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系统级芯片(SoC)

制造商 系列 封装/外壳 包装 产品状态 架构 核心处理器 RAM 大小 外设 连接性 速度 主要属性 闪存大小 工作温度 等级 认证 供应商设备封装

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图片 厂商料号 库存情况 价格 数量 数据表 系列 封装/外壳 包装 产品状态 架构 核心处理器 RAM 大小 外设 连接性 速度 主要属性 闪存大小 工作温度 等级 认证 供应商设备封装
AGFB019R24C2I2VB

AGFB019R24C2I2VB

IC FPGA AGILEX-F 2340BGA

Intel

0 -
AGFB019R24C2I2VB

数据表

Agilex F 2340-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.9M Logic Elements - -40°C ~ 100°C (TJ) - - 2340-BGA (45x42)
AGFB019R24C2I3E

AGFB019R24C2I3E

IC FPGA AGILEX-F 2340BGA

Intel

0 -
AGFB019R24C2I3E

数据表

Agilex F 2340-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.9M Logic Elements - -40°C ~ 100°C (TJ) - - 2340-BGA (45x42)
AGFB019R24C2I2V

AGFB019R24C2I2V

AGFB019R24C2I2V

Intel

0 -
AGFB019R24C2I2V

数据表

Agilex F 2340-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.9M Logic Elements - -40°C ~ 100°C (TJ) - - 2340-BGA (45x42)
AGID019R18A2E3V

AGID019R18A2E3V

IC FPGA AGILEX-I 1805FBGA

Intel

0 -
AGID019R18A2E3V

数据表

Agilex I - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.9M Logic Elements - 0°C ~ 100°C (TJ) - - -
AGFA023R24C2I3V

AGFA023R24C2I3V

IC FPGA AGILEX-F 2340BGA

Intel

0 -
AGFA023R24C2I3V

数据表

Agilex F 2340-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.3M Logic Elements - -40°C ~ 100°C (TJ) - - 2340-BGA (45x42)
AGFB023R24C2I3V

AGFB023R24C2I3V

IC FPGA AGILEX-F 2340BGA

Intel

0 -
AGFB023R24C2I3V

数据表

Agilex F 2340-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.3M Logic Elements - -40°C ~ 100°C (TJ) - - 2340-BGA (45x42)
AGFC019R24C3E4X

AGFC019R24C3E4X

IC FPGA AGILEX-F 2340BGA

Intel

0 -
AGFC019R24C3E4X

数据表

Agilex F 2340-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.9M Logic Elements - 0°C ~ 100°C (TJ) - - 2340-BGA (45x42)
AGFD019R24C3E4X

AGFD019R24C3E4X

IC FPGA AGILEX-F 2340BGA

Intel

0 -
AGFD019R24C3E4X

数据表

Agilex F 2340-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.9M Logic Elements - 0°C ~ 100°C (TJ) - - 2340-BGA (45x42)
AGFC019R25A1E1V

AGFC019R25A1E1V

IC FPGA AGILEX-F 2581FBGA

Intel

0 -
AGFC019R25A1E1V

数据表

Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.9M Logic Elements - 0°C ~ 100°C (TJ) - - -
1SX250LH2F55E2VG

1SX250LH2F55E2VG

IC SOC CORTEX-A53 1.5GHZ 2912BGA

Intel

0 -
1SX250LH2F55E2VG

数据表

Stratix® 10 SX 2912-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.5GHz FPGA - 2500K Logic Elements - 0°C ~ 100°C (TJ) - - 2912-FBGA, FC (55x55)
1SX250LH3F55I2VG

1SX250LH3F55I2VG

IC SOC CORTEX-A53 1.5GHZ 2912BGA

Intel

0 -
1SX250LH3F55I2VG

数据表

Stratix® 10 SX 2912-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.5GHz FPGA - 2500K Logic Elements - -40°C ~ 100°C (TJ) - - 2912-FBGA, FC (55x55)
AGFD019R25A1E1V

