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控制器

制造商	系列	封装/外壳	包装	产品状态	控制器类型	电压 - 电源	安装类型	供应商设备封装	工作温度
Advanced Micro Lites AMD Analog Devices Inc./Maxim Integrated Benchmarq Cypress Semiconductor Corp IBM Infineon Technologies Intel Microchip Technology National Semiconductor QuickLogic Renesas Rochester Electronics, LLC ROHM Semiconductor Silicon Designs, Inc. SMSC Texas Instruments	* - 386™ DP8420V DP8422A DP8422V DP8429 DP8440-25 DP84T22 EZ-USB NX2LP-Flex™ EZ-USB NX2LP™ IBM25PPC750FX Intel®940 Intel®E7000 Pentium™	- 100-BQFP 100-QFP Bumpered 1005-BBGA, FCBGA 1077-BBGA, FCBGA 1085-BGA, FCBGA 1202-BGA, FCBGA 1257-BBGA, FCBGA 132-BCPGA 132-BQFP Bumpered 14-DIP (0.300", 7.62mm) 1432-BGA, FCBGA 144-LQFP 16-DIP (0.300", 7.62mm) 16-SOIC (0.154", 3.90mm Width) 16-SOIC (0.295", 7.50mm Width) 16-TSSOP (0.173", 4.40mm Width) 20-DIP (0.300", 7.62mm) 20-SOIC (0.295", 7.50mm Width) 20-TSSOP (0.173", 4.40mm Width) 208-BFQFP 24-DIP (0.300", 7.62mm) 253-LFBGA, FCCSP 28-DIP (0.600", 15.24mm) 28-DIP (0.600", 15.24mm) Socket 28-LCC (J-Lead) 32-DIP (0.600", 15.24mm) Socket 32-LCC (J-Lead) 44-QFP 474-BCBGA Exposed Pad 48-CDIP (0.600", 15.24mm) Window 48-DIP 48-TFBGA, FCCSPBGA 52-CDIP (0.600", 15.24mm) Window 53-TFBGA, FCCSP 544-BBGA 56-VFBGA 56-VFQFN Exposed Pad 68-CLCC 68-CPGA 68-LCC (J-Lead) 8-DIP (0.300", 7.62mm) 8-SOIC (0.154", 3.90mm Width) 84-LCC (J-Lead) 998-BGA, FCBGA Die	Bag Bulk Tape & Reel (TR) Tray Tube	Active Discontinued at InFortune Obsolete	- CompactFlash Controller Hub Dynamic RAM (DRAM) Firmware Hub Graphics and Memory Controller NAND Flash - USB Nonvolatile RAM Nonvolatile SRAM NVMe Controller Smartsocket SRAM Smartwatch RAM Smartwatch ROM Static RAM (SRAM)	- 1.2V 1V ~ 1.1V, 1.425V ~ 1.575V 2.25V ~ 3.6V 2.5V 2.7V ~ 3.6V 3.135V ~ 3.465V 3V ~ 3.6V 4.5V ~ 5.5V 4.75V ~ 5.25V 4.75V ~ 5.5V	- Surface Mount Through Hole	- 100-QFP 100-QFP (14x20) 1005-FCBGA (42.5x42.5) 1077-FCBGA (42.5x42.5) 1085-FCBGA (27x27) 1202-FCBGA (34x34) 1257-FCBGA (40x37.5) 132-CPGA (36.8x36.8) 132-PQFP (24.13x24.13) 14-PDIP 1432-FCBGA (42.5x42.5) 144-TQFP (20x20) 16-PDIP 16-SOIC 16-TSSOP 20-PDIP 20-SOIC 20-TSSOP 208-QFP (28x28) 24-PDIP 253-FCCSP (8x13.5) 28-DIP Socket 28-PDIP 28-PLCC (11.51x11.51) 32-DIP Socket 32-PLCC 44-QFP (10x10) 474-CBGA (25x32) 48-CDIP 48-DIP 48-FCCSP (3x8) 52-CDIP 53-FCCSP (7.5x3) 544-BGA (35x35) 56-QFN (8x8) 56-QFN-EP (8x8) 56-Sawn QFN-EP (8x8) 56-VFBGA (5x5) 68-CLCC 68-CPGA 68-PLCC 68-PLCC (24.21x24.21) 68-PLCC (25.13x25.13) 8-PDIP 8-SOIC 84-PLCC (29.31x29.31) 998-FCBGA (27x27) Die	- -20°C ~ 70°C -25°C ~ 75°C -40°C ~ 105°C (TJ) -40°C ~ 85°C 0°C ~ 70°C 0°C ~ 70°C (TA) 0°C ~ 70°C (TC) 0°C ~ 75°C (TC) 0°C ~ 85°C (TC) 105°C (TC) 99°C (TC)

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结果

图片厂商料号库存情况价格数量数据表系列封装/外壳包装产品状态控制器类型电压 - 电源安装类型供应商设备封装工作温度

25CPC700BB3B66

25CPC700BB3B66

MEMORY CONTROLLER AND PCI BRIDGE

IBM

5,397

-

询价单

数据表

IBM25PPC750FX

474-BCBGA Exposed Pad

Bulk

Active

Dynamic RAM (DRAM)

3.135V ~ 3.465V

Surface Mount

474-CBGA (25x32)

-40°C ~ 105°C (TJ)

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