| 图片 | 厂商料号 | 库存情况 | 价格 | 数量 | 数据表 | 系列 | 封装/外壳 | 包装 | 产品状态 | 类型 | 材料 - 芯 | 容差 | 电流额定值(安培) | 饱和电流 (Isat) | 供应商设备封装 | 屏蔽 | 直流电阻 (DCR) | 电感 | 品质因数 (Q) @ 频率 | 频率 - 自谐振 | 安装类型 | 额定值 | 尺寸 / 尺寸 | 特性 | 工作温度 | 电感频率 - 测试 | 高度 - 安装后(最大值) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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WCI1005CP19NGDGCHIP IND 1005,19.0NH,G,24Q,0.48A INPAQ Technology Co., Ltd |
18,715 | - |
|
数据表 |
WCI1005CP | 0402 (1005 Metric) | Tape & Reel (TR) | Active | Wirewound | Ceramic | ±2% | 480 mA | - | 0402 | Unshielded | 200mOhm Max | 19 nH | 60 @ 900MHz | 3.04GHz | Surface Mount | - | 0.047" L x 0.025" W (1.19mm x 0.64mm) | - | -25°C ~ 125°C | 250 MHz | 0.026" (0.66mm) |
|
WIP201612S-R47MLDGPOWER INDUCTOR 2016 0.47UH 20% D INPAQ Technology Co., Ltd |
15,000 | - |
|
数据表 |
WIP201612S L | 0806 (2016 Metric) | Tape & Reel (TR) | Active | Wirewound | Metal | ±20% | 4.6 A | 5A | 0806 | Shielded | 28mOhm Max | 470 nH | - | 120MHz | Surface Mount | - | 0.079" L x 0.063" W (2.00mm x 1.60mm) | - | -40°C ~ 125°C | 1 MHz | 0.047" (1.20mm) |
|
WIP252010S-3R3MLDGPOWER INDUCTOR 2520 3.3UH 20% DC INPAQ Technology Co., Ltd |
15,000 | - |
|
数据表 |
WIP252010S L | 1008 (2520 Metric) | Tape & Reel (TR) | Active | Wirewound | Iron Powder | ±20% | 1.6 A | 2.2A | 1008 | Shielded | 160mOhm Max | 3.3 µH | - | 40MHz | Surface Mount | - | 0.098" L x 0.079" W (2.50mm x 2.00mm) | - | -40°C ~ 125°C | 1 MHz | 0.039" (1.00mm) |
|
WCI2012CPR27GDGCHIP IND 2012,270NH,G,48Q,0.35A, INPAQ Technology Co., Ltd |
15,000 | - |
|
数据表 |
WCI2012CP | 0805 (2012 Metric) | Tape & Reel (TR) | Active | Wirewound | Ceramic | ±2% | 350 mA | - | 0805 | Unshielded | 1.15Ohm Max | 270 nH | 48 @ 250MHz | 650MHz | Surface Mount | - | 0.090" L x 0.068" W (2.29mm x 1.73mm) | - | -25°C ~ 125°C | 100 MHz | 0.060" (1.52mm) |
|
WCI2012CPR18GDGCHIP IND 2012,180NH,G,50Q,0.4A,3 INPAQ Technology Co., Ltd |
15,000 | - |
|
数据表 |
WCI2012CP | 0805 (2012 Metric) | Tape & Reel (TR) | Active | Wirewound | Ceramic | ±2% | 400 mA | - | 0805 | Unshielded | 640mOhm Max | 180 nH | 50 @ 250MHz | 870MHz | Surface Mount | - | 0.090" L x 0.068" W (2.29mm x 1.73mm) | - | -25°C ~ 125°C | 100 MHz | 0.060" (1.52mm) |
|
WIP252010S-R33MLDGPOWER INDUCTOR 2520 0.33UH 20% D INPAQ Technology Co., Ltd |
15,000 | - |
|
数据表 |
WIP252010S L | 1008 (2520 Metric) | Tape & Reel (TR) | Active | Wirewound | Iron Powder | ±20% | 4.8 A | 7A | 1008 | Shielded | 22mOhm Max | 330 nH | - | 120MHz | Surface Mount | - | 0.098" L x 0.079" W (2.50mm x 2.00mm) | - | -40°C ~ 125°C | 1 MHz | 0.039" (1.00mm) |
|
WCI2012CPR12GDGCHIP IND 2012,120NH,G,50Q,0.4A,3 INPAQ Technology Co., Ltd |
15,000 | - |
|
数据表 |
WCI2012CP | 0805 (2012 Metric) | Tape & Reel (TR) | Active | Wirewound | Ceramic | ±2% | 400 mA | - | 0805 | Unshielded | 510mOhm Max | 120 nH | 50 @ 250MHz | 1.1GHz | Surface Mount | - | 0.090" L x 0.068" W (2.29mm x 1.73mm) | - | -25°C ~ 125°C | 150 MHz | 0.060" (1.52mm) |
|
WIP201612S-1R0MLDGPOWER INDUCTOR 2016 1.0UH 20% DC INPAQ Technology Co., Ltd |
14,990 | - |
|
数据表 |
WIP201612S L | 0806 (2016 Metric) | Tape & Reel (TR) | Active | Wirewound | Metal | ±20% | 3.1 A | 3.8A | 0806 | Shielded | 58mOhm Max | 1 µH | - | 80MHz | Surface Mount | - | 0.079" L x 0.063" W (2.00mm x 1.60mm) | - | -40°C ~ 125°C | 1 MHz | 0.047" (1.20mm) |
|
WCI2012CP68NGDGCHIP IND 2012,68NH,G,60Q,0.5A,3K INPAQ Technology Co., Ltd |
14,990 | - |
|
数据表 |
WCI2012CP | 0805 (2012 Metric) | Tape & Reel (TR) | Active | Wirewound | Ceramic | ±2% | 500 mA | - | 0805 | Unshielded | 380mOhm Max | 68 nH | 60 @ 500MHz | 1.45GHz | Surface Mount | - | 0.090" L x 0.068" W (2.29mm x 1.73mm) | - | -25°C ~ 125°C | 200 MHz | 0.060" (1.52mm) |
|
WIP252010S-R68MLDGPOWER INDUCTOR 2520 0.68UH 20% D INPAQ Technology Co., Ltd |
14,980 | - |
|
数据表 |
WIP252010S L | 1008 (2520 Metric) | Tape & Reel (TR) | Active | Wirewound | Iron Powder | ±20% | 3.7 A | 5A | 1008 | Shielded | 36mOhm Max | 680 nH | - | 90MHz | Surface Mount | - | 0.098" L x 0.079" W (2.50mm x 2.00mm) | - | -40°C ~ 125°C | 1 MHz | 0.039" (1.00mm) |