AGFD019R25A1E1V

IC FPGA AGILEX-F 2581FBGA

Intel

0 -
AGFD019R25A1E1V

数据表

Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.9M Logic Elements - 0°C ~ 100°C (TJ) - - -
XCZU43DR-2FFVE1156E

XCZU43DR-2FFVE1156E

IC ZUP RFSOC A53 FPGA 1156BGA

AMD

0 -
XCZU43DR-2FFVE1156E

数据表

Zynq® UltraScale+™ RFSoC 1156-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ 256KB DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 533MHz, 1.333GHz Zynq®UltraScale+™ FPGA, 930K+ Logic Cells - 0°C ~ 100°C (TJ) - - 1156-FCBGA (35x35)
XCZU47DR-2FFVE1156E

XCZU47DR-2FFVE1156E

IC ZUP RFSOC A53 FPGA 1156BGA

AMD

0 -
XCZU47DR-2FFVE1156E

数据表

Zynq® UltraScale+™ RFSoC 1156-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 533MHz, 1.333GHz Zynq®UltraScale+™ FPGA, 930K+ Logic Cells - 0°C ~ 100°C (TJ) - - 1156-FCBGA (35x35)
XCZU43DR-L1FFVE1156I

XCZU43DR-L1FFVE1156I

IC ZUP RFSOC A53 FPGA LP 1156BGA

AMD

0 -
XCZU43DR-L1FFVE1156I

数据表

Zynq® UltraScale+™ RFSoC 1156-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ 256KB DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 500MHz, 1.2GHz Zynq®UltraScale+™ FPGA, 930K+ Logic Cells - -40°C ~ 100°C (TJ) - - 1156-FCBGA (35x35)
XCZU43DR-2FSVE1156E

XCZU43DR-2FSVE1156E

IC ZUP RFSOC A53 FPGA 1156BGA

AMD

0 -
XCZU43DR-2FSVE1156E

数据表

Zynq® UltraScale+™ RFSoC 1156-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ 256KB DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 533MHz, 1.333GHz Zynq®UltraScale+™ FPGA, 930K+ Logic Cells - 0°C ~ 100°C (TJ) - - 1156-FCBGA (35x35)
XCZU43DR-L1FSVE1156I

XCZU43DR-L1FSVE1156I

IC ZUP RFSOC A53 FPGA LP 1156BGA

AMD

0 -
XCZU43DR-L1FSVE1156I

数据表

Zynq® UltraScale+™ RFSoC 1156-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ 256KB DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 500MHz, 1.2GHz Zynq®UltraScale+™ FPGA, 930K+ Logic Cells - -40°C ~ 100°C (TJ) - - 1156-FCBGA (35x35)
XCZU47DR-L1FSVE1156I

XCZU47DR-L1FSVE1156I

IC ZUP RFSOC A53 FPGA LP 1156BGA

AMD

0 -
XCZU47DR-L1FSVE1156I

数据表

Zynq® UltraScale+™ RFSoC 1156-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 500MHz, 1.2GHz Zynq®UltraScale+™ FPGA, 930K+ Logic Cells - -40°C ~ 100°C (TJ) - - 1156-FCBGA (35x35)
XCZU47DR-L1FFVE1156I

XCZU47DR-L1FFVE1156I

IC ZUP RFSOC A53 FPGA LP 1156BGA

AMD

0 -
XCZU47DR-L1FFVE1156I

数据表

Zynq® UltraScale+™ RFSoC 1156-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 500MHz, 1.2GHz Zynq®UltraScale+™ FPGA, 930K+ Logic Cells - -40°C ~ 100°C (TJ) - - 1156-FCBGA (35x35)
XCZU47DR-2FSVE1156E

XCZU47DR-2FSVE1156E

IC ZUP RFSOC A53 FPGA 1156BGA

AMD

0 -
XCZU47DR-2FSVE1156E

数据表

Zynq® UltraScale+™ RFSoC 1156-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 533MHz, 1.333GHz Zynq®UltraScale+™ FPGA, 930K+ Logic Cells - 0°C ~ 100°C (TJ) - - 1156-FCBGA (35x35)
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