富聪科技订单满¥1000免运费
关注我们:

系统级芯片(SoC)

制造商 系列 封装/外壳 包装 产品状态 架构 核心处理器 RAM 大小 外设 连接性 速度 主要属性 闪存大小 工作温度 等级 认证 供应商设备封装

全部重置
全部应用
结果
图片 厂商料号 库存情况 价格 数量 数据表 系列 封装/外壳 包装 产品状态 架构 核心处理器 RAM 大小 外设 连接性 速度 主要属性 闪存大小 工作温度 等级 认证 供应商设备封装
XCZU48DR-1FFVE1156I

XCZU48DR-1FFVE1156I

IC ZUP RFSOC A53 FPGA 1156BGA

AMD

0 -
XCZU48DR-1FFVE1156I

数据表

Zynq® UltraScale+™ RFSoC 1156-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ 256KB DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 500MHz, 1.2GHz Zynq®UltraScale+™ FPGA, 930K+ Logic Cells - -40°C ~ 100°C (TJ) - - 1156-FCBGA (35x35)
XCZU48DR-1FSVE1156I

XCZU48DR-1FSVE1156I

IC ZUP RFSOC A53 FPGA 1156BGA

AMD

0 -
XCZU48DR-1FSVE1156I

数据表

Zynq® UltraScale+™ RFSoC 1156-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ 256KB DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 500MHz, 1.2GHz Zynq®UltraScale+™ FPGA, 930K+ Logic Cells - -40°C ~ 100°C (TJ) - - 1156-FCBGA (35x35)
1SX250HH1F55I1VG

1SX250HH1F55I1VG

IC FPGA STRATIX 10 2912FBGA

Intel

0 -
1SX250HH1F55I1VG

数据表

Stratix® 10 SX 2912-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.5GHz FPGA - 2500K Logic Elements - -40°C ~ 100°C (TJ) - - 2912-FBGA, FC (55x55)
XCVE2602-2HSINSVH1369

XCVE2602-2HSINSVH1369

XCVE2602-2HSINSVH1369

AMD

0 -
XCVE2602-2HSINSVH1369

数据表

- - Bulk Active - - - - - - - - - - - -
AGFA019R24C2I1VB

AGFA019R24C2I1VB

IC FPGA AGILEX-F 2340BGA

Intel

0 -
AGFA019R24C2I1VB

数据表

Agilex F 2340-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.9M Logic Elements - -40°C ~ 100°C (TJ) - - 2340-BGA (45x42)
AGFA019R24C2I1V

AGFA019R24C2I1V

AGFA019R24C2I1V

Intel

0 -
AGFA019R24C2I1V

数据表

Agilex F 2340-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.9M Logic Elements - -40°C ~ 100°C (TJ) - - 2340-BGA (45x42)
XCVC1702-2LSENSVG1369

XCVC1702-2LSENSVG1369

IC VERSAL AI-CORE FPGA 1369BGA

AMD

0 -
XCVC1702-2LSENSVG1369

数据表

Versal™ AI Core 1369-BFBGA, FCBGA Tray Active MPU, FPGA Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ - DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 450MHz, 1.08GHz Versal™ AI Core FPGA, 1M Logic Cells - 0°C ~ 100°C (TJ) - - 1369-FCBGA (35x35)
XCVC1702-1LSINSVG1369

XCVC1702-1LSINSVG1369

IC VERSAL AI-CORE FPGA 1369BGA

AMD

0 -
XCVC1702-1LSINSVG1369

数据表

Versal™ AI Core 1369-BFBGA, FCBGA Tray Active MPU, FPGA Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ - DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 400MHz, 1GHz Versal™ AI Core FPGA, 1M Logic Cells - -40°C ~ 100°C (TJ) - - 1369-FCBGA (35x35)
XCVC1702-1MLINSVG1369

XCVC1702-1MLINSVG1369

IC VERSAL AI-CORE FPGA 1369BGA

AMD

0 -
XCVC1702-1MLINSVG1369

数据表

Versal™ AI Core 1369-BFBGA, FCBGA Tray Active MPU, FPGA Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ 256KB DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 600MHz, 1.3GHz Versal™ AI Core FPGA, 1M Logic Cells - -40°C ~ 110°C (TJ) - - 1369-FCBGA (35x35)
XCVC1702-2MLENSVG1369

