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传感器和探测器接口

制造商	封装/外壳	系列	包装	产品状态	可编程	类型	输出类型	电流 - 电源	工作温度	等级	认证	输入类型	安装类型	供应商设备封装
ABLIC Inc. Allegro MicroSystems ams-OSRAM USA INC. Analog Devices Inc. Analog Devices Inc./Maxim Integrated Asahi Kasei Microdevices/AKM Atmel Azoteq (Pty) Ltd Broadcom Limited Burr Brown Cirrus Logic Inc. Diodes Incorporated EM Microelectronic Fairchild Semiconductor Freescale Semiconductor - NXP Grayhill Inc. Harris Corporation Infineon Technologies Interlink Electronics Intersil LSI/CSI Lumissil Microsystems MaxLinear, Inc. Melexis Technologies NV Microchip Technology Motorola National Semiconductor NXP Semiconductors onsemi Renesas Renesas Electronics Operations Services Limited ROHM Semiconductor ScioSense Semtech Corporation STMicroelectronics Texas Instruments Triad Magnetics	- 10-PowerTFSOP, 10-MSOP (0.118", 3.00mm Width) 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) 10-VFDFN Exposed Pad 10-WFDFN Exposed Pad 100-LFBGA, CSPBGA 100-TQFP 105-LFBGA, CSPBGA 112-LFBGA, CSPBGA 12-LFLGA 12-WFBGA, WLBGA 12-WFDFN Exposed Pad 12-WFQFN Exposed Pad 12-XFBGA, DSBGA 120-TFBGA 128-LFBGA, CSPBGA 14-CDIP (0.300", 7.62mm) 14-DIP (0.300", 7.62mm) 14-LSSOP (0.173", 4.40mm Width) 14-SOIC (0.154", 3.90mm Width) 14-SOIC (0.295", 7.50mm Width) 14-SSOP (0.209", 5.30mm Width) 14-TSSOP (0.173", 4.40mm Width) 14-VFQFN Exposed Pad 16-CDIP (0.300", 7.62mm) 16-DIP (0.300", 7.62mm) 16-LSOP (0.173", 4.40mm Width) 16-LSSOP (0.173", 4.40mm Width) 16-SOIC (0.154", 3.90mm Width) 16-SOIC (0.154", 3.90mm Width), 14 Leads 16-SOIC (0.173", 4.40mm Width) 16-SOIC (0.295", 7.50mm Width) 16-SSOP (0.154", 3.90mm Width) 16-SSOP (0.209", 5.30mm Width) 16-TSSOP (0.173", 4.40mm Width) 16-TSSOP (0.173", 4.40mm Width) Exposed Pad 16-UFBGA, WLCSP 16-UFQFN Exposed Pad 16-VFQFN 16-VFQFN Exposed Pad 16-VQFN Exposed Pad 16-VQFN Exposed Pad, CSP 16-WFBGA, WLBGA 16-WFQFN Exposed Pad 16-WQFN Exposed Pad 16-XFQFN Exposed Pad 17-UFBGA, WLCSP 18-DIP (0.300", 7.62mm) 18-SOIC (0.295", 7.50mm Width) 18-UFBGA, WLCSP 196-LFBGA, CSPBGA 20-CDIP (0.300", 7.62mm) 20-CLCC 20-LCC (J-Lead) 20-PowerTSSOP (0.173", 4.40mm Width) 20-SOIC (0.295", 7.50mm Width) 20-SOIC (0.295", 7.50mm Width) Exposed Pad 20-SSOP (0.209", 5.30mm Width) 20-TSSOP (0.173", 4.40mm Width) 20-UFQFN Exposed Pad 20-VFQFN Exposed Pad 20-VQFN Exposed Pad 20-WFQFN Exposed Pad 20-WFQFN Exposed Pad, CSP 24-CDIP (0.600", 15.24mm) 24-SOIC (0.295", 7.50mm Width) 24-SSOP (0.154", 3.90mm Width) 24-SSOP (0.209", 5.30mm Width) 24-UFBGA, WLCSP 24-VFQFN Exposed Pad 24-WFBGA, WLBGA 24-WFQFN Exposed Pad 25-TFBGA 28-DIP (0.500", 12.70mm), 22 Leads 28-LCC (J-Lead) 28-LSSOP (0.220", 5.60mm Width) 28-SOIC (0.295", 7.50mm Width) 28-SSOP (0.209", 5.30mm Width) 28-TSSOP (0.173", 4.40mm Width) 28-TSSOP (0.173", 4.40mm Width) Exposed Pad 28-UFQFN Exposed Pad 28-VFQFN Exposed Pad 28-VQFN Exposed Pad 28-WFQFN Exposed Pad 28-WFQFN Exposed Pad, CSP 32-SOP (0.213", 5.40mm Width) 32-TQFP Exposed Pad 32-VFQFN Exposed Pad 32-VFQFN Exposed Pad, 32-MLF® 32-WFQFN Exposed Pad 32-WFQFN Exposed Pad, CSP 33-UFBGA, WLCSP 35-UFBGA, WLCSP 36-UFBGA, DSBGA 36-VFQFN Exposed Pad 36-WFBGA, WLBGA 38-DIP (0.500", 12.70mm), 8 Leads 38-DIP (0.800", 20.32mm), 12 Leads 38-DIP (0.800", 20.32mm), 15 Leads 38-PowerTFSOP (0.173", 4.40mm Width) 38-TFSOP (0.173", 4.40mm Width) Exposed Pad 38-VFLGA Module 40-VFQFN Exposed Pad 40-VFQFN Exposed Pad, CSP 40-WFQFN Exposed Pad 44-BSSOP (0.433", 11.00mm Width) Exposed Pad 44-LCC (J-Lead) 44-LQFP 44-VFQFN Exposed Pad 48-LQFP 48-PowerTQFP 48-TQFP 48-TQFP Exposed Pad 48-VFQFN Exposed Pad 48-VFQFN Exposed Pad, CSP 48-WFQFN Exposed Pad, CSP 49-VFBGA 54-BSSOP (0.295", 7.50mm Width) Exposed Pad 54-SSOP (0.295", 7.50mm Width) Exposed Pad 56-VFQFN Exposed Pad, CSP 56-WFQFN Exposed Pad 6-WDFN Exposed Pad 64-LFBGA, CSPBGA 64-LQFP 64-PowerTQFP 64-QFP 64-VFQFN Exposed Pad 64-VFQFN Exposed Pad, CSP 68-VFQFN Exposed Pad 70-LFBGA 8-CDIP (0.300", 7.62mm) 8-DIP (0.300", 7.62mm) 8-FlipChip 8-SOIC (0.154", 3.90mm Width) 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) 8-UFDFN Exposed Pad 8-VDFN Exposed Pad 8-VFDFN Exposed Pad 84-LFBGA, CSPBGA 84-VFQFN Dual Rows, Exposed Pad 9-UFBGA, WLCSP 9-WFBGA, WLBGA 9-XFBGA, WLCSP 96-LFBGA, CSPBGA Die Module SC-74A, SOT-753 TO-205AA, TO-5-8 Metal Can	* - 65 AD9840 AD9995 cLite™ IQ Switch® ProxFusion® IQ Switch®, ProxFusion™ IQ Switch®, ProxSense® LT® MicroJoystick PICOSTRAIN® QTwo™ TPS ZoomingADC™	- Bag Box Bulk Cut Tape (CT) Strip Tape & Reel (TR) Tray Tube	Active Discontinued at InFortune Last Time Buy Not For New Designs Obsolete	- Not Verified Verified	- ADC, DAC Automotive Battery Management Biometric Sensor Hub Capacitance-to-Digital Converter Capacitive Sensor Capacitive Sensor Controller Capacitive Switch Capacitive Switch Controller Capacitive Touch and Proximity Sensor Capacitive Touch Screen Controller CCD Signal Processor, 10-Bit CCD Signal Processor, 12-Bit CCD Signal Processor, 14-Bit Clock Generator