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振荡器

制造商 系列 封装/外壳 包装 产品状态 基谐振器 类型 功能 输出 电压 - 电源 高度 - 安装后(最大值) 频率稳定性 绝对拉力范围(APR) 频率 工作温度 扩展频谱带宽 尺寸 / 尺寸 电流 - 电源(最大值) 供应商设备封装 额定值 安装类型

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图片 厂商料号 库存情况 价格 数量 数据表 系列 封装/外壳 包装 产品状态 基谐振器 类型 功能 输出 电压 - 电源 高度 - 安装后(最大值) 频率稳定性 绝对拉力范围(APR) 频率 工作温度 扩展频谱带宽 尺寸 / 尺寸 电流 - 电源(最大值) 供应商设备封装 额定值 安装类型
DSC6111BI1B-012.2880

DSC6111BI1B-012.2880

MEMS OSC., ULTRA LOW POWER, LVCM

Microchip Technology

9,875 -
DSC6111BI1B-012.2880

数据表

DSC61XXB 4-VDFN Tube Active MEMS XO (Standard) Standby (Power Down) CMOS 1.8V ~ 3.3V 0.035" (0.90mm) ±50ppm - 12.288 MHz -40°C ~ 85°C - 0.197" L x 0.126" W (5.00mm x 3.20mm) 3mA (Typ) 4-VDFN (5x3.2) - Surface Mount
DSC6111BI1B-033.3330

DSC6111BI1B-033.3330

MEMS OSC., ULTRA LOW POWER, LVCM

Microchip Technology

7,713 -
DSC6111BI1B-033.3330

数据表

DSC61XXB 4-VDFN Tube Active MEMS XO (Standard) Standby (Power Down) CMOS 1.8V ~ 3.3V 0.035" (0.90mm) ±50ppm - 33.333 MHz -40°C ~ 85°C - 0.197" L x 0.126" W (5.00mm x 3.20mm) 3mA (Typ) 4-VDFN (5x3.2) - Surface Mount
DSC6111BI1B-024.5760

DSC6111BI1B-024.5760

MEMS OSC., ULTRA LOW POWER, LVCM

Microchip Technology

6,938 -
DSC6111BI1B-024.5760

数据表

DSC61XXB 4-VDFN Tube Active MEMS XO (Standard) Standby (Power Down) CMOS 1.8V ~ 3.3V 0.035" (0.90mm) ±50ppm - 24.576 MHz -40°C ~ 85°C - 0.197" L x 0.126" W (5.00mm x 3.20mm) 3mA (Typ) 4-VDFN (5x3.2) - Surface Mount
DSC6111BI1B-048.0000

DSC6111BI1B-048.0000

MEMS OSC., ULTRA LOW POWER, LVCM

Microchip Technology

9,555 -
DSC6111BI1B-048.0000

数据表

DSC61XXB 4-VDFN Tube Active MEMS XO (Standard) Standby (Power Down) CMOS 1.8V ~ 3.3V 0.035" (0.90mm) ±50ppm - 48 MHz -40°C ~ 85°C - 0.197" L x 0.126" W (5.00mm x 3.20mm) 3mA (Typ) 4-VDFN (5x3.2) - Surface Mount
DSC6111BI1B-025.0000

DSC6111BI1B-025.0000

MEMS OSC., ULTRA LOW POWER, LVCM

Microchip Technology

8,960 -
DSC6111BI1B-025.0000

数据表

DSC61XXB 4-VDFN Tube Active MEMS XO (Standard) Standby (Power Down) CMOS 1.8V ~ 3.3V 0.035" (0.90mm) ±50ppm - 25 MHz -40°C ~ 85°C - 0.197" L x 0.126" W (5.00mm x 3.20mm) 3mA (Typ) 4-VDFN (5x3.2) - Surface Mount
DSC6111BI1B-024.0000T

DSC6111BI1B-024.0000T

MEMS OSC., ULTRA LOW POWER, LVCM

Microchip Technology

6,136 -
DSC6111BI1B-024.0000T

数据表

DSC61XXB 4-VDFN Tape & Reel (TR) Active MEMS XO (Standard) Standby (Power Down) CMOS 1.8V ~ 3.3V 0.035" (0.90mm) ±50ppm - 24 MHz -40°C ~ 85°C - 0.197" L x 0.126" W (5.00mm x 3.20mm) 3mA (Typ) 4-VDFN (5x3.2) - Surface Mount
DSC6111BI1B-012.2880T

DSC6111BI1B-012.2880T

MEMS OSC., ULTRA LOW POWER, LVCM

Microchip Technology

9,802 -
DSC6111BI1B-012.2880T

数据表

DSC61XXB 4-VDFN Tape & Reel (TR) Active MEMS XO (Standard) Standby (Power Down) CMOS 1.8V ~ 3.3V 0.035" (0.90mm) ±50ppm - 12.288 MHz -40°C ~ 85°C - 0.197" L x 0.126" W (5.00mm x 3.20mm) 3mA (Typ) 4-VDFN (5x3.2) - Surface Mount
DSC6111BI1B-020.0000T

DSC6111BI1B-020.0000T

MEMS OSC., ULTRA LOW POWER, LVCM

Microchip Technology

4,602 -
DSC6111BI1B-020.0000T

数据表

DSC61XXB 4-VDFN Tape & Reel (TR) Active MEMS XO (Standard) Standby (Power Down) CMOS 1.8V ~ 3.3V 0.035" (0.90mm) ±50ppm - 20 MHz -40°C ~ 85°C - 0.197" L x 0.126" W (5.00mm x 3.20mm) 3mA (Typ) 4-VDFN (5x3.2) - Surface Mount
DSC6111BI1B-025.0000T

DSC6111BI1B-025.0000T

MEMS OSC., ULTRA LOW POWER, LVCM

Microchip Technology

7,606 -
DSC6111BI1B-025.0000T

数据表

DSC61XXB 4-VDFN Tape & Reel (TR) Active MEMS XO (Standard) Standby (Power Down) CMOS 1.8V ~ 3.3V 0.035" (0.90mm) ±50ppm - 25 MHz -40°C ~ 85°C - 0.197" L x 0.126" W (5.00mm x 3.20mm) 3mA (Typ) 4-VDFN (5x3.2) - Surface Mount
DSC6111BI1B-033.3330T

DSC6111BI1B-033.3330T

MEMS OSC., ULTRA LOW POWER, LVCM

Microchip Technology

6,222 -
DSC6111BI1B-033.3330T

数据表

DSC61XXB 4-VDFN Tape & Reel (TR) Active MEMS XO (Standard) Standby (Power Down) CMOS 1.8V ~ 3.3V 0.035" (0.90mm) ±50ppm - 33.333 MHz -40°C ~ 85°C - 0.197" L x 0.126" W (5.00mm x 3.20mm) 3mA (Typ) 4-VDFN (5x3.2) - Surface Mount
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