| 图片 | 厂商料号 | 库存情况 | 价格 | 数量 | 数据表 | 系列 | 封装/外壳 | 包装 | 产品状态 | 功能 | 接口 | 电压 - 电源 | 电流 - 电源 | 功率(瓦特) | 工作温度 | 等级 | 电路数量 | 认证 | 安装类型 | 供应商设备封装 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
CYP15G0201DXB-BBXIIC TELECOM INTERFACE 196FBGA Infineon Technologies |
0 | - |
|
数据表 |
HOTlink II™ | 196-LBGA | Tray | Obsolete | Transceiver | LVTTL | 3.135V ~ 3.465V | 570mA | - | -40°C ~ 65°C | - | 2 | - | Surface Mount | 196-FBGA (15x15) |
|
CYV15G0101DXB-BBXCIC TELECOM INTERFACE 100TBGA Infineon Technologies |
0 | - |
|
数据表 |
HOTlink II™ | 100-LBGA | Tray | Discontinued at Digi-Key | Transceiver | LVTTL | 3.135V ~ 3.465V | 390mA | - | 0°C ~ 70°C | - | - | - | Surface Mount | 100-TBGA (11x11) |
|
CYV15G0201DXB-BBXCIC TELECOM INTERFACE 196FBGA Infineon Technologies |
0 | - |
|
数据表 |
HOTlink II™ | 196-LBGA | Tray | Obsolete | Transceiver | LVTTL | 3.135V ~ 3.465V | 570mA | - | 0°C ~ 70°C | - | 2 | - | Surface Mount | 196-FBGA (15x15) |
|
CYV15G0201DXB-BBXIIC TELECOM INTERFACE 196FBGA Infineon Technologies |
0 | - |
|
数据表 |
HOTlink II™ | 196-LBGA | Tray | Obsolete | Transceiver | LVTTL | 3.135V ~ 3.465V | 570µA | - | -40°C ~ 85°C | - | 2 | - | Surface Mount | 196-FBGA (15x15) |
|
CYV15G0404DXB-BGXCIC TELECOM INTERFACE 256BGA Infineon Technologies |
0 | - |
|
数据表 |
HOTlink II™ | 256-BGA Exposed Pad | Tray | Obsolete | - | LVTTL | 3.135V ~ 3.465V | 900mA | - | 0°C ~ 70°C | - | 4 | - | Surface Mount | 256-L2BGA (27x27) |
|
CYP15G0402DXB-BGXCIC TELECOM INTERFACE 256BGA Infineon Technologies |
0 | - |
|
数据表 |
HOTlink II™ | 256-BGA Exposed Pad | Tray | Obsolete | - | LVTTL | 3.135V ~ 3.465V | 830mA | - | 0°C ~ 70°C | - | 4 | - | Surface Mount | 256-L2BGA (27x27) |
|
CYV15G0403DXB-BGXCIC TELECOM INTERFACE 256BGA Infineon Technologies |
0 | - |
|
数据表 |
HOTlink II™ | 256-BGA Exposed Pad | Tray | Obsolete | Transceiver | LVTTL | 3.135V ~ 3.465V | 900mA | - | 0°C ~ 70°C | - | 4 | - | Surface Mount | 256-L2BGA (27x27) |
|
CYW15G0401DXB-BGXCIC TELECOM INTERFACE 256BGA Infineon Technologies |
0 | - |
|
数据表 |
HOTlink II™ | 256-BGA Exposed Pad | Tray | Obsolete | Transceiver | LVTTL | 3.135V ~ 3.465V | 830mA | - | 0°C ~ 70°C | - | 4 | - | Surface Mount | 256-L2BGA (27x27) |
|
PEB 22554 HT V1.3IC TELECOM INTERFACE TQFP-144 Infineon Technologies |
0 | - |
|
数据表 |
QuadFALC™ | 144-LQFP | Tray | Obsolete | Framer, Line Interface Unit (LIU) | E1, HDLC, J1, PCM, T1 | 3.13V ~ 3.46V | 330mA | 750 mW | -40°C ~ 85°C | - | 4 | - | Surface Mount | PG-TQFP-144-2 |
|
PEB 4264-2 T V1.2IC TELECOM INTERFACE PDSO-20 Infineon Technologies |
0 | - |
|
数据表 |
DuSLIC | 20-SOIC (0.433", 11.00mm Width) Exposed Pad | Tape & Reel (TR) | Obsolete | Dual Channel Subscriber Line Interface Circuit (DuSLIC) | IOM-2, PCM | 3.3V ~ 5V | 105mA | - | - | - | 2 | - | Surface Mount | P-DSO-20-5 |