Controller Converter Current Loop Protector Current Transmitter Data Acquisition Data Acquisition System (DAS) Detector Controller Distance Measuring, Preamplifier Distributed Systems Interface Engine Knock Signal Processor Front End Hall Effect Sensor Hall Effect Switch Horn Driver Image Sensor Infrared (IR) Interface Level Shifter Light to Digital Converter Motion Coprocessor Optical Output Driver Piezoelectric - Strain Gauge Power Management Preamplifier Pressure Sensor Programmable Amplifier/Attenuator Proximity Detector R/D Converter Relay/Load Driver Resistive Sensor Conditioner Sensor Interface Sensor Interface - Unprogrammed Sensor Interface, Signal Conditioner Serializer SFP Laser Controller SFP+ Controller Signal Conditioner Signal Processor Smart Sensor Smoke Detector Temperature Sensor Thermocouple Amplifier Thermocouple Conditioner Thermocouple to Digital Converter Time to Flight to Digital Converter Touch Sensor Translator USB Joystick Controller Variable Reluctance	- 1-Wire® 1-Wire®, I2C 1-Wire®, I2C, SPI 2-Wire 3-Wire Serial 3-Wire SPI Serial 4 ~ 20mA 4mA ~ 20mA Analog Analog Voltage Analog, CMOS, Digital Analog, Digital CML CMOS Current Differential Digital Digital, I2C Digital, Serial I2C I2C, 2-Wire Serial I2C, Serial I2C, Serial, SPI I2C, SPI ISO9141 LIN Logic LVDS LVDS, Serial, SPI Parallel Serial Serial, SPI SPI Thermocouple Voltage	- 1 mA 1 µA 1.1 mA 1.2 mA 1.3 mA 1.35 mA 1.4 mA 1.5 mA 1.5 µA 1.6 mA 1.9 µA 10 mA 10 nA 10 µA 100 nA 100 µA 12 mA 12 µA 12.5 mA 120 µA 125 mA 13 mA 13.5 mA 13.6 mA 13.6 µA 133 mA 14 µA 145 mA 15 mA 150 nA 150 µA 160 µA 165 mA 170 µA 173 µA 18 mA 180 µA 184 µA 2 mA 2 µA 2.1 mA 2.3 mA 2.5 mA 2.5 µA 2.57 mA 2.6 mA 2.7 mA 2.8 mA 2.85 mA 2.9 mA 2.95 mA 20 mA 200 µA 225 µA 23 mA 24 mA 25 mA 250 mA 250 µA 27 mA 29 µA 3 mA 3.5 mA 3.5 µA 3.6 µA 3.8 µA 30 mA 30 µA 300 µA 350 µA 360 µA 4 mA 4 µA 4.2 µA 4.5 mA 4.9 mA 40 mA 40 µA 41 mA 457 µA 476 µA 48 mA 495 mA 5 mA 5.3 µA 5.5 mA 50 µA 500 µA 55 mA 550 µA 6 mA 6 µA 6.5 mA 6.8 mA 600 µA 62 µA 7 mA 7.5 mA 70 µA 720 µA 73 mA 75 mA 8 mA 8 µA 8.5 mA 80 mA 80 µA 800 µA 840 µA 86 mA 890 µA 9 mA 9 µA 9.3 mA 90 µA 900 µA 95 mA 950 µA	- -10°C ~ 60°C -10°C ~ 60°C (TA) -20°C ~ 105°C (TA) -20°C ~ 45°C -20°C ~ 70°C -20°C ~ 75°C -20°C ~ 85°C -25°C ~ 105°C (TA) -25°C ~ 70°C (TA) -25°C ~ 75°C -25°C ~ 85°C -30°C ~ 75°C -40°C ~ 100°C -40°C ~ 105°C -40°C ~ 105°C (TA) -40°C ~ 110°C -40°C ~ 115°C -40°C ~ 120°C -40°C ~ 125°C -40°C ~ 125°C (TA) -40°C ~ 125°C (TJ) -40°C ~ 140°C -40°C ~ 150°C -40°C ~ 150°C (TA) -40°C ~ 70°C (TA) -40°C ~ 85°C -40°C ~ 85°C (TA) -40°C ~ 90°C (TA) -40°C ~ 95°C -45°C ~ 125°C -55°C ~ 125°C -55°C ~ 125°C (TA) -55°C ~ 150°C 0°C ~ 50°C 0°C ~ 60°C (TA) 0°C ~ 70°C 0°C ~ 70°C (TA) 0°C ~ 85°C 0°C ~ 85°C (TA) 0°C ~ 90°C 150°C 20°C ~ 85°C 25°C ~ 100°C	- Automotive	- AEC-Q100	- Analog Analog Current Analog Voltage Analog, Digital Analog, Logic, Photodiode Capacitive Capacitive, Inductive CML CMOS CMOS, LVDS Differential Digital Ionization Logic LVDS Parallel Photodiode Photoelectric Serial Thermocouple Thermocouple (J) Thermocouple (K) Thermocouple (Multiple) Ultrasound Voltage	- Panel Mount Surface Mount Surface Mount, Wettable Flank Through Hole	- 0402/SOD-923F 10-HVSSOP 10-MSOP 10-TDFN (3x3) 10-TDFN (3x4) 10-uMAX 10-uMAX/uSOP 10-VSON (3x3) 10-VSON (3x4) 10-VSSOP 100-CSPBGA (9x9) 100-TQFP (14x14) 105-CSPBGA (8x8) 112-CSPBGA (8x8) 12-DIP 12-DSBGA (2.45x1.7) 12-LGA-CAV (2.8x5) 12-MLPD-WEP (4x4) 12-PDIP 12-TDFN (3x3) 12-TQFN (3x3) 12-WLP (2.14x1.56) 12-WSON (4x4) 120-TFBGA (9x9) 128-CSPBGA (9x9) 14-CDIP 14-PDIP 14-QFN (4x4) 14-SO 14-SOIC 14-SSOP 14-SSOP-B 14-TSSOP 16-CDIP 16-CERDIP 16-DIP 16-LFCSP-VQ (4x4) 16-MLPQ (4x4) 16-MLPQ-EP (4x4) 16-PDIP 16-QFN (3x3) 16-QFN (4x4) 16-QSOP 16-SOIC 16-SOP 16-SSOP 16-SSOP-A 16-SSOP-B 16-TSSOP 16-TSSOP-EP 16-UQFN (3x3) 16-VQFN (4x4) 16-WLCSP (1.62x1.62) 16-WLCSP (1.66x1.66) 16-WLCSP (2.46x1.4) 16-WLP (1.55x1.57) 16-WLP (2.45x2.45) 16-WQFN (4x4) 17-WLCSP (2.46x1.4) 18-PDIP 18-SOIC 18-WLCSP (1.62x1.62) 196-CSPBGA (12x12) 20-CDIP 20-CLCC (9x9) 20-HSOIC 20-HTSSOP 20-LFCSP (4x4) 20-MQFN (5x5) 20-PLCC (9x9) 20-QFN (3x3) 20-QFN (4x4) 20-SOIC 20-SSOP 20-TQFN (4x4) 20-TSSOP 20-VQFN (5x5) 24-CDIP 24-QFN (3.5x3.5) 24-QFN (4x4) 24-QFN (4x5) 24-SO 24-SOIC 24-SSOP 24-TQFN (3.5x3.5) 24-TQFN (3x3) 24-TQFN (4x4) 24-VFQFPN (4x4) 24-WLCSP (2.62x1.8) 24-WLP (2.5x1.75) 25-NFBGA (4x4) 28-DIP 28-LFCSP-WQ (4x4) 28-PLCC (11.51x11.51) 28-QFN (6x6) 28-SOIC 28-SSOP 28-SSOP-B 28-TQFN (5x5) 28-TSSOP 28-TSSOP-EP 28-UQFN (4x4) 32-LFCSP-WQ (5x5) 32-MLF® (5x5) 32-QFN 32-QFN (5x5) 32-SSOP-A 32-STQFN (4x4) 32-TQFN (5x5) 32-TQFP (5x5) 33-WLCSP (3.11x2.14) 35-WLCSP (3.11x2.14) 36-DSBGA (3.66x3.66) 36-VQFN (6x6) 36-WLP (2.57x2.57) 38-HTSSOP 38-OLGA (4.1x4.5) 38-TSSOP-EP 40-LFCSP (6x6) 40-LFCSP-VQ (6x6) 40-QFN (5x5) 40-QFN (6x6) 40-TQFN (5x5) 40-VFQFPN (5x5) 44-HSOP 44-MLPQ (7x7) 44-PLCC (16.59x16.59) 44-TQFP (10x10) 48-HTQFP (7x7) 48-LFCSP (7x7) 48-LFCSP-VQ (7x7) 48-LFQFP (7x7) 