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振荡器

制造商 系列 封装/外壳 包装 产品状态 基谐振器 类型 功能 输出 电压 - 电源 高度 - 安装后(最大值) 频率稳定性 绝对拉力范围(APR) 频率 工作温度 扩展频谱带宽 尺寸 / 尺寸 电流 - 电源(最大值) 供应商设备封装 额定值 安装类型

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图片 厂商料号 库存情况 价格 数量 数据表 系列 封装/外壳 包装 产品状态 基谐振器 类型 功能 输出 电压 - 电源 高度 - 安装后(最大值) 频率稳定性 绝对拉力范围(APR) 频率 工作温度 扩展频谱带宽 尺寸 / 尺寸 电流 - 电源(最大值) 供应商设备封装 额定值 安装类型
HTM6101CA1B-050.0000

HTM6101CA1B-050.0000

HT-MM900AC-6K-EE-30M0000000

Microchip Technology

4,361 -
HTM6101CA1B-050.0000

数据表

HTM61XX 4-VDFN Tape & Reel (TR) Active MEMS XO (Standard) Enable/Disable CMOS 1.8V, 2.5V, 2.8V, 3V, 3.3V 0.035" (0.90mm) ±50ppm - 50 MHz -40°C ~ 125°C - 0.126" L x 0.098" W (3.20mm x 2.50mm) 4mA (Typ) 4-VDFN (3.2x2.5) - Surface Mount
HTM6101JA1B-028.8000

HTM6101JA1B-028.8000

HIGH TEMP MEMS BASED XO +3.3 VDC

Microchip Technology

3,453 -
HTM6101JA1B-028.8000

数据表

HTM61XX 4-VLGA Tape & Reel (TR) Active MEMS XO (Standard) Enable/Disable CMOS 1.8V, 2.5V, 2.8V, 3V, 3.3V 0.035" (0.89mm) ±50ppm - 28.8 MHz -40°C ~ 125°C - 0.098" L x 0.079" W (2.50mm x 2.00mm) 4mA (Typ) 4-VLGA (2.5x2) - Surface Mount
HTM6101CA1B-025.0000

HTM6101CA1B-025.0000

HIGH TEMP MEMS BASED XO +3.3 VDC

Microchip Technology

2,184 -
HTM6101CA1B-025.0000

数据表

HTM61XX 4-VDFN Tape & Reel (TR) Active MEMS XO (Standard) Enable/Disable CMOS 1.8V, 2.5V, 2.8V, 3V, 3.3V 0.035" (0.90mm) ±50ppm - 25 MHz -40°C ~ 125°C - 0.126" L x 0.098" W (3.20mm x 2.50mm) 4mA (Typ) 4-VDFN (3.2x2.5) - Surface Mount
DSC1522AA3-125M0000

DSC1522AA3-125M0000

MEMS BASED XO +2.5 VDC +/-5% LVD

Microchip Technology

6,560 -
DSC1522AA3-125M0000

数据表

- - Tape & Reel (TR) Active - - - - - - - - - - - - - - - -
HTM6101CA1B-030.0000

HTM6101CA1B-030.0000

HIGH TEMP MEMS BASED XO +3.3 VDC

Microchip Technology

8,249 -
HTM6101CA1B-030.0000

数据表

HTM61XX 4-VDFN Tape & Reel (TR) Active MEMS XO (Standard) Enable/Disable CMOS 1.8V, 2.5V, 2.8V, 3V, 3.3V 0.035" (0.90mm) ±50ppm - 30 MHz -40°C ~ 125°C - 0.126" L x 0.098" W (3.20mm x 2.50mm) 4mA (Typ) 4-VDFN (3.2x2.5) - Surface Mount
M906101JI2B-040.0000

M906101JI2B-040.0000

MEMS BASED XO +3.3 VDC -40C TO +

Microchip Technology

3,566 -
M906101JI2B-040.0000

数据表

M9061XX 4-VLGA Tape & Reel (TR) Active MEMS XO (Standard) Enable/Disable CMOS 1.8V, 2.5V, 2.8V, 3V, 3.3V 0.035" (0.89mm) ±25ppm - 40 MHz -40°C ~ 85°C - 0.098" L x 0.079" W (2.50mm x 2.00mm) 4mA (Typ) 4-VLGA (2.5x2) - Surface Mount
M906111CI3B-080.0000

M906111CI3B-080.0000

MEMS BASED XO +3.3 VDC -40C TO +

Microchip Technology

7,083 -
M906111CI3B-080.0000

数据表

M9061XX 4-VDFN Tape & Reel (TR) Active MEMS XO (Standard) Standby (Power Down) CMOS 1.8V, 2.5V, 2.8V, 3V, 3.3V 0.035" (0.90mm) ±20ppm - 80 MHz -40°C ~ 85°C - 0.126" L x 0.098" W (3.20mm x 2.50mm) 4mA (Typ) 4-VDFN (3.2x2.5) - Surface Mount
M921223CI2-40M00000

M921223CI2-40M00000

MEMS BASED XO +2.5 VDC +/-5% LVD

Microchip Technology

6,718 -
M921223CI2-40M00000

数据表

M9212X3 6-VDFN Tape & Reel (TR) Active MEMS XO (Standard) Enable/Disable LVDS 2.5V, 3.3V 0.035" (0.90mm) ±25ppm - 40 MHz -40°C ~ 85°C - 0.126" L x 0.098" W (3.20mm x 2.50mm) 32mA (Typ) 6-VDFN (3.2x2.5) - Surface Mount
HTM6101CA1B-001.0000

HTM6101CA1B-001.0000

HIGH TEMP MEMS BASED XO +1.8 VDC

Microchip Technology

2,340 -
HTM6101CA1B-001.0000

数据表

HTM61XX 4-VDFN Tape & Reel (TR) Active MEMS XO (Standard) Enable/Disable CMOS 1.8V, 2.5V, 2.8V, 3V, 3.3V 0.035" (0.90mm) ±50ppm - 1 MHz -40°C ~ 125°C - 0.126" L x 0.098" W (3.20mm x 2.50mm) 4mA (Typ) 4-VDFN (3.2x2.5) - Surface Mount
HTM6101AA3B-016.3840

HTM6101AA3B-016.3840

-55C TO +85C, 4 PIN 2.0MMX1.6MM,

Microchip Technology

5,549 -
HTM6101AA3B-016.3840

数据表

HTM61XX 4-VDFN Exposed Pad Tape & Reel (TR) Active MEMS XO (Standard) Enable/Disable CMOS 1.8V, 2.5V, 2.8V, 3V, 3.3V 0.035" (0.90mm) ±20ppm - 16.384 MHz -40°C ~ 125°C - 0.276" L x 0.197" W (7.00mm x 5.00mm) 4mA (Typ) 4-VDFN (7x5) - Surface Mount
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