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系统级芯片(SoC)

制造商 系列 封装/外壳 包装 产品状态 架构 核心处理器 RAM 大小 外设 连接性 速度 主要属性 闪存大小 工作温度 等级 认证 供应商设备封装

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图片 厂商料号 库存情况 价格 数量 数据表 系列 封装/外壳 包装 产品状态 架构 核心处理器 RAM 大小 外设 连接性 速度 主要属性 闪存大小 工作温度 等级 认证 供应商设备封装
XCVE1752-2LLENSVG1369

XCVE1752-2LLENSVG1369

IC VERSAL AI-EDGE FPGA 1369BGA

AMD

0 -
XCVE1752-2LLENSVG1369

数据表

Versal™ AI Core 1369-BFBGA, FCBGA Tray Active MPU, FPGA Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ - DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 450MHz, 1.08GHz Versal™ AI Core FPGA, 1M Logic Cells - 0°C ~ 100°C (TJ) - - 1369-FCBGA (35x35)
AGIB019R18A1E1V

AGIB019R18A1E1V

IC FPGA AGILEX-I 1805FBGA

Intel

0 -
AGIB019R18A1E1V

数据表

Agilex I - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.9M Logic Elements - 0°C ~ 100°C (TJ) - - -
AGIB019R18A1E1VB

AGIB019R18A1E1VB

IC FPGA AGILEX-I 1805BGA

Intel

0 -
AGIB019R18A1E1VB

数据表

Agilex I 1805-BBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.9M Logic Elements - 0°C ~ 100°C (TJ) - - 1805-BGA (42.5x42.5)
AGFC023R24C2E1VB

AGFC023R24C2E1VB

IC FPGA AGILEX-F 2340BGA

Intel

0 -
AGFC023R24C2E1VB

数据表

Agilex F 2340-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.3M Logic Elements - 0°C ~ 100°C (TJ) - - 2340-BGA (45x42)
AGFC023R24C2E1V

AGFC023R24C2E1V

AGFC023R24C2E1V

Intel

0 -
AGFC023R24C2E1V

数据表

Agilex F 2340-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.3M Logic Elements - 0°C ~ 100°C (TJ) - - 2340-BGA (45x42)
AGFD023R24C2E1VB

AGFD023R24C2E1VB

IC FPGA AGILEX-F 2340BGA

Intel

0 -
AGFD023R24C2E1VB

数据表

Agilex F 2340-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.3M Logic Elements - 0°C ~ 100°C (TJ) - - 2340-BGA (45x42)
AGFD023R24C2E1V

AGFD023R24C2E1V

AGFD023R24C2E1V

Intel

0 -
AGFD023R24C2E1V

数据表

Agilex F 2340-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.3M Logic Elements - 0°C ~ 100°C (TJ) - - 2340-BGA (45x42)
AGFA027R24C2E3E

AGFA027R24C2E3E

IC FPGA AGILEX-F 2340FBGA

Intel

0 -
AGFA027R24C2E3E

数据表

Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.7M Logic Elements - 0°C ~ 100°C (TJ) - - -
AGFA027R24C2E2V

AGFA027R24C2E2V

IC FPGA AGILEX-F 2340FBGA

Intel

0 -
AGFA027R24C2E2V

数据表

Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.7M Logic Elements - 0°C ~ 100°C (TJ) - - -
AGFA027R24C2E2VB

AGFA027R24C2E2VB

IC FPGA AGILEX-F 2340BGA

Intel

0 -
AGFA027R24C2E2VB

数据表

Agilex F 2340-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.7M Logic Elements - 0°C ~ 100°C (TJ) - - 2340-BGA (45x42)
AGFA027R24C2E2VR2

AGFA027R24C2E2VR2

IC FPGA AGILEX-F 2340FBGA

Intel

0 -
AGFA027R24C2E2VR2

数据表

Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.7M Logic Elements - 0°C ~ 100°C (TJ) - - -
AGFB027R24C2E2V

AGFB027R24C2E2V

IC FPGA AGILEX-F 2340FBGA

Intel

0 -
AGFB027R24C2E2V

数据表

Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.7M Logic Elements - 0°C ~ 100°C (TJ) - - -
AGFB027R24C2E3E

AGFB027R24C2E3E

IC FPGA AGILEX-F 2340FBGA

Intel

0 -
AGFB027R24C2E3E

数据表

Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.7M Logic Elements - 0°C ~ 100°C (TJ) - - -
AGFB027R24C2E2VB

AGFB027R24C2E2VB

IC FPGA AGILEX-F 2340BGA

Intel

0 -
AGFB027R24C2E2VB

数据表

Agilex F 2340-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.7M Logic Elements - 0°C ~ 100°C (TJ) - - 2340-BGA (45x42)
AGFB027R24C2E2VR2

AGFB027R24C2E2VR2

IC FPGA AGILEX-F 2340FBGA

Intel

0 -
AGFB027R24C2E2VR2

数据表

Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.7M Logic Elements - 0°C ~ 100°C (TJ) - - -
XCZU46DR-1FSVH1760I

XCZU46DR-1FSVH1760I

IC ZUP RFSOC A53 FPGA 1760BGA

AMD

0 -
XCZU46DR-1FSVH1760I

数据表

Zynq® UltraScale+™ RFSoC 1760-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ 256KB DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 500MHz, 1.2GHz Zynq®UltraScale+™ FPGA, 930K+ Logic Cells - -40°C ~ 100°C (TJ) - - 1760-FCBGA (42.5x42.5)
XCZU46DR-1FFVH1760I

XCZU46DR-1FFVH1760I

IC ZUP RFSOC A53 FPGA 1760BGA

AMD

0 -
XCZU46DR-1FFVH1760I

数据表

Zynq® UltraScale+™ RFSoC 1760-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ 256KB DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 500MHz, 1.2GHz Zynq®UltraScale+™ FPGA, 930K+ Logic Cells - -40°C ~ 100°C (TJ) - - 1760-FCBGA (42.5x42.5)
XCVC1902-1LSEVSVD1760

XCVC1902-1LSEVSVD1760

IC VERSAL AICORE FPGA 1760BGA

AMD

0 -
XCVC1902-1LSEVSVD1760

数据表

Versal™ AI Core 1760-BFBGA, FCBGA Tray Active MPU, FPGA Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ 256KB DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 400MHz, 1GHz Versal™ AI Core FPGA, 1.9M Logic Cells - 0°C ~ 100°C (TJ) - - 1760-FCBGA (40x40)
XCVC1902-1MSIVIVA1596

XCVC1902-1MSIVIVA1596

IC VERSAL AICORE FPGA 1596BGA

AMD

0 -
XCVC1902-1MSIVIVA1596

数据表

Versal™ AI Core 1596-BFBGA, FCBGA Tray Active MPU, FPGA Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ 256KB DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 600MHz, 1.3GHz Versal™ AI Core FPGA, 1.9M Logic Cells - -40°C ~ 100°C (TJ) - - 1596-FCBGA (40x40)
XCVC1902-2MSEVIVA1596

XCVC1902-2MSEVIVA1596

IC VERSAL AICORE FPGA 1596BGA

AMD

0 -
XCVC1902-2MSEVIVA1596

数据表

Versal™ AI Core 1596-BFBGA, FCBGA Tray Active MPU, FPGA Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ 256KB DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 600MHz, 1.4GHz Versal™ AI Core FPGA, 1.9M Logic Cells - 0°C ~ 100°C (TJ) - - 1596-FCBGA (40x40)
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