| 图片 | 厂商料号 | 库存情况 | 价格 | 数量 | 数据表 | 系列 | 封装/外壳 | 包装 | 产品状态 | 类型 | 材料 - 芯 | 容差 | 电流额定值(安培) | 饱和电流 (Isat) | 供应商设备封装 | 屏蔽 | 直流电阻 (DCR) | 电感 | 品质因数 (Q) @ 频率 | 频率 - 自谐振 | 安装类型 | 额定值 | 尺寸 / 尺寸 | 特性 | 工作温度 | 电感频率 - 测试 | 高度 - 安装后(最大值) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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WCI2012CPR68JDGCHIP IND 2012,680NH,J,23Q,0.19A, INPAQ Technology Co., Ltd |
14,920 | - |
|
数据表 |
WCI2012CP | 0805 (2012 Metric) | Tape & Reel (TR) | Active | Wirewound | Ceramic | ±5% | 190 mA | - | 0805 | Unshielded | 2.2Ohm Max | 680 nH | 23 @ 50MHz | 188MHz | Surface Mount | - | 0.090" L x 0.068" W (2.29mm x 1.73mm) | - | -25°C ~ 125°C | 25 MHz | 0.060" (1.52mm) |
|
WCI2012CPR10JDGCHIP IND 2012,100NH,J,65Q,0.4A,3 INPAQ Technology Co., Ltd |
14,915 | - |
|
数据表 |
WCI2012CP | 0805 (2012 Metric) | Tape & Reel (TR) | Active | Wirewound | Ceramic | ±5% | 400 mA | - | 0805 | Unshielded | 460mOhm Max | 100 nH | 65 @ 500MHz | 1.2GHz | Surface Mount | - | 0.090" L x 0.068" W (2.29mm x 1.73mm) | - | -25°C ~ 125°C | 150 MHz | 0.060" (1.52mm) |
|
WCI2012CP36NGDGCHIP IND 2012,36NH,G,55Q,0.5A,3K INPAQ Technology Co., Ltd |
14,885 | - |
|
数据表 |
WCI2012CP | 0805 (2012 Metric) | Tape & Reel (TR) | Active | Wirewound | Ceramic | ±2% | 500 mA | - | 0805 | Unshielded | 270mOhm Max | 36 nH | 55 @ 500MHz | 1.7GHz | Surface Mount | - | 0.090" L x 0.068" W (2.29mm x 1.73mm) | - | -25°C ~ 125°C | 250 MHz | 0.060" (1.52mm) |
|
WCI2012CPR15GDGCHIP IND 2012,150NH,G,50Q,0.4A,3 INPAQ Technology Co., Ltd |
14,798 | - |
|
数据表 |
WCI2012CP | 0805 (2012 Metric) | Tape & Reel (TR) | Active | Wirewound | Ceramic | ±2% | 400 mA | - | 0805 | Unshielded | 560mOhm Max | 150 nH | 50 @ 250MHz | 920MHz | Surface Mount | - | 0.090" L x 0.068" W (2.29mm x 1.73mm) | - | -25°C ~ 125°C | 100 MHz | 0.060" (1.52mm) |
|
WIP252010S-R24MLDGPOWER INDUCTOR 2520 0.24UH 20% D INPAQ Technology Co., Ltd |
14,784 | - |
|
数据表 |
WIP252010S L | 1008 (2520 Metric) | Tape & Reel (TR) | Active | Wirewound | Iron Powder | ±20% | 6 A | 8A | 1008 | Shielded | 14.5mOhm Max | 240 nH | - | 120MHz | Surface Mount | - | 0.098" L x 0.079" W (2.50mm x 2.00mm) | - | -40°C ~ 125°C | 1 MHz | 0.039" (1.00mm) |
|
WIP201610S-R33MLDGPOWER INDUCTOR 2016 0.33UH 20% D INPAQ Technology Co., Ltd |
14,755 | - |
|
数据表 |
WIP201610S L | 0806 (2016 Metric) | Tape & Reel (TR) | Active | Wirewound | Iron Powder | ±20% | 4.2 A | 6.1A | 0806 | Shielded | 26mOhm Max | 330 nH | - | 120MHz | Surface Mount | - | 0.079" L x 0.063" W (2.00mm x 1.60mm) | - | -40°C ~ 125°C | 1 MHz | 0.039" (1.00mm) |
|
WIP252010S-R47MLDGPOWER INDUCTOR 2520 0.47UH 20% D INPAQ Technology Co., Ltd |
14,736 | - |
|
数据表 |
WIP252010S L | 1008 (2520 Metric) | Tape & Reel (TR) | Active | Wirewound | Iron Powder | ±20% | 4.4 A | 6A | 1008 | Shielded | 29mOhm Max | 470 nH | - | 120MHz | Surface Mount | - | 0.098" L x 0.079" W (2.50mm x 2.00mm) | - | -40°C ~ 125°C | 1 MHz | 0.039" (1.00mm) |
|
WIP201612S-2R2MLDGPOWER INDUCTOR 2016 2.2UH 20% DC INPAQ Technology Co., Ltd |
14,673 | - |
|
数据表 |
WIP201612S L | 0806 (2016 Metric) | Tape & Reel (TR) | Active | Wirewound | Metal | ±20% | 2.2 A | 2.1A | 0806 | Shielded | 110mOhm Max | 2.2 µH | - | 50MHz | Surface Mount | - | 0.079" L x 0.063" W (2.00mm x 1.60mm) | - | -40°C ~ 125°C | 1 MHz | 0.047" (1.20mm) |
|
WCI2012CPR22GDGCHIP IND 2012,220NH,G,50Q,0.4A,3 INPAQ Technology Co., Ltd |
14,655 | - |
|
数据表 |
WCI2012CP | 0805 (2012 Metric) | Tape & Reel (TR) | Active | Wirewound | Ceramic | ±2% | 400 mA | - | 0805 | Unshielded | 700mOhm Max | 220 nH | 50 @ 250MHz | 850MHz | Surface Mount | - | 0.090" L x 0.068" W (2.29mm x 1.73mm) | - | -25°C ~ 125°C | 100 MHz | 0.060" (1.52mm) |
|
WIP201610S-R47MLDGPOWER INDUCTOR 2016 0.47UH 20% D INPAQ Technology Co., Ltd |
14,641 | - |
|
数据表 |
WIP201610S L | 0806 (2016 Metric) | Tape & Reel (TR) | Active | Wirewound | Iron Powder | ±20% | 4.1 A | 5.3A | 0806 | Shielded | 30mOhm Max | 470 nH | - | 120MHz | Surface Mount | - | 0.079" L x 0.063" W (2.00mm x 1.60mm) | - | -40°C ~ 125°C | 1 MHz | 0.039" (1.00mm) |