| 图片 | 厂商料号 | 库存情况 | 价格 | 数量 | 数据表 | 系列 | 封装/外壳 | 包装 | 产品状态 | 应用 | 电流 - 电源 | 工作温度 | 等级 | 认证 | 安装类型 | 供应商设备封装 | 电压 - 电源 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
MC34VR500V1ESIC REG 9OUT BUCK/LDO 56QFN NXP USA Inc. |
453 | - |
|
数据表 |
- | 56-VFQFN Exposed Pad | Tray | Active | QorlQ LS1/T1 Communications Processors | 250µA | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-QFN-EP (8x8) | 2.8V ~ 4.5V |
|
MC34708VMIC POWER MANAGEMENT 206MAPBGA NXP USA Inc. |
740 | - |
|
数据表 |
- | 206-LFBGA | Tray | Active | General Purpose | - | -40°C ~ 85°C | - | - | Surface Mount | 206-MAPBGA (13x13) | 1.8V ~ 4.5V |
|
PCA9420BSAZPCA9420BS NXP USA Inc. |
1,317 | - |
|
数据表 |
- | 24-VFQFN Exposed Pad | Tape & Reel (TR) | Active | - | 4.5µA | -40°C ~ 85°C (TA) | - | - | Surface Mount | 24-HVQFN (3x3) | 3.3V ~ 5.5V |
|
TEA2206T/1JIC ACTIVE BRIDGE CTRL SO8 NXP USA Inc. |
4,622 | - |
|
数据表 |
- | 8-SOIC (0.154", 3.90mm Width) | Tape & Reel (TR) | Active | Desktop, Notebook PCs | 2mA | -40°C ~ 125°C (TJ) | - | - | Surface Mount | 8-SO | 440V |
|
MC32PF4210A1ESPF4210 NXP USA Inc. |
266 | - |
|
数据表 |
- | 56-VFQFN Exposed Pad | Tray | Active | Audio, Video | - | 0°C ~ 85°C (TA) | - | - | Surface Mount, Wettable Flank | 56-QFN-EP (8x8) | 2.8V ~ 4.5V |
|
MFS2303BMBA3EPMFS2303BMBA3EP NXP USA Inc. |
531 | - |
|
数据表 |
- | 48-VFQFN Exposed Pad | Tray | Active | System Basis Chip | 40µA | -40°C ~ 125°C (TA) | - | - | Surface Mount, Wettable Flank | 48-HVQFN (7x7) | 5.5V ~ 40V |
|
TEA2208T/1JBRIDGE RECTIFIER CONTROLLER S014 NXP USA Inc. |
2,518 | - |
|
数据表 |
- | 14-SOIC (0.154", 3.90mm Width) | Tape & Reel (TR) | Active | Desktop, Notebook PCs | 2mA | -40°C ~ 125°C (TJ) | - | - | Surface Mount | 14-SO | 0V ~ 440V |
|
|
MC34704AEPIC POWER MANAGEMENT 56-QFN NXP USA Inc. |
1,758 | - |
|
数据表 |
- | 56-VFQFN Exposed Pad | Tray | Active | Processor | 86mA | -20°C ~ 85°C | - | - | Surface Mount | 56-QFN-EP (7x7) | 2.7V ~ 5.5V |
|
MC33FS4500CAESYSTEM BASIS CHIP LINEAR 0.5A V NXP USA Inc. |
161 | - |
|
数据表 |
- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | -40°C ~ 125°C | - | - | Surface Mount | 48-HLQFP (7x7) | 1V ~ 5V |
|
MC33664ATL1EGR2TRANSFORMER PHYSICAL LAYER NXP USA Inc. |
1,893 | - |
|
数据表 |
- | 16-SOIC (0.154", 3.90mm Width) | Tape & Reel (TR) | Active | Isolated Communications Interface | 40mA | -40°C ~ 125°C (TA) | - | - | Surface Mount | 16-SOIC | 4.5V ~ 5.5V |