XCVC1702-2MLENSVG1369

IC VERSAL AI-CORE FPGA 1369BGA

AMD

0 -
XCVC1702-2MLENSVG1369

数据表

Versal™ AI Core 1369-BFBGA, FCBGA Tray Active MPU, FPGA Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ 256KB DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 600MHz, 1.4GHz Versal™ AI Core FPGA, 1M Logic Cells - 0°C ~ 110°C (TJ) - - 1369-FCBGA (35x35)
AGFB019R24C2I1VB

AGFB019R24C2I1VB

IC FPGA AGILEX-F 2340BGA

Intel

0 -
AGFB019R24C2I1VB

数据表

Agilex F 2340-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.9M Logic Elements - -40°C ~ 100°C (TJ) - - 2340-BGA (45x42)
AGFB019R24C2I1V

AGFB019R24C2I1V

AGFB019R24C2I1V

Intel

0 -
AGFB019R24C2I1V

数据表

Agilex F 2340-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.9M Logic Elements - -40°C ~ 100°C (TJ) - - 2340-BGA (45x42)
1SX250HN1F43I1VG

1SX250HN1F43I1VG

IC FPGA STRATIX 10 1760FBGA

Intel

0 -
1SX250HN1F43I1VG

数据表

Stratix® 10 SX 1760-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.5GHz FPGA - 2500K Logic Elements - -40°C ~ 100°C (TJ) - - 1760-FBGA (42.5x42.5)
1SX250HU1F50E1VG

1SX250HU1F50E1VG

IC FPGA STRATIX 10 2397FBGA

Intel

0 -
1SX250HU1F50E1VG

数据表

Stratix® 10 SX 2397-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.5GHz FPGA - 2500K Logic Elements - 0°C ~ 100°C (TJ) - - 2397-FBGA, FC (50x50)
XCZU43DR-2FSVE1156I

XCZU43DR-2FSVE1156I

IC ZUP RFSOC A53 FPGA 1156BGA

AMD

0 -
XCZU43DR-2FSVE1156I

数据表

Zynq® UltraScale+™ RFSoC 1156-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ 256KB DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 533MHz, 1.333GHz Zynq®UltraScale+™ FPGA, 930K+ Logic Cells - -40°C ~ 100°C (TJ) - - 1156-FCBGA (35x35)
XCZU47DR-2FFVE1156I

XCZU47DR-2FFVE1156I

IC ZUP RFSOC A53 FPGA 1156BGA

AMD

0 -
XCZU47DR-2FFVE1156I

数据表

Zynq® UltraScale+™ RFSoC 1156-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 533MHz, 1.333GHz Zynq®UltraScale+™ FPGA, 930K+ Logic Cells - -40°C ~ 100°C (TJ) - - 1156-FCBGA (35x35)
XCZU43DR-2FFVE1156I

XCZU43DR-2FFVE1156I

IC ZUP RFSOC A53 FPGA 1156BGA

AMD

0 -
XCZU43DR-2FFVE1156I

数据表

Zynq® UltraScale+™ RFSoC 1156-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ 256KB DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 533MHz, 1.333GHz Zynq®UltraScale+™ FPGA, 930K+ Logic Cells - -40°C ~ 100°C (TJ) - - 1156-FCBGA (35x35)
XCZU47DR-2FSVE1156I

XCZU47DR-2FSVE1156I

IC ZUP RFSOC A53 FPGA 1156BGA

AMD

0 -
XCZU47DR-2FSVE1156I

数据表

Zynq® UltraScale+™ RFSoC 1156-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 533MHz, 1.333GHz Zynq®UltraScale+™ FPGA, 930K+ Logic Cells - -40°C ~ 100°C (TJ) - - 1156-FCBGA (35x35)
1SX280LU2F50E2LG

1SX280LU2F50E2LG

IC SOC CORTEX-A53 1.5GHZ 2397BGA

Intel

0 -
1SX280LU2F50E2LG

数据表

Stratix® 10 SX 2397-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.5GHz FPGA - 2800K Logic Elements - 0°C ~ 100°C (TJ) - - 2397-FBGA, FC (50x50)
1SX280LU3F50I2LG

1SX280LU3F50I2LG

IC SOC CORTEX-A53 1.5GHZ 2397BGA

Intel

0 -
1SX280LU3F50I2LG

数据表

Stratix® 10 SX 2397-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.5GHz FPGA - 2800K Logic Elements - -40°C ~ 100°C (TJ) - - 2397-FBGA, FC (50x50)
富聪科技

搜索

富聪科技

产品

富聪科技

电话

富聪科技

用户