48-LQFP (7x7) 48-QFN (7x7) 48-QFP (7x7) 48-TQFP (7x7) 48-TQFP-EP (7x7) 49-VFBGA (5x5) 54-SOIC 54-SOIC-EP 56-LFCSP (8x8) 56-LFCSP-VQ (8x8) 56-QFN (7x7) 6-MLPD-W (3x3) 6-TDFN (3x3) 64-CSPBGA (9x9) 64-HTQFP (10x10) 64-LFCSP-VQ (9x9) 64-PQFP (14x14) 64-QFN (9x9) 64-QFP (10x10) 68-QFN (10x10) 70-GQFN (6x10) 8-CERDIP 8-DFN (2x3) 8-DFN (3x3) 8-DIP 8-FlipChip 8-MSOP 8-PDIP 8-QFN (2x2) 8-SO 8-SOIC 8-SON (3x3) 8-uMAX/uSOP 8-VSSOP 8-µMAX 84-AQFN (7x7) 84-CSPBGA (12x6) 84-CSPBGA (6x6) 9-WLCSP (1.53x1.07) 9-WLCSP (1.66x1.66) 9-WLP (1.53x1.53) 96-CSPBGA (8x8) Die Micro8™ Module PG-DSO-14-66 PG-DSO-16 PG-DSO-16-1 PG-LQFP-64 SOT-23-5 TO-5 VQFN020V4040 VQFN028V5050 VQFN16Z3030A Wafer

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厂商料号	价格	数量	数据表	封装/外壳	系列	包装	产品状态	可编程	类型	输出类型	电流 - 电源	工作温度	等级	认证	输入类型	安装类型	供应商设备封装
ZSSC4161DE4R PQFN / 24 / 4X4MM S1 - TAPE&REE Renesas Electronics Corporation	-	询价单	数据表	24-VFQFN Exposed Pad	-	Tape & Reel (TR)	Active	-	Signal Conditioner	1-Wire®, I2C	-	-40°C ~ 150°C	-	-	Differential	Surface Mount	24-QFN (4x4)
MC33793DR2 IC DSI SLAVE FOR R-SENSE 16-SOIC NXP USA Inc.	-	询价单	数据表	16-SOIC (0.154", 3.90mm Width)	-	Tape & Reel (TR)	Obsolete	Not Verified	Distributed Systems Interface	Logic	-	-40°C ~ 150°C	-	-	Logic	Surface Mount	16-SOIC
ZSSC3240CC6B IC SENSOR SIGNAL CONDITIONER Renesas Electronics Corporation	-	询价单	数据表	Die	-	Bulk	Active	Not Verified	Resistive	1-Wire®, I2C, SPI	2.8 mA	-40°C ~ 85°C (TA)	-	-	Analog	Surface Mount	Die
ZSSC3240CC2B IC SENSOR SIGNAL CONDITIONER Renesas Electronics Corporation	-	询价单	数据表	Die	-	Bulk	Active	Not Verified	Resistive	1-Wire®, I2C, SPI	2.8 mA	-40°C ~ 85°C (TA)	-	-	Analog	Surface Mount	Die
ZSSC3240CC5B IC SENSOR SIGNAL CONDITIONER Renesas Electronics Corporation	-	询价单	数据表	Die	-	Bulk	Active	Not Verified	Resistive	1-Wire®, I2C, SPI	2.8 mA	-40°C ~ 85°C (TA)	-	-	Analog	Surface Mount	Die
ZSSC3240CC1B IC SENSOR SIGNAL CONDITIONER Renesas Electronics Corporation	-	询价单	数据表	Die	-	Bulk	Active	Not Verified	Resistive	1-Wire®, I2C, SPI	2.8 mA	-40°C ~ 85°C (TA)	-	-	Analog	Surface Mount	Die
ZSSC4162DE4R PQFN / 24 / 4X4MM SLP - TAPE&RE Renesas Electronics Corporation	-	询价单	数据表	24-VFQFN Exposed Pad	-	Tape & Reel (TR)	Active	-	Signal Conditioner	1-Wire®, I2C	-	-40°C ~ 150°C	-	-	Differential	Surface Mount	24-QFN (4x4)
ZSSC4151CE5R SENSOR SIGNAL CONDITIONER 16TSSO Renesas Electronics Corporation	-	询价单	数据表	16-TSSOP (0.173", 4.40mm Width)	-	Tape & Reel (TR)	Active	-	Signal Conditioner	I2C	7 mA	-40°C ~ 150°C (TA)	Automotive	AEC-Q100	Analog	Surface Mount	16-TSSOP
