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| 图片 | 厂商料号 | 库存情况 | 价格 | 数量 | 数据表 | 系列 | 封装/外壳 | 包装 | 产品状态 | 应用 | 电流 - 电源 | 工作温度 | 等级 | 认证 | 安装类型 | 供应商设备封装 | 电压 - 电源 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
MC33PF8100EAESIC POWER MANAGEMENT LS1046A |
0 | - |
|
数据表 |
- | 56-VFQFN Exposed Pad | Tray | Active | High Performance i.MX 8, S32x Processor Based | - | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) | 2.7V ~ 5.5V |
|
MC33PF8100ERESIC POWER MANAGEMENT I.MX8QM |
0 | - |
|
数据表 |
- | 56-VFQFN Exposed Pad | Tray | Active | High Performance i.MX 8, S32x Processor Based | - | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) | 2.7V ~ 5.5V |
|
LM2984T/NOPBIC CONV MICROPROCESSOR TO220-11 |
0 | - |
|
数据表 |
- | TO-220-11 Formed Leads | Tube | Obsolete | Power Supplies | 100mA | -40°C ~ 125°C | - | - | Through Hole | TO-220-11 | 6V ~ 26V |
|
MC35FS4503NAER2FS4500 |
0 | - |
|
数据表 |
- | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | - | -40°C ~ 150°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) | 1V ~ 5V |
|
MAX17031ETG+TIC CTLR DUAL QUICK PWM SD 24TQFN |
0 | - |
|
数据表 |
Quick-PWM™ | 24-WFQFN Exposed Pad | Tape & Reel (TR) | Active | Power Supplies | 100µA | -40°C ~ 85°C | - | - | Surface Mount | 24-TQFN (4x4) | 6V ~ 24V |
|
MC33FS8435G0ESR2SAFETY POWER MANAGEMENT IC, QFN5 |
0 | - |
|
数据表 |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | 15mA | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 56-HVQFN (8x8) | 60V |
|
MC33FS8435G0KSR2SAFETY POWER MANAGEMENT IC, QFN5 |
0 | - |
|
数据表 |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | 15mA | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 56-HVQFN (8x8) | 60V |
|
MC35FS6512NAEFS6500 |
0 | - |
|
数据表 |
- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | -40°C ~ 150°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) | 1V ~ 5V |
|
AMP8DS1QF74MULTI-RAIL POWER PLATFORM 1A |
0 | - |
|
数据表 |
- | 74-PowerWFQFN | Tape & Reel (TR) | Active | Battery Charger, Digital Power Management, Power Component Integrator | 1A | -40°C ~ 85°C (TA) | - | - | Surface Mount | 74-QFN (8x8) | 12V |
|
MC35FS4507CAESYSTEM BASIS CHIP, LINEAR 0.5A V |
0 | - |
|
数据表 |
- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | -40°C ~ 150°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) | 1V ~ 5V |
|
MC33FS8430G2ESSYSTEM BASIS CHIP FS8430 |
0 | - |
|
数据表 |
* | - | Tray | Active | - | - | - | - | - | - | - | - |
|
MC33FS8430G4ESSYSTEM BASIS CHIP FS8430 |
0 | - |
|
数据表 |
* | - | Tray | Active | - | - | - | - | - | - | - | - |
|
MC33PF8200DEESR2POWER MANAGEMENT IC I.MX8 PRE-PR |
0 | - |
|
数据表 |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) | 2.5V ~ 5.5V |
|
MC33PF8200D2ESR2POWER MANAGEMENT IC I.MX8 PRE-PR |
0 | - |
|
数据表 |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) | 2.5V ~ 5.5V |
|
MC33PF8200DBESR2POWER MANAGEMENT IC I.MX8 PRE-PR |
0 | - |
|
数据表 |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) | 2.5V ~ 5.5V |
|
MC33PF8200EMESR2POWER MANAGEMENT IC I.MX8 PRE-PR |
0 | - |
|
数据表 |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) | 2.5V ~ 5.5V |
|
MC33PF8200ETESR2POWER MANAGEMENT IC I.MX8 PRE-PR |
0 | - |
|
数据表 |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) | 2.5V ~ 5.5V |
|
MC33PF8200A0ESR2POWER MANAGEMENT IC I.MX8 NON-PR |
0 | - |
|
数据表 |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) | 2.5V ~ 5.5V |
|
MC33PF8200DNESR2POWER MANAGEMENT IC I.MX8 PRE-PR |
0 | - |
|
数据表 |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) | 2.5V ~ 5.5V |
|
MC33PF8200DMESR2POWER MANAGEMENT IC I.MX8 PRE-PR |
0 | - |
|
数据表 |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) | 2.5V ~ 5.5V |
