instruments

0 -
LM2984T/NOPB

数据表

- TO-220-11 Formed Leads Tube Obsolete Power Supplies 100mA -40°C ~ 125°C - - Through Hole TO-220-11 6V ~ 26V
MC35FS4503NAER2

MC35FS4503NAER2

FS4500

NXP USA Inc.

0 -
MC35FS4503NAER2

数据表

- 48-LQFP Exposed Pad Tape & Reel (TR) Active System Basis Chip - -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7) 1V ~ 5V
MAX17031ETG+T

MAX17031ETG+T

IC CTLR DUAL QUICK PWM SD 24TQFN

Analog Devices Inc./Maxim Integrated

0 -
MAX17031ETG+T

数据表

Quick-PWM™ 24-WFQFN Exposed Pad Tape & Reel (TR) Active Power Supplies 100µA -40°C ~ 85°C - - Surface Mount 24-TQFN (4x4) 6V ~ 24V
MC33FS8435G0ESR2

MC33FS8435G0ESR2

SAFETY POWER MANAGEMENT IC, QFN5

NXP USA Inc.

0 -
MC33FS8435G0ESR2

数据表

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active System Basis Chip 15mA -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 56-HVQFN (8x8) 60V
MC33FS8435G0KSR2

MC33FS8435G0KSR2

SAFETY POWER MANAGEMENT IC, QFN5

NXP USA Inc.

0 -
MC33FS8435G0KSR2

数据表

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active System Basis Chip 15mA -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 56-HVQFN (8x8) 60V
MC35FS6512NAE

MC35FS6512NAE

FS6500

NXP USA Inc.

0 -
MC35FS6512NAE

数据表

- 48-LQFP Exposed Pad Tray Active System Basis Chip - -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7) 1V ~ 5V
AMP8DS1QF74

AMP8DS1QF74

MULTI-RAIL POWER PLATFORM 1A

AnDAPT, Inc.

0 -
AMP8DS1QF74

数据表

- 74-PowerWFQFN Tape & Reel (TR) Active Battery Charger, Digital Power Management, Power Component Integrator 1A -40°C ~ 85°C (TA) - - Surface Mount 74-QFN (8x8) 12V
MC35FS4507CAE

MC35FS4507CAE

SYSTEM BASIS CHIP, LINEAR 0.5A V

NXP USA Inc.

0 -
MC35FS4507CAE

数据表

- 48-LQFP Exposed Pad Tray Active System Basis Chip - -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7) 1V ~ 5V
MC33FS8430G2ES

MC33FS8430G2ES

SYSTEM BASIS CHIP FS8430

NXP USA Inc.

0 -
MC33FS8430G2ES

数据表

* - Tray Active - - - - - - - -
MC33FS8430G4ES

MC33FS8430G4ES

SYSTEM BASIS CHIP FS8430

NXP USA Inc.

0 -
MC33FS8430G4ES

数据表

* - Tray Active - - - - - - - -
MC33PF8200DEESR2

MC33PF8200DEESR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

0 -
MC33PF8200DEESR2

数据表

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8) 2.5V ~ 5.5V
MC33PF8200D2ESR2

MC33PF8200D2ESR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

0 -
MC33PF8200D2ESR2

数据表

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8) 2.5V ~ 5.5V
MC33PF8200DBESR2

MC33PF8200DBESR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

0 -
MC33PF8200DBESR2

数据表

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8) 2.5V ~ 5.5V
MC33PF8200EMESR2

MC33PF8200EMESR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

0 -
MC33PF8200EMESR2

数据表

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8) 2.5V ~ 5.5V
MC33PF8200ETESR2

MC33PF8200ETESR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

0 -
MC33PF8200ETESR2

数据表

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8) 2.5V ~ 5.5V
MC33PF8200A0ESR2

MC33PF8200A0ESR2

POWER MANAGEMENT IC I.MX8 NON-PR

NXP USA Inc.

0 -
MC33PF8200A0ESR2

数据表

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8) 2.5V ~ 5.5V
MC33PF8200DNESR2

MC33PF8200DNESR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

0 -
MC33PF8200DNESR2

数据表

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8) 2.5V ~ 5.5V
MC33PF8200DMESR2

MC33PF8200DMESR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

0 -
MC33PF8200DMESR2

数据表

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8) 2.5V ~ 5.5V
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