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MPF5023AMBA0ESR2

MPF5023AMBA0ESR2

POWER MANAGEMENT IC, PRE-PROG, 3

NXP USA Inc.

0 -
MPF5023AMBA0ESR2

数据表

- 40-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based 200µA -40°C ~ 125°C (TA) - - Surface Mount, Wettable Flank 40-HVQFN (6x6) 2.5V ~ 5.5V
MPF5023CMBA0ESR2

MPF5023CMBA0ESR2

POWER MANAGEMENT IC, PRE-PROG, 3

NXP USA Inc.

0 -
MPF5023CMBA0ESR2

数据表

- 40-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based 200µA -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 40-HVQFN (6x6) 2.5V ~ 5.5V
MD1730-I/M2

MD1730-I/M2

IC ULTRASOUND IMAGING 36VQFN

Microchip Technology

0 -
MD1730-I/M2

数据表

- 36-VFQFN Exposed Pad Tray Obsolete Ultrasound Imaging - 0°C ~ 85°C - - Surface Mount 36-SQFN (6x6) 4.75V ~ 5.25V
MP5505GL-P

MP5505GL-P

POWER MANAGEMENT SPECIALIZED - P

Monolithic Power Systems Inc.

0 -
MP5505GL-P

数据表

- 20-PowerTFQFN Tape & Reel (TR) Not For New Designs Hard-Disk Drives, Solid State Drives (SSD) 2mA (Max) -40°C ~ 125°C - - Surface Mount 20-QFN (3x4) 2.7V ~ 7V
ISL6537CRZ-T

ISL6537CRZ-T

IC REG/CTRLR ACPI DUAL DDR 28QFN

Renesas Electronics Corporation

0 -
ISL6537CRZ-T

数据表

- 28-VQFN Exposed Pad Tape & Reel (TR) Active Memory, DDR/DDR2 Regulator 7mA 0°C ~ 70°C - - Surface Mount 28-QFN (6x6) -
ISL6537CRZ-TR5160

ISL6537CRZ-TR5160

IC REG/CTRLR ACPI DUAL DDR 28QFN

Renesas Electronics Corporation

0 -
ISL6537CRZ-TR5160

数据表

- 28-VQFN Exposed Pad Tape & Reel (TR) Obsolete Memory, DDR/DDR2 Regulator 7mA 0°C ~ 70°C - - Surface Mount 28-QFN (6x6) -
SMD IC AXP223

SMD IC AXP223

SMD IC AXP223

Olimex LTD

0 -
SMD IC AXP223

数据表

- - Bulk Active - - - - - - - -
MFS8622BMBA0ESR2

MFS8622BMBA0ESR2

SAFETY SYSTEM BASIS CHIP FOR DOM

NXP USA Inc.

0 -
MFS8622BMBA0ESR2

数据表

- 48-VFQFN Exposed Pad Tape & Reel (TR) Active Camera - -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 48-HVQFN (7x7) 36V
MC33FS4505KAER2

MC33FS4505KAER2

SYSTEM BASIS CHIP, LINEAR 0.5A V

NXP USA Inc.

0 -
MC33FS4505KAER2

数据表

- 48-LQFP Exposed Pad Tape & Reel (TR) Active System Basis Chip - -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7) 1V ~ 5V
MFS8621BMBA0ES

MFS8621BMBA0ES

IC FS86 SYSTEM BASIS CHIP ASIL

NXP USA Inc.

0 -
MFS8621BMBA0ES

数据表

- 48-VFQFN Exposed Pad Tray Active Camera - -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount 48-QFN (7x7) 4.5V ~ 36V
BH6053GU-E2

BH6053GU-E2

IC PWR MGMT SW REG 32-VCSP

Rohm Semiconductor

0 -
BH6053GU-E2

数据表

- 32-VFBGA, CSPBGA Tape & Reel (TR) Obsolete Cellular 5.7mA -30°C ~ 75°C (TA) - - Surface Mount 32-VCSP85H3 (3.54x3.54) 3V ~ 5.5V
DA9063L-XXHO1

DA9063L-XXHO1

ONCE OTP IS FINALIZED, PART BECO

Renesas Electronics Corporation

0 -
DA9063L-XXHO1

数据表

- 100-TFBGA Tray Active Processor 11mA -40°C ~ 125°C (TJ) Automotive AEC-Q100 Surface Mount 100-TFBGA (8x8) 2.8V ~ 5.5V
ACT88321VU112SR

ACT88321VU112SR

ADV PMIC 3 BUCKS 2 LDOS LOAD BYP

Qorvo

0 -
ACT88321VU112SR

数据表

ActiveCiPSTM™ 30-UFBGA, WLCSP Tape & Reel (TR) Active Solid State Drives (SSD) 260µA -40°C ~ 125°C (TJ) - - Surface Mount 30-WLCSP (2.18x2.58) 2.7V ~ 5.5V
ACT88760-101T

ACT88760-101T

5V PMIC FOR NEXT GEN PROCESSORS

Qorvo

0 -
ACT88760-101T

数据表

- 81-UFBGA, WLCSP Tape & Reel (TR) Active Processor - - - - Surface Mount 81-WLCSP (3.78x3.78) 2.7V ~ 5.5V
MAX25430AATLF/V+T

MAX25430AATLF/V+T

AUTOMOTIVE USB POWER DELIVERY PO

Analog Devices Inc./Maxim Integrated

0 -
MAX25430AATLF/V+T

数据表

- 40-WFQFN Exposed Pad Tape & Reel (TR) Active USB Dedicated Charging Port (DCP), Power Switch 2.3mA -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount 40-TQFN (6x6) 4.5V ~ 36V
MFS2322BMBA0EP

MFS2322BMBA0EP

MFS2322BMBA0EP

NXP USA Inc.

0 -
MFS2322BMBA0EP

数据表

- - Tray Active - - - - - - - -
WLC151568LDXSXQMA1

WLC151568LDXSXQMA1

TYPE-C - EMERGING APP.

Infineon Technologies

0 -
WLC151568LDXSXQMA1

数据表

- 68-VFQFN Exposed Pad Tray Active Wireless Power Transmitter 85mA -40°C ~ 125°C (TJ) Automotive AEC-Q100 Surface Mount, Wettable Flank 68-QFN (10x10) 4.5V ~ 24V
MPF5030BMMA4ESR2

MPF5030BMMA4ESR2

PMIC 3 BUCKS 2 LDO A1 DIE

NXP USA Inc.

0 -
MPF5030BMMA4ESR2

数据表

- 40-PowerVFQFN Tape & Reel (TR) Active System Basis Chip - -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 40-HVQFN (6x6) 3.3V ~ 5.25V
MPF5030BMMA0ESR2

MPF5030BMMA0ESR2

PMIC 3 BUCKS 2 LDO A1 DIE

NXP USA Inc.

0 -
MPF5030BMMA0ESR2

数据表

- 40-PowerVFQFN Tape & Reel (TR) Active System Basis Chip - -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 40-HVQFN (6x6) 3.3V ~ 5.25V
MFS8620BMDA0ESR2

MFS8620BMDA0ESR2

SAFETY SYSTEM BASIS CHIP FOR DOM

NXP USA Inc.

0 -
MFS8620BMDA0ESR2

数据表

- 48-VFQFN Exposed Pad Tape & Reel (TR) Active Camera - -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 48-HVQFN (7x7) 36V
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