ZSSC3241DI1C WAFER (SAWN) - FRAME Renesas Electronics Corporation	-	询价单	数据表	Die	-	Tape & Reel (TR)	Active	-	Signal Conditioner	1-Wire®, I2C, SPI	18 mA	-40°C ~ 125°C (TA)	-	-	Analog, Digital	Surface Mount	Wafer
ZSSC3241DI5B WAFER (UNSAWN) - WAFER BOX Renesas Electronics Corporation	-	询价单	数据表	Die	-	Tape & Reel (TR)	Active	-	Signal Conditioner	1-Wire®, I2C, SPI	18 mA	-40°C ~ 125°C (TA)	-	-	Analog, Digital	Surface Mount	Wafer
ZSSC3241DL5B WAFER (UNSAWN) - WAFER BOX Renesas Electronics Corporation	-	询价单	数据表	Die	-	Tape & Reel (TR)	Active	-	Signal Conditioner	1-Wire®, I2C, SPI	18 mA	-40°C ~ 125°C (TA)	-	-	Analog, Digital	Surface Mount	Wafer
ZSSC3241DI5C WAFER (SAWN) - FRAME Renesas Electronics Corporation	-	询价单	数据表	Die	-	Tape & Reel (TR)	Active	-	Signal Conditioner	1-Wire®, I2C, SPI	18 mA	-40°C ~ 125°C (TA)	-	-	Analog, Digital	Surface Mount	Wafer
ZSSC3241DL1B WAFER (UNSAWN) - WAFER BOX Renesas Electronics Corporation	-	询价单	数据表	Die	-	Tape & Reel (TR)	Active	-	Signal Conditioner	1-Wire®, I2C, SPI	18 mA	-40°C ~ 125°C (TA)	-	-	Analog, Digital	Surface Mount	Wafer
ZSSC3241DI1B WAFER (UNSAWN) - WAFER BOX Renesas Electronics Corporation	-	询价单	数据表	Die	-	Tape & Reel (TR)	Active	-	Signal Conditioner	1-Wire®, I2C, SPI	18 mA	-40°C ~ 125°C (TA)	-	-	Analog, Digital	Surface Mount	Wafer
ZSSC3241DL5C WAFER (SAWN) - FRAME Renesas Electronics Corporation	-	询价单	数据表	Die	-	Tape & Reel (TR)	Active	-	Signal Conditioner	1-Wire®, I2C, SPI	18 mA	-40°C ~ 125°C (TA)	-	-	Analog, Digital	Surface Mount	Wafer
ZSSC3241DL1C WAFER (SAWN) - FRAME Renesas	-	询价单	数据表	Die	-	Bulk	Active	-	Signal Conditioner	1-Wire®, I2C, SPI	18 mA	-40°C ~ 125°C (TA)	-	-	Analog, Digital	Surface Mount	Wafer
ZSSC3242EI1B WAFER (UNSAWN) - WAFER BOX Renesas	-	询价单	数据表	-	-	Bulk	Active	-	-	-	-	-	-	-	-	-	-
MC33794EKR2 IC SENSOR ELECTRIC FIELD 54SOIC NXP USA Inc.	-	询价单	数据表	54-BSSOP (0.295", 7.50mm Width) Exposed Pad	-	Tape & Reel (TR)	Obsolete	Not Verified	Sensor Interface	Logic	7 mA	-40°C ~ 85°C	-	-	Logic	Surface Mount	54-SOIC-EP
ZSSC3240CC6B WAFER (UNSAWN) - WAFER BOX Renesas Electronics Corporation	-	询价单	数据表	Die	-	Tray	Active	-	Signal Conditioner	1-Wire®, I2C, SPI	2.8 mA	-40°C ~ 85°C (TA)	-	-	Analog	Surface Mount	Die
ZSSC3240CC5B WAFER (UNSAWN) - WAFER BOX Renesas Electronics Corporation	-	询价单	数据表	Die	-	Tray	Active	-	Signal Conditioner	1-Wire®, I2C, SPI	2.8 mA	-40°C ~ 85°C (TA)	-	-	Analog	Surface Mount	Die

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