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振荡器

制造商 系列 封装/外壳 包装 产品状态 基谐振器 类型 功能 输出 电压 - 电源 高度 - 安装后(最大值) 频率稳定性 绝对拉力范围(APR) 频率 工作温度 扩展频谱带宽 尺寸 / 尺寸 电流 - 电源(最大值) 供应商设备封装 额定值 安装类型

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图片 厂商料号 库存情况 价格 数量 数据表 系列 封装/外壳 包装 产品状态 基谐振器 类型 功能 输出 电压 - 电源 高度 - 安装后(最大值) 频率稳定性 绝对拉力范围(APR) 频率 工作温度 扩展频谱带宽 尺寸 / 尺寸 电流 - 电源(最大值) 供应商设备封装 额定值 安装类型
DSC6001HI2B-005.0000T

DSC6001HI2B-005.0000T

MEMS OSC., ULTRA LOW POWER, LVCM

Microchip Technology

4,333 -
DSC6001HI2B-005.0000T

数据表

DSC60XXB 4-VFLGA Tape & Reel (TR) Active MEMS XO (Standard) Enable/Disable CMOS 1.8V ~ 3.3V 0.035" (0.89mm) ±25ppm - 5 MHz -40°C ~ 85°C - 0.063" L x 0.047" W (1.60mm x 1.20mm) 1.3mA (Typ) 4-VFLGA (1.6x1.2) AEC-Q100 Surface Mount
DSC6001HI2B-002.0800

DSC6001HI2B-002.0800

MEMS OSCILLATOR, ULTRA LOW POWER

Microchip Technology

6,432 -
DSC6001HI2B-002.0800

数据表

DSC60XXB 4-VFLGA Bag Active MEMS XO (Standard) Enable/Disable CMOS 1.8V ~ 3.3V 0.035" (0.89mm) ±25ppm - 2.08 MHz -40°C ~ 85°C - 0.063" L x 0.047" W (1.60mm x 1.20mm) 1.3mA (Typ) 4-VFLGA (1.6x1.2) AEC-Q100 Surface Mount
DSC1525MI2A-33M33333

DSC1525MI2A-33M33333

MEMS OSC, LOW JITTER, 33.33333MH

Microchip Technology

9,161 -
DSC1525MI2A-33M33333

数据表

DSC152X 4-VFLGA Bag Active MEMS XO (Standard) Enable/Disable LVCMOS 1.8V 0.035" (0.89mm) ±25ppm - 33.33333 MHz -40°C ~ 85°C - 0.079" L x 0.063" W (2.00mm x 1.60mm) 7.5mA - - Surface Mount
090-02789-011

090-02789-011

SA65 COMMERCIAL NON ROHS

Microchip Technology

8,508 -
090-02789-011

数据表

CSAC SA65 12-DIP Module, 9 Leads Bulk Active Crystal Atomic - CMOS 3.3V 0.460" (11.68mm) ±0.3ppb - 10 MHz -10°C ~ 65°C - 1.600" L x 1.390" W (40.64mm x 35.31mm) - 4-VDFN (3.2x2.5) - Through Hole
DSC6011HI2B-050.0000

DSC6011HI2B-050.0000

MEMS OSC., ULTRA LOW POWER, LVCM

Microchip Technology

5,059 -
DSC6011HI2B-050.0000

数据表

DSC60XXB 4-VFLGA Bag Active MEMS XO (Standard) Standby (Power Down) CMOS 1.8V ~ 3.3V 0.035" (0.89mm) ±25ppm - 50 MHz -40°C ~ 85°C - 0.063" L x 0.047" W (1.60mm x 1.20mm) 1.3mA (Typ) 4-VFLGA (1.6x1.2) AEC-Q100 Surface Mount
DSA6331ML1AB-025.0000VAO

DSA6331ML1AB-025.0000VAO

SPREAD SPECTRUM OSC. FOR AUTO.,

Microchip Technology

5,771 -
DSA6331ML1AB-025.0000VAO

数据表

DSA63XX 4-VFLGA Bag Active MEMS XO (Standard) - LVCMOS 1.8V ~ 3.3V 0.035" (0.89mm) ±50ppm - 25 MHz -40°C ~ 105°C ±0.25%, Center Spread 0.079" L x 0.063" W (2.00mm x 1.60mm) 3mA (Typ) - AEC-Q100 Surface Mount
DSC6013HI2B-024.0000

DSC6013HI2B-024.0000

MEMS OSC., ULTRA LOW POWER, LVCM

Microchip Technology

3,678 -
DSC6013HI2B-024.0000

数据表

DSC60XXB 4-VFLGA Bag Active MEMS XO (Standard) Standby (Power Down) CMOS 1.8V ~ 3.3V 0.035" (0.89mm) ±25ppm - 24 MHz -40°C ~ 85°C - 0.063" L x 0.047" W (1.60mm x 1.20mm) 1.3mA (Typ) 4-VFLGA (1.6x1.2) AEC-Q100 Surface Mount
DSC6111HI2B-033.3300

DSC6111HI2B-033.3300

MEMS OSC., ULTRA LOW POWER, LVCM

Microchip Technology

7,078 -
DSC6111HI2B-033.3300

数据表

DSC61XXB 4-VFLGA Bag Active MEMS XO (Standard) Standby (Power Down) CMOS 1.8V ~ 3.3V 0.035" (0.89mm) ±25ppm - 33.33 MHz -40°C ~ 85°C - 0.063" L x 0.047" W (1.60mm x 1.20mm) 3mA (Typ) 4-VFLGA (1.6x1.2) AEC-Q100 Surface Mount
090-02789-012

090-02789-012

SA65 INDUSTRIAL NON ROHS

Microchip Technology

6,355 -
090-02789-012

数据表

CSAC SA65 12-DIP Module, 9 Leads Bulk Active Crystal Atomic - CMOS 3.3V 0.460" (11.68mm) ±0.3ppb - 10 MHz -40°C ~ 85°C - 1.600" L x 1.390" W (40.64mm x 35.31mm) - 4-VDFN (3.2x2.5) - Through Hole
DSC6101HA1B-025.0000

DSC6101HA1B-025.0000

MEMS OSC., ULTRA LOW POWER, LVCM

Microchip Technology

8,544 -
DSC6101HA1B-025.0000

数据表

DSC61XXB 4-VFLGA Bag Active MEMS XO (Standard) Enable/Disable CMOS 1.8V ~ 3.3V 0.035" (0.89mm) ±50ppm - 25 MHz -40°C ~ 125°C - 0.063" L x 0.047" W (1.60mm x 1.20mm) 3mA (Typ) 4-VFLGA (1.6x1.2) AEC-Q100 Surface Mount
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